Abstract: A photodiode excellent in responsivity receives flashes of light emitted from flash lamps in the process of heating a semiconductor wafer by irradiation with flashes of light, and the waveform of the intensity of the flashes of light versus time is acquired using voltage data obtained from an output from the photodiode. Then, a temperature calculating part performs a heat conduction simulation using the acquired data to calculate the temperature of the semiconductor wafer irradiated with the flashes of light from the flash lamps. The temperature of the semiconductor wafer is computed using data corresponding to the intensity of the flashes of light obtained from the output from the photodiode. This allows the determination of the surface temperature of the semiconductor wafer irradiated with the flashes of light, irrespective of the waveform of the emission intensity of the flash lamps.
Abstract: In an inkjet printer, a first sparsely arranged portion of a first ejection head entirely overlaps in a movement direction with a second densely arranged portion of a second ejection head. A plurality of outlets of the first sparsely arranged portion include use outlets, and among a plurality of outlets of the second densely arranged portion, those that overlap in the movement direction with use outlets of the first sparsely arranged portion are non-use outlets. In an overlapping range of the first ejection head and the second ejection head, outlets of both of the ejection heads are used in recording an image onto a base material. Consequently, it is possible to prevent or suppress a reduction in print quality such as changes in density or the occurrence of voids due to displacement of the mounting positions of ejection heads in the overlapping range.
Abstract: A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.
Abstract: A technology of inspecting a photoexcited carrier generation area of a photo device in a non-contact manner is provided. An inspection apparatus inspects a photovoltaic cell panel in which the photo device is formed. The inspection apparatus includes an irradiation part that irradiates the photovoltaic cell panel with pulsed light from a light receiving surface side and a detecting part (detector) that detects electric field intensity of a terahertz wave pulse, which is generated according to the irradiation of the pulsed light.
June 12, 2012
Date of Patent:
October 28, 2014
Dainippon Screen Mfg. Co., Ltd., Osaka University
Abstract: A transport device includes a plurality of transporting sections to transport a printing medium; a divided accelerating interval setting section to set a transportation speed in a divided accelerating interval corresponding to a time generated by dividing a time where the transportation speed of the printing medium changes from 0 to a given value in accordance with an acceleration rate; a divided decelerating interval setting section to set a transportation speed in a divided decelerating interval corresponding to a time generated by dividing a time where the transportation speed of the printing medium changes from the given value to 0 in accordance with an decelerating rate; including a basic shaft transporting section configured to be driven at the transportation speed set for every divided accelerating interval or for every divided decelerating interval for transporting the printing medium; and a controller for controlling the foregoing sections.
Abstract: A substrate treatment apparatus includes: a treatment chamber provided therein with a chemical solution treatment area for treating a substrate with a chemical solution and a drying treatment area provided above the chemical solution treatment area for drying the substrate; a substrate holding member vertically movably provided in the treatment chamber for holding the substrate; and a lifting mechanism vertically moving the substrate in the range between the chemical solution treatment area and the drying treatment area.
Abstract: A control apparatus in a substrate treating system with a substrate treating apparatus having a physical load port for receiving pods for storing substrates, and a carrier transport system for transporting the pods to and from the physical load port. The control apparatus includes a virtual load port control device for allotting a virtual load port to the physical load port, and instructing the carrier transport system to perform a transporting operation to and from the virtual load port on an assumption that the virtual load port really exists.
Abstract: The first flash irradiation is performed on a semiconductor wafer preheated to 500° C. to heat a front surface of the semiconductor wafer. Thereafter, the second flash irradiation is performed to reheat the front surface of the semiconductor wafer before the temperature of the front surface of the semiconductor wafer becomes equal to the temperature of a back surface of the semiconductor wafer. Thus, the second flash irradiation is performed before the temperature of the front surface of the semiconductor wafer falls. Even if less energy is consumable by the second flash irradiation, the efficiency of heating of the front surface of the semiconductor wafer resulting from each iteration of the flash irradiation is improved.
Abstract: In light-irradiation heating with a total irradiation time of one second or less, two-stage irradiation is performed, including a first stage of light irradiation of a semiconductor wafer, which irradiation produces an output waveform that reaches a peak at a given emission output; and a second stage of supplemental light irradiation of the semiconductor wafer, which irradiation is started after the peak, producing an emission output smaller than the above given emission output. The emission output in the second stage is two thirds or less than the above given emission output at the peak. The first-stage light-irradiation time is between 0.1 and 10 milliseconds, and the second-stage light-irradiation time is 5 milliseconds or more. This allows the temperature of the semiconductor wafer even at a somewhat greater depth below the surface to be raised to some extent while allowing the surface temperature to be maintained at a generally constant processing temperature.
Abstract: Web paper is transported by roll with two or more drive rollers. The two adjacent drive rollers each have difference in rotation speed in accordance with a draw ratio. Accordingly, tension is applied to the web paper. Tension of the web paper between the adjacent drive rollers is detected by a tension sensor. A tension controller controls the detected tension value so as to be a target tension value. A predictive control device predicts decrease in tension during an initial printing period where tension control is not stable, and increases rotation speeds of the drive rollers downstream of a print unit to suppress the decrease in tension. Consequently, tension acting on the web paper is appropriately controlled also during the initial printing period, resulting in possible reduction in printing quality.
Abstract: A rinsing liquid adheres in a piled up state to the entire front surface of the substrate which is rinsed with the rinsing liquid discharged from a rinse nozzle, thereby forming a so-called puddle-like rinse layer. An opposed surface of a proximity block is positioned in the vicinity of a front surface of a substrate and a liquid-tight layer is formed in a gap space between the opposed surface and the front surface of the substrate. In a condition that the liquid-tight layer is formed, the proximity block moves in the moving direction, and a solvent gas containing a solvent component, which dissolves in the liquid to reduce a surface tension, is supplied toward an upstream-side edge of the liquid-tight layer.
