Abstract: Apparatus and methods for electronic amplification are provided. In one embodiment, a method of electronic amplification includes amplifying a differential input voltage signal to generate a feed-forward signal, chopping the feed-forward signal at a chopping frequency to generate a chopped feed-forward signal, notch filtering the chopped feed-forward signal at the chopping frequency to generate a notched signal, generating an input offset correction signal based at least partly on the notched signal, and amplifying the differential input voltage signal using a signal amplification block to generate an output signal. Amplifying the differential input voltage signal using the signal amplification block includes chopping the input signal at the chopping frequency to generate a chopped input signal and combining the chopped input signal and the offset correction signal to reduce input offset error of the signal amplification block.

Abstract: A bi-directional protection device includes a bi-directional NPN bipolar transistor including an emitter/collector formed from a first n-well region, a base formed from a p-well region, and a collector/emitter formed from a second n-well region. P-type active regions are formed in the first and second n-well regions to form a PNPNP structure, which is isolated from the substrate using dual-tub isolation consisting of an n-type tub and a p-type tub. The dual-tub isolation prevents induced latch-up during integrated circuit powered stress conditions by preventing the wells associated with the PNPNP structure from injecting carriers into the substrate. The size, spacing, and doping concentrations of active regions and wells associated with the PNPNP structure are selected to provide fine-tuned control of the trigger and holding voltage characteristics to enable the bi-directional protection device to be implemented in high voltage applications using low voltage precision interface signaling.

Abstract: Apparatuses are disclosed, such as those involving integrated circuit packaging. In one embodiment, a chip package includes: an encapsulation having a top surface and a bottom surface facing away from the top surface. The package further includes a leadframe including a plurality of leads. Each of the leads includes an exposed portion exposed through one of edges of the bottom surface of the encapsulation. The exposed portion has a length. At least one of exposed portions positioned along one of the edges of the bottom surface of the encapsulation has a length different from other exposed portions along the edge. The package can also include a dummy pad exposed through a corner of the bottom surface. The configuration can enhance solder joint reliability of the package when the package is attached to a printed circuit board.

Abstract: A detector circuit can include an integrator having an amplifier, a first feedback capacitor connected between an input and output of the amplifier, one or more additional feedback capacitors connected by at least one switch between the input and output of the amplifier, and a shunt capacitor connected to the output of the amplifier. The shunt capacitor can be selected to have a capacitance value greater than that of a minimum but less than that of a maximum feedback capacitance. The detector circuit can further include a sampling circuit having a sampling capacitor connected to the output of the integrator amplifier through at least one switch, wherein the sampling capacitor is separate from the shunt capacitor. A computed tomography imaging apparatus can include the detector circuit.

Abstract: A high voltage isolation protection device for low voltage communication interface systems in mixed-signal high voltage electronic circuit is disclosed. According to one aspect, the protection device includes a semiconductor structure configured to provide isolation between low voltage terminals and protection from transient events. The protection device includes a thyristor having an anode, a cathode, and a gate, and a thyristor cathode-gate control region that is built into the protection device. The protection device is configured to provide multiple built-in path-up to power-high terminals and path-down to power-low terminals at different voltage levels. The protection device also includes independently built-in discharge paths to the common substrate that is connected to a different power-low voltage reference. The conduction paths may be built into a single structure with dual isolation regions.

Abstract: The sampling rate of a digital signal is reduced by storing a series of partial sums of the digital signal instead of the signal itself, thus reducing the memory size required to perform the sampling-rate reduction.

Abstract: Apparatus and methods for electronic circuit protection under high stress operating conditions are provided. In one embodiment, an apparatus includes a substrate having a first p-well, a second p-well adjacent the first p-well, and an n-type region separating the first and second p-wells. An n-type active area is over the first p-well and a p-type active area is over the second p-well. The n-type and p-type active areas are electrically connected to a cathode and anode of a high reverse blocking voltage (HRBV) device, respectively. The n-type active area, the first p-well and the n-type region operate as an NPN bipolar transistor and the second p-well, the n-type region, and the first p-well operate as a PNP bipolar transistor. The NPN bipolar transistor defines a relatively low forward trigger voltage of the HRBV device and the PNP bipolar transistor defines a relatively high reverse breakdown voltage of the HRBV device.

Abstract: A method and a corresponding device for performing a background calibration of a comparator in a circuit having a plurality of stages that are connected in a pipelined fashion to an input signal. A digital value of a residue signal, which is output from a first stage in the plurality of stages to a subsequent stage in the plurality of stages, is calculated. The value of the residue signal is compared to at least one threshold. Based on the comparison, a triggering threshold of a selected comparator in the first stage may be adjusted.

Abstract: A method and a circuit for increasing a resolution of a digitally controlled oscillator include controlling the oscillator so that an output signal of the oscillator varies between semi-periods having a first frequency and semi-periods having a second frequency. The method and circuit further include applying the output signal of the oscillator as an input to a divider to obtain a divided signal. A frequency of at least one semi-period of the divided signal is a function of both an oscillator semi-period having the first frequency and an oscillator semi-period having the second frequency.

