Abstract: A complementary field-effect (CMOS) circuit is provided which includes a current-limiting device arranged along a power-supply bus or a ground bus of the circuit. The current-limiting device is configured to prevent latch up of the CMOS circuit. More specifically, the current-limiting device is configured to maintain a junction of the parasitic pnpn diode structure as reverse-biased. A method is also provided which includes creating a current-voltage plot of a pnpn diode arranged within a first CMOS circuit which is absent of a current-limiting device arranged along a power bus of the circuit. In addition, the method includes determining a holding current level from the current-voltage plot and sizing a current-limiting device to place along a power bus of a second CMOS circuit comprising similar design specifications as the first CMOS circuit such that the current through the second CMOS circuit does not exceed the holding current level.

Abstract: A host device can download a firmware update to a peripheral device having previously enumerated with the host device. The host device can perform link training with the peripheral device in response to a re-enumeration indication received from the peripheral device. The link training can include switching a Link Training and Status State Machine (LTSSM) in the host device from an active state (U0) to an RX.Detect state and synchronizing with the peripheral device in the RX.Detect state. The host device can re-enumerate with the peripheral device utilizing the firmware update after the host device completes link training with the peripheral device.

Abstract: A method of making a semiconductor structure comprises forming an oxide layer on a substrate; forming a silicon nitride layer on the oxide layer; annealing the layers in NO; and annealing the layers in ammonia. The equivalent oxide thickness of the oxide layer and the silicon nitride layer together is at most 25 Angstroms.

Abstract: An apparatus for converting a capacitance measured on a capacitive sensor to a digital code may include a modulation capacitor to receive charge transferred from the sensor and compensation circuitry to divert charge from the modulation capacitor. A method for operating the apparatus may include generating a digital bitstream based on the capacitance of the sensor and compensating for a parasitic capacitance of the capacitive sensor.

Abstract: A multiple master USB hub device and method for enabling multiple OTG and host devices to control peripherals and slave devices with a connection of the multiple OTG and host devices to the USB hub device. The multiple master USB hub device is configured to enable at least two USB devices connected thereto to each be configured as host/master elements to control OTG and peripheral/slave devices connected to the USB hub device, the USB hub device comprising an element configured to switch configuration of each of the at least two USB devices to a host/master configuration at different predetermined times.

Abstract: A system interface of a processing system receives an indication to initiate configuration of a programmable system. A processing device coupled to the system interface and associated with an integrated development environment, responsive to the indication, translates a hardware description code into one or more configuration files specific to the programmable system, the hardware description code to describe circuitry in the programmable system. The processing device further generates program code for a microcontroller of the programmable system based, at least in part, on the hardware description code, and configures the programmable system to implement the circuitry according to the configuration files and the program code. In addition, the processing device debugs the programmable system as configured by the configuration files and the program code.

Abstract: In one example, a chip includes an integrated analog component configured to communicate over an internal analog bus of the chip. A plurality of I/O pads located on the chip is configured to provide a connected device access to the integrated analog component. A plurality of transmission gates configured to selectively connect the I/O pads to a bus line of the analog bus.

Abstract: One embodiment includes a method for designating, at a first device, one of a first plurality of wireless channels as a bind channel, then transmitting a channel change request message using a second plurality of wireless channels, wherein the channel change request includes which one of the plurality of wireless channels is a designated bind channel, transmitting a bind request message using the designated bind channel, and then receiving a bind response message from a second wireless device using the designated bind channel.

Abstract: A system includes a voltage pump to generate a first pump voltage from an analog voltage signal. The system further includes switching pad to receive an analog signal from an external source and route the analog signal to analog processing circuitry over one or more analog signal busses based on the first pump voltage and the analog voltage signal.

Abstract: An apparatus for and method of detecting multiple presences on a touch sensor device are described.

Abstract: A capacitive sensor array may include a first sensor element of a first plurality of sensor elements, and a second sensor element. The second sensor element may include a plurality of subelements, where each of the plurality of subelements is connected to at least another of the plurality of subelements by one of a plurality of connecting traces. A width of each of the connecting traces may be less than a width of any of the plurality of subelements. Connecting traces in a subset of the plurality of connecting traces may be staggered about a central axis of the second sensor element.

