Abstract: In one aspect, an apparatus for data conversion is provided.

Abstract: A transceiver for use in a bidirectional optical communication link over a multimode channel is provided. The transceiver includes a single transverse mode light source in a transmitter. A waveguide or fiber based bidirectional coupler projects the transmitter mode to the high modes of the multimode channel. A detector coupled to predominantly all the modes of the channel via the waveguide or fiber based bidirectional coupler.

Abstract: A Galois field linear transformer trellis system includes a Galois field linear transformer matrix; an input selection circuit for providing to the matrix a number of input bits in one or more trellis bit streams and a trellis state output of the matrix and a programmable storage device for configuring the matrix to perform a multi-cycle Galois field transform of the one or more trellis bit steams and trellis state output to provide a plurality of trellis output channel symbols and a new trellis state output in a single cycle.

Abstract: In accordance with one embodiment of the invention, a packaged microchip has 1) a base with a mounting surface having a given electrical interconnector, and 2) a microchip with a plurality of side surfaces, a top surface, a bottom surface, and a given electrical pad on at least one of the top and bottom surfaces. The packaged microchip also has 3) a given solder ball secured to one of the top and bottom surfaces of the microchip. The given solder ball also is connected to the given electrical interconnector to electrically connect the given electrical pad and the given electrical interconnector. At least one side surface of the microchip is generally parallel with the mounting surface of the base.

Abstract: A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

Abstract: A system and method for calibrating an RDAC to obtain an expected resistance are disclosed. In one embodiment, a method of obtaining an expected resistance from an RDAC circuit includes receiving a digital signal comprising a digital code by an on-chip calibration code engine, automatically deriving a calibrated digital code based on resistance versus digital code characteristic curves of an expected RDAC and the RDAC associated with the calibration code engine, and inputting the calibrated digital code into the RDAC associated with the calibration code engine to obtain an expected resistance. The method also includes forming the resistance versus digital code characteristic curves of the expected RDAC and the RDAC, computing a gain error and an offset error using the formed resistance versus digital code characteristic curves of the RDAC and the expected RDAC and storing the gain error and the offset error in a non-volatile/volatile RDAC memory.

Abstract: A redundant cross point switching is achieved by mapping a redundant column/row of point cells and enabling at least one of the switching devices which is associated with each column/row to define an alternate path around the defective point cell which replicates the function of the switching location of the defective point cell.

Abstract: A system and method transmits graphic data received at varying frequencies at a fixed data rate. The frequency dependent data and associated data clock signal are received and the frequency dependent data is converted to frequency independent data. A ratio of a number of data clock cycles to a number of reference clock cycles is determined and transmitted. The frequency independent data and header data are transmitted, at a fixed rate, to a receiver, the fixed rate being a frequency greater than the frequency of the associated data clock signal. The received the frequency independent data is converted to frequency dependent data based upon the received determined ratio. The communication channel may include an optical fiber and a tension member wherein control data is transmitted along the tension member and graphic data is transmitted along the optical fiber.

Abstract: A testing system contactor with an integral temperature measurement sensor.

Abstract: A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals.

Abstract: A cross-coupled switched capacitor circuit that has two branches. During a first phase for the first branch, an input voltage is provided that causes charge to move through a resistor and to be placed onto a plate of the capacitor within the branch. An equivalent amount of charge is transferred to an output node. The output node may be a summing node of a sigma-delta modulator. The summing node is one of the inputs to an operational amplifier that is part of the integrator of the sigma-delta modulator. The resistor and the capacitor in the first branch define an RC circuit and corresponding RC time constant. During the first phase, the capacitor does not reach a fully settled voltage for a desired resolution. During the second phase, the capacitor in the first branch of the circuit is set to a defined voltage. The defined voltage may be the settling voltage had the capacitor been allowed to settle during the first phase.

Abstract: A MEMS switch with a platinum-series contact is capped through a process that also passivates the contact by controlling, over time, the amount of oxygen in the environment, pressures and temperatures. Some embodiments passivate a contact in an oxygenated atmosphere at a first temperature and pressure, before hermetically sealing the cap at a higher temperature and pressure. Some embodiments hermetically seal the cap at a temperature below which passivating dioxides will form, thus trapping oxygen within the volume defined by the cap, and later passivate the contact with the trapped oxygen at a higher temperature.

Abstract: A system and method for performing dynamic in-line testing of semiconductor devices sequentially tests a plurality of semiconductor devices. Test data associated with a predetermined number of semiconductor devices of the sequentially tested semiconductor devices is stored in a data structure. After test data corresponding to a predetermined number of semiconductor devices is stored in the data structure, the following steps are iteratively performed. Statistics concerning the selected devices are calculated using the associated test data. A device that fails to meet a precision setting based on the statistics is marked as an outlier device. Test data stored in the data structure corresponding to an earliest tested semiconductor device in sequence is evicted from the data structure. Test data associated with the next passing tested semiconductor device in sequence is stored in the data structure.

Abstract: A method and apparatus are provided for imaging three-dimensional scenes and objects by detecting reflections from emitted sequences of electromagnetic radiation. At least one transmitter is provided for emitting a sequence of electromagnetic radiation, and at least three sensors are provided for detecting radiation reflected from the scene and objects being imaged. Signals based on the detected radiation are used, together with spatial information of the transmitters and sensors, to calculate reflectivity coefficients for points of interest in the scene. Velocity vectors associated with moving objects within the scene can also be determined based on the rate of change of the phase differences between the emitted and reflected radiations.

Abstract: An output distortion circuit includes a first transistor arrangement receiving a nonlinear current associated with a nonlinear differential error signal. The first transistor arrangement produces a reflected base current that is applied to one side of a differential input pair. A second transistor arrangement eliminates the nonlinear differential error signal by producing a replicated base current that replicates the reflected base current. The replicated base current is applied to an opposite side of the differential input pair thus the output distortion cancellation circuit creating a deflection of approximately equal magnitude to the reflected base current so as to eliminate the nonlinear differential error signal.

Abstract: Disclosed is a differential amplifier system that maintains high speed characteristics of the differential amplifier while providing stability from a common-mode loop by using dominant pole compensation. The disclosed system includes a first and second transconductance stage, a circuit having high impedance, and a compensation circuit.

Abstract: A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure positioned radially outward from the MEMS structure. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

Abstract: Transducers comprising a frame structure made of piezoelectric material convert energy, through piezoelectric effect, between electrostatic energy associated with voltage differential between the electrodes sandwiching the frame structure and mechanical energy associated with deformation of the frame structure. Inertial sensors such as gyroscopes and accelerators, including inertial sensors comprising ring resonators, utilize said transducers both to generate oscillations of their resonators and to sense the changes in such oscillations produced, in the sensors' frame of reference, by Coriolis forces appearing due to the movement of the sensors.

Abstract: A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.

Abstract: A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.