Abstract: A flexible support device adapted to provide overall structural biomechanics support and contouring of a lower limb of a patient by a practitioner where the flexible support device having various indentations to provide proper fitting of a bold for production of an orthosis device in one form.

Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: A system includes an imaging device suitable for effectively positioning a probe for testing a semiconductor wafer. The system includes an objective lens for sensing the device under test and an imaging device sensing a first video sequence including multiple frames of an overlapping region of the device under test. A video signal is provided to a display including multiple frames of the overlapping region of the device under test. An operator indicating a region of the video signal of devices under test and the system in response presenting an enlarged view of a plurality of different regions of the device under test in a plurality of windows free from user input, where the region and the plurality of different regions are simultaneously displayed on the display.

Abstract: Improved bolted joint designs are used for a joint between a bolt-on load-lifting member such as a fork or clamp arm and a carriage or carrier associated with a material handling device. In various embodiments, an elongate rear vertical shank of one or the other of the load-lifting member or the carrier may have a plurality of mounting bolt holes spaced longitudinally along its length, each mounting bolt hole extending from a respective recessed area formed in one or both of the joined surfaces. Each bolt hole has a respective bolt-hole width dimension transverse to the elongate member, and each recessed area has a recess width dimension parallel to and greater than the bolt-hole width dimension.

Abstract: A cover or enclosure for actively transferring heat energy to at least a distal portion of a fluid conduit and/or bite valve thereof that is part of a personal hydration system, systems incorporating such a cover and related methods. The cover or enclosure includes a first chamber and an adjacent second chamber where a common or adjacent wall, or portion thereof, separates the two. The first chamber is adapted to receive a heat generating element while the second chamber is adapted to removable receive at least the distal portion of the fluid conduit and/or bite valve thereof. The first chamber further includes at least one closure for selectively allowing ingress and egress of the heating means to and from the first chamber. Heating of the distal portion of the fluid conduit and/or bite valve thereof takes place when disposed in the second chamber and the heat generating element is active.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A chuck for a probe station.

Abstract: A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam contact proximate the second end of the beam. The beam being movable to deform at least one surface of the elastic membrane.

Abstract: A chuck for a probe station.

Abstract: A system for low-current testing of a test device includes a probing device for probing a probing site on the test device. The probing device includes a dielectric substrate having first and second sides, an elongate conductive path on the first side of the substrate, an elongate probing element connected to the elongate conductive path so as to extend in a cantilevered manner beyond the substrate, and a conductive area on the second side of the substrate. The probe housing is matingly detachably engageable with the probing device.

Abstract: An accessible optical path to a lower surface of a heatable device under test is provided by a thermal optical chuck comprising a transparent resistor deposited on transparent plate arranged to supporting the device in a probe station.

Abstract: A chuck for a probe station.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

Abstract: A probe assembly suitable for high-current measurements of an electrical device.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.

Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.