Abstract: A method and a corresponding device for calibrating an interleaved analog-to-digital converter (ADC) involve injecting a randomly determined amount of dither into at least one of a flash component and a multiplying digital-to-analog converter (MDAC) in a selected channel in the ADC. A correlation procedure is performed to estimate, based on an overall ADC output, a gain experienced by the injected dither after propagating through the channel. The injection and the correlation procedure are repeated on at least one additional channel to estimate a gain for each at least one additional channel. The estimated gains of the selected channel and the at least one additional channel are then compared to determine a degree of mismatch between the selected channel and each at least one additional channel. At least one channel is calibrated as a function of the determined degree of mismatch.

Abstract: A bootstrapped switch circuit includes a first switch transistor to receive an input signal and a second switch transistor to provide an output signal. The sources of the switch transistors may be coupled. A voltage source may be coupled to the sources of the switch transistors and at least one of the gates of the switch transistors. The voltage source may generate a control voltage to activate at least one of the switch transistors based on a bias current. A voltage source driver may be coupled to the voltage source to generate the bias current based on a bias voltage. The bias voltage may include a first voltage approximately corresponding to an overdrive voltage of at least one of the switch transistors and a second voltage approximately corresponding to a threshold voltage of the switch transistors.

Abstract: A method and a device for detecting user input includes receiving a user input at an input arrangement of a user interface. The input arrangement has at least one piezoelectric sensor that generates an electric signal in response to the input. The electric signal is processed to determine the presence of the input. The processing may indicate the magnitude of the force of the input, in addition to the input's location. An output arrangement of the user interface generates an output in response to the processing. The output may be a haptic, audio or visual output.

Abstract: A capped micromachined accelerometer with a Q-factor of less than 2.0 is fabricated without encapsulating a high-viscosity gas with the movable mass of the micromachined accelerometer by providing small gaps between the movable mass and the substrate, and between the movable mass and the cap. The cap may be an silicon cap, and may be an ASIC smart cap.

Abstract: Cross-talk sensitivity in an xy-axis shell-type gyroscope can be rejected or reduced by operating the gyroscope with a single in-plane flexural or bulk resonance mode and sensing two out-of-plane degenerate or non-degenerate resonance modes resulting from rotations about two axes in the plane of the resonator. Mode matching in an xy-axis shell-type gyroscope can be achieved by configuring the resonator (e.g., size, shape, thickness) to match the in-plane and out-of-plane resonance frequencies for the drive and sense modes of interest.

Abstract: A method for identifying objects in a digital image includes tracing chain codes associated with the contour of the object; a series of states is maintained, and the next chain codes in the contour are accepted only if they comply with allowed chain codes for each state. Certain chain codes trigger a transition into a next state. If a disallowed chain code is encountered, the process halts.

Abstract: A bi-directional protection device includes a bi-directional NPN bipolar transistor including an emitter/collector formed from a first n-well region, a base formed from a p-well region, and a collector/emitter formed from a second n-well region. P-type active regions are formed in the first and second n-well regions to form a PNPNP structure, which is isolated from the substrate using dual-tub isolation consisting of an n-type tub and a p-type tub. The dual-tub isolation prevents induced latch-up during integrated circuit powered stress conditions by preventing the wells associated with the PNPNP structure from injecting carriers into the substrate. The size, spacing, and doping concentrations of active regions and wells associated with the PNPNP structure are selected to provide fine-tuned control of the trigger and holding voltage characteristics to enable the bi-directional protection device to be implemented in high voltage applications using low voltage precision interface signaling.

Abstract: Embodiments of the present invention may provide a battery monitor for a battery system that avoids current loops. A battery monitor may be provisioned as an integrated circuit and may include a pair of supply pins for reception of power to the integrated circuit, a third high impedance pin, and a voltage regulation circuit. When the circuits are deployed, the supply pins of several battery monitors may be connected to each other to form a stack. The high impedance inputs of each battery monitor may be coupled to low voltage terminals of an associated battery cell. A voltage reference circuit within the battery monitor may maintain the voltage at a low voltage supply of the monitors at a level that matches the voltage present on the high impedance input. Thus, the voltages on the monitors' low voltage supplies may be regulated. As a result, no current should flow through the high impedance pins of the battery monitor.

Abstract: Electrical networks are formed to produce an approximation of at least one desired performance characteristic, based on the recognition that fabrication variations introduce slight differences in electronic sub-networks which were intended to be identical. These fabrication differences are turned to an advantage by providing a pool of sub-networks, and then selectively connecting particular combinations of these sub-networks to implement networks that approximate the desired performance characteristics. The sub-networks are of like kind (e.g., resistors) and have a like measure.

Abstract: Detecting and/or mitigating the presence of particle contaminants in a MEMS device involves converting benign areas in which particles might become trapped undetectably by electric fields during test to field-free regions by extending otherwise non-functional conductive shield and gate layers and placing the same electrical potential on the conductive shield and gate layers. Particle contaminants can then be moved into detection locations remote from the potential trap areas and having particle detection structures by providing some mechanical disturbance.

Abstract: A bias-shaping circuit for adjusting power consumption in a frequency divider to a temperature-dependent minimum includes a temperature-dependent bias source for producing a temperature-dependent bias. The bias is combined with an input signal to create an output bias. The output bias changes in response to a change in temperature to compensate for at least a portion of a temperature-induced change in the frequency divider, thereby adjusting power consumption in the frequency divider to a temperature-dependent minimum.