Patents Assigned to Applied Materials
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Patent number: 11515130Abstract: Implementations of the present disclosure generally relate to an improved substrate support pedestal assembly. In one implementation, the substrate support pedestal assembly includes a shaft. The substrate support pedestal assembly further includes a substrate support pedestal, mechanically coupled to the shaft. The substrate support pedestal comprises substrate support plate coated on a top surface with a ceramic material.Type: GrantFiled: March 23, 2018Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Lara Hawrylchak, Chaitanya A. Prasad
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Patent number: 11515163Abstract: Exemplary methods of semiconductor processing may include delivering a carbon-containing precursor and a hydrogen-containing precursor to a processing region of a semiconductor processing chamber. The methods may include generating a plasma of the carbon-containing precursor and the hydrogen-containing precursor within the processing region of the semiconductor processing chamber. The methods may include forming a layer of graphene on a substrate positioned within the processing region of the semiconductor processing chamber. The substrate may be maintained at a temperature below or about 600° C. The methods may include halting flow of the carbon-containing precursor while maintaining the plasma with the hydrogen-containing precursor.Type: GrantFiled: January 6, 2021Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Jialiang Wang, Susmit Singha Roy, Abhijit Basu Mallick, Nitin K. Ingle
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Patent number: 11515154Abstract: Selective deposition methods are described. An exemplary method comprises exposing the substrate comprising a first surface and a second surface to an anchor reactant and selectively depositing the anchor reactant on the first surface as a seed layer, wherein the anchor reactant comprises an ethynyl derivative with a headgroup that selectively targets the first surface.Type: GrantFiled: October 27, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Andrea Leoncini, Yong Wang, Doreen Wei Ying Yong
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Patent number: 11511388Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.Type: GrantFiled: December 6, 2019Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
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Patent number: 11515179Abstract: Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include a mixing manifold coupled between the remote plasma unit and the processing chamber. The mixing manifold may be characterized by a first end and a second end opposite the first end, and may be coupled with the processing chamber at the second end. The mixing manifold may define a central channel through the mixing manifold, and may define a port along an exterior of the mixing manifold. The port may be fluidly coupled with a first trench defined within the first end of the mixing manifold. The first trench may be characterized by an inner radius at a first inner sidewall and an outer radius, and the first trench may provide fluid access to the central channel through the first inner sidewall.Type: GrantFiled: June 29, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Mehmet Tugrul Samir, Dongqing Yang
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Patent number: 11515150Abstract: Exemplary processing methods may include forming a plasma of a deposition precursor in a processing region of a semiconductor processing chamber. The methods may include adjusting a variable capacitor within 20% of a resonance peak. The variable capacitor may be coupled with an electrode incorporated within a substrate support on which a substrate is seated. The methods may include depositing a material on the substrate.Type: GrantFiled: October 22, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Michael Wenyoung Tsiang, Abdul Aziz Khaja, Li-Qun Xia, Kevin Hsiao, Liangfa Hu, Yayun Cheng
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Patent number: 11515191Abstract: Embodiments disclosed herein may include a heater pedestal. In an embodiment, the heater pedestal may comprise a heater pedestal body and a conductive mesh embedded in the heater pedestal. In an embodiment, the conductive mesh is electrically coupled to a voltage source In an embodiment, the heater pedestal may further comprise a support surface on the heater pedestal body. In an embodiment, the support surface comprises a plurality of pillars extending out from the heater pedestal body and arranged in concentric rings. In an embodiment pillars in an outermost concentric ring have a height that is greater than a height of pillars in an innermost concentric ring.Type: GrantFiled: October 10, 2019Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Vivek B. Shah, Bhaskar Kumar, Ganesh Balasubramanian
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Patent number: 11511950Abstract: A substrate flipping device includes a substrate securing assembly, a gripping actuator, and a rotary actuator. The gripping actuator is configured to pneumatically cause the substrate securing assembly to be in an open position to receive a substrate and configured to pneumatically cause the substrate securing assembly to be in a closed position to secure the substrate. The rotary actuator is configured to pneumatically cause the substrate securing assembly to rotate to a flipped position and to pneumatically rotate to a non-flipped position.Type: GrantFiled: July 29, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Michael Minh Phan, Steven Trey Tindel, Paul Benjamin Reuter
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Patent number: 11515132Abstract: Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.Type: GrantFiled: May 11, 2021Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Sanjay Bhat, Vibhu Jindal, Vishwas Kumar Pandey
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Patent number: 11512391Abstract: A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a liner assembly disposed within an interior volume of the processing chamber, and a C-channel disposed in an interior volume of the chamber, circumscribing the liner assembly. In another embodiment, a process kit disposed in the interior volume of the processing chamber is disclosed herein. The process kit includes a liner assembly, a C-channel, and an isolator disposed in the interior volume. The C-channel and the isolator circumscribe the liner assembly. A method for depositing a silicon based material on a substrate by flowing a precursor gas into a processing chamber is also described herein.Type: GrantFiled: June 25, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Kalyanjit Ghosh, Mayur G. Kulkarni, Sanjeev Baluja, Kien N. Chuc, Sungjin Kim, Yanjie Wang
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Patent number: 11515176Abstract: Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.Type: GrantFiled: April 14, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Siva Chandrasekar, Satish Radhakrishnan, Rajath Kumar Lakkenahalli Hiriyannaiah, Viren Kalsekar, Vinay Prabhakar
