Patents Assigned to Applied Material
  • Patent number: 10745805
    Abstract: Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a porous chamber component and onto pore walls within the porous chamber component using an atomic layer deposition (ALD) process. The porous chamber component may include a porous body comprising a plurality of pores within the porous body, the plurality of pores each comprising pore walls. The porous body is permeable to a gas. The plasma resistant coating may comprise a solid solution of Y2O3—ZrO2 and may have a thickness of about 5 nm to about 3 ?m, and may protect the pore walls from erosion. The porous body with the plasma resistant coating remains permeable to the gas.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Vahid Firouzdor, Sumanth Banda, Rajinder Dhindsa, Daniel Byun, Dana Marie Lovell
  • Patent number: 10748783
    Abstract: The present disclosure relates to high pressure processing apparatus for semiconductor processing. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: August 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Adib M. Khan, Qiwei Liang, Sultan Malik, Srinivas D. Nemani
  • Publication number: 20200255943
    Abstract: Apparatus and methods for processing a substrate including an injector unit insert with a plurality of flow paths leading to a first plenum, each of the flow paths providing one or more of substantially the same residence time, length and/or conductance. Injector units including the injector unit inserts have increased flow uniformity.
    Type: Application
    Filed: April 28, 2020
    Publication date: August 13, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Aaron Miller, Kallol Bera
  • Publication number: 20200255938
    Abstract: Physical vapor deposition methods for reducing the particulates deposited on the substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of the particulates formed in the plasma. The agglomerated particulates can be moved to an outer portion of the process chamber prior to extinguishing the plasma so that the agglomerates fall harmlessly outside of the diameter of the substrate.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 13, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Halbert Chong, Lei Zhou, Adolph Miller Allen, Vaibhav Soni, Kishor Kalathiparambil, Vanessa Faune, Song-Moon Suh
  • Publication number: 20200256228
    Abstract: Exhaust systems for handling multiple effluent streams are described. Some embodiments include pressure drops to prevent perturbations from one effluent source from affecting a second effluent source. Some embodiments incorporate an exhaust assembly with multiple inlets and pumps and a single outlet. The exhaust assembly includes shared auxiliary components like purge and cooling systems.
    Type: Application
    Filed: February 13, 2020
    Publication date: August 13, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Michael Rice, Sanjeev Baluja, Joseph AuBuchon, Hari Ponnekanti, Mario D. Silvetti, Kevin Griffin
  • Patent number: 10741435
    Abstract: Methods comprising forming a film on at least one feature of a substrate surface are described. The film is expanded to fill the at least one feature and cause growth of the film from the at least one feature. Methods of forming self-aligned vias are also described.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: August 11, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Susmit Singha Roy, Yihong Chen, Kelvin Chan, Abhijit Basu Mallick, Srinivas Gandikota, Pramit Manna
  • Patent number: 10741459
    Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: August 11, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu, Ingemar Carlsson, Boguslaw A. Swedek, Wen-Chiang Tu
  • Patent number: 10738008
    Abstract: Methods for deposition of elemental metal films on surfaces using metal coordination complexes comprising nitrogen-containing ligands are provided. Also provided are nitrogen-containing ligands useful in the methods of the invention and metal coordination complexes comprising these ligands.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: August 11, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey W. Anthis, David Thompson
  • Publication number: 20200251151
    Abstract: Memory devices are described. The memory devices include a plurality of bit lines extending through a stack of alternating memory layers and dielectric layers. Each of the memory layers comprises a single crystalline-like silicon layer and includes a first word line, a second word line, a first capacitor, and a second capacitor. Methods of forming stacked memory devices are also described.
    Type: Application
    Filed: February 3, 2020
    Publication date: August 6, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Chang Seok Kang, Tomohiko Kitajima, Gill Yong Lee, Sanjay Natarajan, Sung-Kwan Kang, Lequn Liu
  • Patent number: 10730240
    Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense a plurality of layers of feed material on a top surface of the platform, and an energy delivery system. The energy deliver system includes a light source to emit a light beam, and a reflective member having a plurality of reflective facets. The reflective member is positioned in a path of the light beam to receive the light beam and redirect the light beam toward the top surface of the platform to deliver energy to an uppermost layer of the layers of feed material to fuse the feed material. The reflective member is rotatable such that sequential facets sweep the light beam sequentially along a path on the uppermost layer.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: August 4, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Hou T. Ng, Nag B. Patibandla, Ajey M. Joshi, Raanan Zehavi, Jeffrey L. Franklin, Kashif Maqsood
  • Patent number: 10730798
    Abstract: Disclosed herein are methods for producing an ultra-dense and ultra-smooth ceramic coating. A method includes feeding a slurry of ceramic particles into a plasma sprayer. The plasma sprayer generates a stream of particles directed toward the substrate, forming a ceramic coating on the substrate upon contact.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: August 4, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Sun, Biraja Prasad Kanungo, Yikai Chen, Vahid Firouzdor
  • Patent number: 10731979
    Abstract: A method for monitoring a first nanometric structure formed by a multiple patterning process, the method may include performing a first plurality of measurements to provide a first plurality of measurement results; wherein the performing of the first plurality of measurements comprises illuminating first plurality of locations of a first sidewall of the first nanometric structure by oblique charged particle beams of different tilt angles; and processing, by a hardware processor, the first plurality of measurement results to determine a first attribute of the first nanometric structure.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: August 4, 2020
    Assignee: Applied Materials Israel Ltd.