Abstract: A substrate processing apparatus includes a substrate processing section that processes a plurality of substrates assuming a vertical posture in a batch manner; a first traversing mechanism that laterally moves a first traverse holding portion along a first traversing path between a substrate transfer position and a substrate delivery position; a second traversing mechanism that laterally moves a second traverse holding portion along a second traversing path disposed below the first traversing path between the substrate transfer position and the substrate delivery position; an elevation mechanism that raises and lowers an elevation holding portion in the substrate transfer position; and a main transfer mechanism that conveys a plurality of substrates assuming a vertical posture in a batch manner between the substrate delivery position and the substrate processing section, the first and second traverse holding portions, and the elevation holding portion each holds a plurality of substrates assuming a vertical
Abstract: A semiconductor wafer, on the surface of which a silicon dioxide base material and an amorphous silicon thin film are formed in this order, is carried into a chamber. An insulated gate bipolar transistor (IGBT) is connected with a power supply circuit to a flash lamp, and the IGBT makes an energization period to the flash lamp to be 0.01 millisecond or more and 1 millisecond or less, consequently making a flash light irradiation time to be 0.01 millisecond or more and 1 millisecond or less. Since a flash heat treatment is performed with a remarkably short flash light irradiation time, the excessive heating of the thin film of amorphous silicon is suppressed and harmful influence such as the exfoliation of the film is prevented.
Abstract: A chart 50 is formed of a density detecting pattern 51 and position detecting marks 52. The density detecting pattern 51 includes five different density areas A, B, C, D and E in form of belts arranged sequentially in Y-direction. The position detecting marks 52 are formed at intervals in X-direction which is a direction of arrangement of nozzles, at an end of the density area A of the density detecting pattern 51. These position detecting marks 52 are formed by suspending, for a fixed period of time, discharge from particular nozzles selected from a plurality of nozzles which discharge ink for forming the density detecting pattern 51, thereby producing ink-free portions (void portions) in the density area A.
Abstract: The present invention provides a printer and printing method that forms a lenticular lens or a transparent structure based on pseudo-embossment printing or the like on paper having penetrability, and an inkjet printer performs: with respect to a base material having a characteristic of being penetrated by radiation-curable ink, an undercoating step of using radiation-curable transparent ink to form a thin undercoat layer; an undercoat curing step of irradiating the formed undercoat layer with radiation to completely solidify the thrilled undercoat layer; a transparent structure forming step of using the radiation-curable transparent ink to form a spacer layer and microlens layer as a desired transparent structure on the solidified undercoat layer; and a transparent structure curing step of afterward further irradiating the radiation to cure the formed spacer layer and microlens layer.
Abstract: A transfer apparatus includes a plurality of holders respectively coming into contact with a carrier and a roller member. Each of the holders is sequentially separated from the carrier in accordance with a movement of the roller member, moves to a retracted position where the holder does not interfere with the roller member, comes into contact with the other surface of the carrier again after the passage of the roller member, and moves in the direction away from the carrier while sucking the carrier by the suction unit.
Abstract: A substrate processing apparatus includes a substrate supporting part for supporting a substrate in a horizontal state, an upper nozzle for discharging deionized water as a cleaning solution toward a center portion of an upper surface of the substrate, and a substrate rotating mechanism for rotating the substrate supporting part together with the substrate around a central axis directed in a vertical direction. In the substrate processing apparatus, the plurality of discharge ports are provided in the upper nozzle, and the flow rate of the deionized water to be supplied onto the center portion of the substrate from the upper nozzle can be ensured, with the flow rate of the deionized water from each discharge port reduced. It is thereby possible to perform appropriate cleaning of the upper surface of the substrate while suppressing electrification at the center portion of the substrate.
Abstract: An image obtained by shrinking an original image in a row direction is halftoned, and this halftone dot image is enlarged in the row direction and recorded at double speed. In order to determine a threshold value of a threshold matrix used for halftoning an image, prepared is a matrix space in accordance with writing positions used for actual recording of an image. In the matrix space, writing elements are set alternately with non-writing elements both in the row direction and in a column direction. In the matrix space, turn-on numbers are allocated to all the writing elements in avoidance of the non-writing elements. Then, in accordance with the turn-on numbers, respective threshold values for the writing elements are determined. By shrinking the threshold matrix in the row direction with omission of the non-writing elements, a threshold matrix for double speed is obtained.
Abstract: A treatment liquid supply apparatus supplies a treatment liquid to a predetermined object for treatment of a substrate, and recovers the supplied treatment liquid for reuse. The apparatus includes: a first tank in which the treatment liquid to be supplied to the object is stored; a second tank in which the treatment liquid recovered from the object is stored; a transfer unit which transfers the treatment liquid from the second tank to the first tank; a first temperature regulating unit which regulates the temperature of the treatment liquid to be supplied from the first tank to the object; and a second temperature regulating unit which regulates the temperature of the treatment liquid to be transferred from the second tank to the first tank by the transfer unit.
Abstract: An image recording apparatus generates black, cyan, magenta, and yellow halftone image data from a multi-tone color image. When the cyan halftone image data is generated, the size of a cyan dot to be formed at a target pixel position is provisionally determined and added to the size of a black dot to obtain a total dot size. When the total dot size is less than or equal to a first threshold dot size, the cyan dot size is determined to be the provisionally determined size, and when the total dot size is greater than the first threshold dot size, the cyan dot size is determined to be the largest dot size within the range of a difference between the first threshold dot size and the black dot size. It is possible to prevent excessive overlapping of black and cyan dots.