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Patent number: 11513504Abstract: A method includes receiving, from one or more sensors associated with manufacturing equipment, current trace data associated with producing, by the manufacturing equipment, a plurality of products. The method further includes performing signal processing to break down the current trace data into a plurality of sets of current component data mapped to corresponding component identifiers. The method further includes providing the plurality of sets of current component data and the corresponding component identifiers as input to a trained machine learning model. The method further includes obtaining, from the trained machine learning model, one or more outputs indicative of predictive data and causing, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment.Type: GrantFiled: October 18, 2019Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventor: David John Paul
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Patent number: 11511390Abstract: A carrier head includes a base assembly, a substrate mounting surface connected to the base assembly, and a plurality of segments disposed circumferentially around the substrate mounting surface to provide a retaining ring to surround a substrate mounted on the substrate mounting surface. An inner surface of each of the plurality of segments is configured to engage the substrate, and each segment of the plurality of segments of the retaining ring is pivotally connected to the base assembly such that a lower portion of each segment of the retaining ring is swingable toward and away from the substrate.Type: GrantFiled: November 20, 2019Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Jay Gurusamy, Andrew J. Nagengast
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Patent number: 11513437Abstract: Extreme ultraviolet (EUV) mask blanks, methods for their manufacture and production systems therefor are disclosed. The EUV mask blanks comprise a substrate; a multilayer stack of reflective layers on the substrate; a capping layer on the multilayer stack of reflecting layers; and an absorber layer on the capping layer, the absorber layer comprising an alloy selected from an alloy of ruthenium (Ru) and silicon (Si); an alloy tantalum (Ta) and platinum (Pt); and an alloy of ruthenium (Ru) and molybdenum (Mo).Type: GrantFiled: January 11, 2021Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Shiyu Liu, Shuwei Liu, Vibhu Jindal
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Patent number: 11515129Abstract: An example semiconductor processing system may include a chamber body having sidewalls and a base. The processing system may also include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate, and a shaft coupled with the support platen. The processing system may further include a plate coupled with the shaft of the substrate support. The plate may have an emissivity greater than 0.5. In some embodiments, the plate may include a radiation shied disposed proximate the support platen. In some embodiments, the plate may include a pumping plate disposed proximate the base of the chamber body. In some embodiments, the emissivity of the plate may range between about 0.5 and about 0.95.Type: GrantFiled: December 3, 2019Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Elizabeth Neville, Satish Radhakrishnan, Kartik Shah, Vinay Prabhakar, Venkata Sharat Chandra Parimi, Sungwon Ha
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Patent number: 11515145Abstract: Methods for forming a SiBN film comprising depositing a film on a feature on a substrate. The method comprises in a first cycle, depositing a SiB layer on a substrate in a chamber using a chemical vapor deposition process, the substrate having at least one feature thereon, the at least one feature comprising an upper surface, a bottom surface and sidewalls, the SiB layer formed on the upper surface, the bottom surface and the sidewalls. In a second cycle, the SiB layer is treated with a plasma comprising a nitrogen-containing gas to form a conformal SiBN film.Type: GrantFiled: September 11, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Chuanxi Yang, Hang Yu, Deenesh Padhi
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Patent number: 11512385Abstract: Embodiments of the disclosure generally relate to methods of forming gratings. The method includes depositing a resist material on a grating material disposed over a substrate, patterning the resist material into a resist layer, projecting a first ion beam to the first device area to form a first plurality of gratings, and projecting a second ion beam to the second device area to form a second plurality of gratings. Using a patterned resist layer allows for projecting an ion beam over a large area, which is often easier than focusing the ion beam in a specific area.Type: GrantFiled: December 16, 2019Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Joseph C. Olson, Ludovic Godet, Rutger Meyer Timmerman Thijssen, Morgan Evans, Jinxin Fu
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Patent number: 11515195Abstract: Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a showerhead. The chambers may include a substrate support. The substrate support may include a platen characterized by a first surface facing the showerhead. The substrate support may include a shaft coupled with the platen along a second surface of the platen opposite the first surface of the platen. The shaft may extend at least partially through the chamber body. A coating may extend conformally about the first surface of the platen, the second surface of the platen, and about the shaft.Type: GrantFiled: October 26, 2020Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventor: Laksheswar Kalita
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Publication number: 20220372620Abstract: Exemplary methods of forming a coating of material on a substrate may include forming a plasma of a first precursor and an oxygen-containing precursor. The first precursor and the oxygen-containing precursor may be provided in a first flow rate ratio. The methods may include depositing a first layer of material on the substrate. While maintaining the plasma, the methods may include adjusting the first flow rate ratio to a second flow rate ratio. The methods may include depositing a second layer of material on the substrate.Type: ApplicationFiled: May 10, 2022Publication date: November 24, 2022Applicant: Applied Materials, Inc.Inventors: Lance A. Scudder, Sukti Chatterjee, David Masayuki Ishikawa, Yuriy V. Melnik, Vibhas Singh
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Publication number: 20220375750Abstract: Exemplary methods of semiconductor processing may include providing a silicon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region of the semiconductor processing chamber. The methods may include depositing a silicon-containing material on the substrate. Subsequent a first period of time, the methods may include providing a germanium-containing precursor to the processing region of the semiconductor processing chamber. The methods may include thermally reacting the silicon-containing precursor and the germanium-containing precursor at a temperature greater than or about 400° C. The methods may include forming a silicon-and-germanium-containing layer on the substrate.Type: ApplicationFiled: May 19, 2021Publication date: November 24, 2022Applicant: Applied Materials, Inc.Inventors: Huiyuan Wang, Susmit Singha Roy, Abhijit Basu Mallick
