Abstract: A chuck that includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal oath and the probe tip.

Abstract: Disclosed herein is an attenuation device comprising a flexible housing and a medium capable of transformation to inflate the housing from the first configuration to the second configuration. Also disclose herein are methods of treating a patient, comprising: providing a self-inflating expandable attenuation device, containing a medium which is transformable from a first, reduced volume to a second, expanded volume; positioning the attenuation device within the patient at a treatment site; and transforming the medium from the first volume to the second volume. In one embodiment, a self-inflating expandable attenuation device is used to treat glaucoma.

Abstract: An inflatable body including first and second fluid impervious major panels, each having an outer surface, an inner surface and a perimeter, and further including a fluid impervious intermediate panel having a first surface, a second surface and a perimeter. A first perimeter portion of the intermediate panel is joined to the inner surface of the first major panel from one perimeter portion thereof to a generally opposed perimeter portion thereof, and a second perimeter portion of the intermediate panel, which is generally opposed to the first perimeter portion, is joined to the inner surface of the second major panel from one perimeter portion thereof to a generally opposed perimeter portion thereof. The first and second major panel perimeters are joined to each other, defining a primary enclosure having first and second chambers separated by the intermediate panel, and at least one sealable orifice in fluid communication with the environment and at least one chamber.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

Abstract: A multi-use snow tool is described, which includes a snow fluke and a snow picket that may be combined to function as a snow shovel, or may be used independent of each other as climbing anchors. As one example, the multi-use snow tool includes a snow fluke including a blade body having a base end and a nose end opposite the base end; a snow picket having an elongate shaft including at least a first flange; and a lip assembly located at the base end of the blade body and cooperating with the blade body to define at least a first channel that is adapted to mate with the first flange to detachably couple the snow picket to the snow fluke.

Abstract: A probe assembly having a switch that selectively electrically connects, for example, either a Kelvin connection or a suspended guard element with the probe assembly.

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.

Abstract: A high frequency probe has contact tips located within the periphery of a terminal section of a coaxial cable and shielded by a ground conductor of the coaxial cable.

Abstract: A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies.

Abstract: An RFID enabled waste/recycling container includes a molded plastic body; and a case containing an RFID device. The case includes a front surface and a rear surface defining a wedge-shape. The case is in-molded with the plastic body such that a substantial portion of the front surface and the rear surface are exposed. In another embodiment, the case is also designed to snap-fit to a waste/recycling container.

Abstract: A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.

Abstract: A connection system for sealingly interconnecting components of a high pressure fluid flow system, for example, an automobile engine air intake. The system can include a conduit defining a groove that is locked in a corresponding groove defined by a component, for example, an engine intake. An interlock ring is placed in the conduit groove. A clamp is placed over the interlock ring, however, the clamp and ring can be an integral component. When tightened, the clamp forces the ring into the conduit groove, which presses the conduit into sealing and/or locking engagement with the component groove.

Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may have a rigid probing member and include a flexible interconnection between the active circuit and a support structure. The active circuit may have a relatively low capacitance as seen by the device under test.

Abstract: A chuck for a probe station.

Abstract: A naturally aspirated, fully aerated radiant burner and optional heat exchanger arrangement where the radiant burner has a generally enclosed cavity defined, at least in part, by fuel gas impermeable surroundings and a lower surface of fuel gas permeable burner element, wherein cavity preferably has two opening exposed to an oxidizer source. Sealingly coupled to openings are mix tubes, each having respective first ends and second ends, wherein first ends occupy openings and second ends extend into and are exposed to cavity. Fuel gas injectors, which during use are in fluid communication with fuel gas, are positioned to introduce fuel gas into mix tubes and entrain only slightly more air than needed for stoichiometric combustion.

Abstract: A test configuration for double sided probing of a device under test includes a holder to secure the device under test in a first orientation, a calibration substrate secured in a second orientation and a probe capable of calibration using the calibration substrate and probing the device under test.