Abstract: A switch capacitor unit for implementing a capacitive sensor includes a charging switch, a charge transfer switch, and a first switch. The charging switch is coupled between a first supply voltage and a circuit node to selectively couple a sensing capacitor to the first supply voltage through the circuit node. The charge transfer switch is coupled between the circuit node and a first terminal of a second capacitor to selectively couple the sensing capacitor through the circuit node to the second capacitor. The first switch is coupled between the circuit node and a second terminal of the second capacitor to selectively couple the second terminal to the sensing capacitor through the circuit node.

Abstract: A leadframe and semiconductor device package with multiple semiconductor device die paddles for accepting multiple semiconductor devices is disclosed, wherein the leadframe increases semiconductor device density and reduces cost by integrating the multiple dies into a semiconductor device package with a relatively small footprint. The leadframe may include at least one full-metal die paddle and at least one reduced-metal die paddle, which may form a unified or hybrid die paddle. The leadframe may enable electrical coupling of multiple semiconductor devices to a common leadfinger and/or die paddle, where internal leadfingers coupled to the common leadfingers and/or die paddles may receive the electrical coupling means from the semiconductor device. Surfaces of one or more die paddles of the leadframe may be exposed to the outside of the semiconductor device package to enable electrical testing of and/or provide heat dissipation from one or more of the semiconductor devices attached to the leadframe.

Abstract: An example method includes measuring a capacitance variation of a first conductive element and a capacitance variation of a second conductive element. The example method includes calculating a centroid position through the measured capacitance variation of the first conductive element and the measured capacitance variation of the second conductive element. A conductive sub-element of the first conductive element may be interleaved with a conductive sub-element of the second conductive element. The conductive sub-element of the first conductive element and the conductive sub-element of the second conductive element may each have a varying width.

Abstract: A configurable switched capacitor block includes a switched-capacitor (SC) sampling circuit, a fully differential amplifier, an SC feedback circuit, and a comparator. The SC sampling circuit is coupled to receive an input signal and to selectively generate a sampled signal to a differential input of the amplifier. The SC feedback circuit is coupled between the differential inputs and the differential outputs of the amplifier to selectively control a feedback of the amplifier. The comparator is coupled to the differential outputs of the amplifier to generate an output signal. The configurable switched capacitor block has multiple modes of operation which are selectable by programming the SC sampling circuit and the SC feedback circuit.

Abstract: Apparatuses and methods of an integrated capacitance model circuit are described. A capacitance model circuit is disposed on a common carrier substrate of an integrated circuit (IC) having a capacitance-sensing device. The capacitance model circuit is configured to model a capacitance of an external sense array. The capacitance model circuit is programmable.

Abstract: A method for locating a conductive object at a touch-sensing surface may include detecting a first resolved location for the conductive object at the touch-sensing surface based on a first scan of the touch-sensing surface, predicting a location for the conductive object, and determining a second resolved location for the conductive object by performing a second scan of a subset of sensor electrodes of the touch-sensing surface, wherein the subset of sensor electrodes is selected based on the predicted location of the conductive object.

Abstract: A system for wear-leveling of a non-volatile memory may include a controller configured to allocate memory blocks in the non-volatile memory, a logical-to-physical table populated with pointers to memory blocks in the nonvolatile memory, and a wear-leveling table configured to store two or more pointers to unallocated memory blocks in the non-volatile memory. The unallocated memory blocks are previously allocated to store data by the controller according to the pointers in the logical-to-physical table. The controller is further configured to identify two or more pointers in the wear-leveling table and to store data to the two or more memory blocks associated with the identified pointers.

Abstract: An integrated circuit device can include a plurality of analog blocks, at least a first analog block comprising a data converter circuit, each analog block including a programmable switch path coupled to a plurality of external connections to the integrated circuit device; and a plurality of programmable digital blocks, at least one programmable digital block configurable to control the programmable switch paths to couple external connections to the data converter circuit via an analog block other than the first analog block.

Abstract: Methods, physical computer-readable media, and devices are provided that allow re-enumeration to be initiated on a USB 3.0-compatible device. The method includes establishing a connection with a host, transmitting an indicator from the device to the host to cause a Link Training and Status State Machine (LTSSM) of the host to move from active state (U0) to one of SS.Inactive and RX.Detect, synchronizing the device with the host, and presenting a new configuration of the device to the host.