    Inventors: Shimon Levi, Ishai Schwarzband, Roman Kris
  • Patent number: 10734202
    Abstract: An article includes a body that is coated with a ceramic coating. The ceramic coating may include Y2O3 in a range between about 45 mol % to about 99 mol %, ZrO2 in a range between about 1 mol % to about 55 mol %, and Al2O3 in a range between about 1 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 45 mol % to about 99 mol % and Al2O3 in a range between about 1 mol % to about 10 mol %. The ceramic coating may alternatively include Y2O3 in a range between about 45 mol % to about 99 mol % and ZrO2 in a range between about 1 mol % to about 55 mol %.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: August 4, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Sun, Biraja P. Kanungo, Tom Cho
  • Patent number: 10732607
    Abstract: A method of processing a substrate includes subjecting a substrate to processing that modifies a thickness of an outer layer of the substrate, measuring a spectrum of light reflected from the substrate during processing, reducing the dimensionality of the measured spectrum to generate a plurality of component values, generating a characterizing value using an artificial neural network, and determining at least one of whether to halt processing of the substrate or an adjustment for a processing parameter based on the characterizing value. The artificial neural network has a plurality of input nodes to receive the plurality of component values, an output node to output the characterizing value, and a plurality of hidden nodes connecting the input nodes to the output node.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: August 4, 2020
    Assignee: Applied Materials, Inc.
    Inventor: Benjamin Cherian
  • Patent number: 10734232
    Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for depositing metal silicide layers on substrates and chamber components. In one embodiment, a method of forming a hardmask includes positioning the substrate having a target layer within a processing chamber, forming a seed layer comprising metal silicide on the target layer and depositing a tungsten-based bulk layer on the seed layer, wherein the metal silicide layer and the tungsten-based bulk layer form the hardmask. In another embodiment, a method of conditioning the components of a plasma processing chamber includes flowing an inert gas comprising argon or helium from a gas applicator into the plasma processing chamber, exposing a substrate support to a plasma within the plasma processing chamber and forming a seasoning layer including metal silicide on an aluminum-based surface of the substrate support.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: August 4, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Prashant Kumar Kulshreshtha, Jiarui Wang, Kwangduk Douglas Lee, Milind Gadre, Xiaoquan Min, Paul Connors
  • Patent number: 10736182
    Abstract: Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: August 4, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Matthew Busche, Wendell Boyd, Jr., Todd J. Egan, Gregory L. Kirk, Vijay D. Parkhe, Michael R. Rice, Leon Volfovski
  • Publication number: 20200243432
    Abstract: A method for producing an electrical component is disclosed using a molybdenum adhesion layer, connecting a polyimide substrate to a copper seed layer and copper plated attachment.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 30, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Han-Wen CHEN, Steven VERHAVERBEKE, Kyuil CHO, Prayudi LIANTO, Guan Huei SEE, Vincent DICAPRIO
  • Publication number: 20200241409
    Abstract: Physical vapor deposition target assemblies, PVD chambers including target assemblies and methods of manufacturing EUV mask blanks using such target assemblies are disclosed. The target assembly includes a target shield adjacent the target and surrounding the peripheral edges of the target, the target shield comprising an insulating material and a non-insulating outer peripheral fixture to secure the target shield to the assembly.
    Type: Application
    Filed: January 23, 2020
    Publication date: July 30, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Wen Xiao, Sanjay Bhat, Shuwei Liu, Vibhu Jindal
  • Publication number: 20200243341
    Abstract: In-situ methods for depositing a metal film without the use of a barrier layer are disclosed. Some embodiments comprise forming an amorphous nucleation layer comprising one or more of silicon or boron and forming a metal layer on the nucleation layer. These processes are performed without an air break between processes.
    Type: Application
    Filed: March 30, 2020
    Publication date: July 30, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Yong Wu, Wei V. Tang, Jianqiu Guo, Wenyi Liu, Yixiong Yang, Jacqueline S. Wrench, Mandyam Sriram, Srinivas Gandikota, Yumin He
  • Patent number: 10727080
    Abstract: Methods are described herein for etching tantalum-containing films with various potential additives while still retaining other desirable patterned substrate portions. The methods include exposing a tantalum-containing film to a chlorine-containing precursor (e.g. Cl2) with a concurrent plasma. The plasma-excited chlorine-containing precursor selectively etches the tantalum-containing film and other industrially-desirable additives. Chlorine is then removed from the substrate processing region. A hydrogen-containing precursor (e.g. H2) is delivered to the substrate processing region (also with plasma excitation) to produce a relatively even and residue-free tantalum-containing surface. The methods presented remove tantalum while retaining materials elsewhere on the patterned substrate.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: July 28, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Xikun Wang, Naomi Yoshida, Soumendra N. Barman, Nitin K. Ingle