Abstract: An inkjet printing apparatus is provided, which has a simple construction, and is yet capable of reducing ink consumption and cleaning inkjet heads promptly. The inkjet printing apparatus includes connector caps 51a-51l for connecting tubes communicating with suction caps, a cap support 54 supporting the connector caps 51a-51l, a switch element 60 for switching to a sucking state one of the connector caps 51a-51l to which the tubes are connected, and a stepping motor 57 for supporting and rotating the switch element 60.

Abstract: A treatment liquid supply apparatus supplies a treatment liquid to a predetermined object for treatment of a substrate, and recovers the supplied treatment liquid for reuse. The apparatus includes: a first tank in which the treatment liquid to be supplied to the object is stored; a second tank in which the treatment liquid recovered from the object is stored; a transfer unit which transfers the treatment liquid from the second tank to the first tank; a first temperature regulating unit which regulates the temperature of the treatment liquid to be supplied from the first tank to the object; and a second temperature regulating unit which regulates the temperature of the treatment liquid to be transferred from the second tank to the first tank by the transfer unit.

Abstract: A liquid supply apparatus includes a reservoir for storing a liquid therein, a supply path for supplying the liquid from the reservoir to a liquid consuming apparatus, a pump for feeding the liquid from the reservoir to the supply path, and a controller for outputting a driving signal to the pump to control the supply of the liquid. The controller acquires a target feed volume of the liquid from the pump to gradually change a feed volume of the liquid from the pump from a current feed volume to the target feed volume, based on a request signal from the liquid consuming apparatus serving as a destination to which the liquid is supplied. This suppresses an abrupt change in pressure in the liquid consuming apparatus serving as the destination to which the liquid is supplied.

Abstract: In a substrate processing apparatus, provided are an upper nozzle for supplying a chemical liquid having a temperature higher than that of a substrate onto an upper surface of the substrate and a heating liquid supply nozzle for supplying a heating liquid having a temperature higher than that of the substrate onto a lower surface of the substrate. It is thereby possible to suppress or prevent a decrease in the temperature of the chemical liquid supplied on the upper surface of the substrate from a center portion of the substrate toward an outer peripheral portion thereof. In a supply nozzle, the heating liquid supply nozzle is positioned on the inner side of a heating gas supply nozzle for ejecting heating gas in drying the substrate. It is thereby possible to simplify and downsize a structure used for heating the lower surface of the substrate.

Abstract: In a substrate processing apparatus, an ejection surface of an ejection head located at a standby position is immersed in an immersion liquid retained in a reservoir during standby of the ejection head. This prevents drying of a plurality of outlets provided in the ejection head and drying of processing liquid flow passages that communicate with the outlets. It is thus possible to suppress or prevent clogging of the fine outlets. When the ejection head resumes processing on a substrate, the immersion liquid in the reservoir is discharged and then a liquid removing part removes the immersion liquid adhering to the ejection surface. Accordingly, it is possible to prevent the immersion liquid remaining on the ejection surface from dropping and adhering to the substrate (so-called “liquid dripping”) when, for example, the ejection head is moved to a position above the substrate.

Abstract: An inkjet printer includes a cleaning unit to be brought into contact with a head lower surface of an ejection head, and a unit movement mechanism for moving the cleaning unit. The cleaning unit includes a base part, a cleaning liquid ejecting part protruding above the base part, and a pair of positioning parts. The positioning parts are brought into contact with a block lower surface of a head fixation block on opposite sides of the cleaning liquid ejecting part to keep an under-head gap for holding the cleaning liquid between the cleaning liquid ejecting part and the head lower surface. Since the positioning parts are spaced from the cleaning liquid ejecting part, it is possible to prevent the cleaning liquid that has spread from the under-head gap to the surrounding area from adhering to the block lower surface via the positioning parts.

Abstract: In a substrate processing apparatus, an election head from a position above a substrate held by a substrate holding part to an inspection position above a standby pod disposed outside a cup part. At the inspection position, a processing liquid ejected from the ejection head toward the standby pod is irradiated with planar light emitted from a light emitting part. An imaging part acquires an inspection image including bright dots appearing on the processing liquid, and a determination part determines the quality of the ejection operation of the ejection head on the basis of the inspection image. Accordingly, it is possible to eliminate the influence of reflected light from the substrate and droplets, mist, or the like of the processing liquid having collided with the substrate and to accurately determine the quality of the ejection operation of the ejection head.

Abstract: Four wafer pins are fixed in a chamber and spaced at intervals of 90 degrees. Four support pins are provided in a wafer pocket of a susceptor and spaced at intervals of 90 degrees. The four wafer pins and the four support pins are disposed concyclically in an alternating manner at intervals of 45 degrees. When halogen lamps irradiate a semiconductor wafer with light to heat the semiconductor wafer, the susceptor is moved upwardly and downwardly, so that the semiconductor wafer is shifted between the wafer pins and the support pins. This eliminates the occurrence of a problem such that the quartz pins which are relatively low in temperature are continuously kept in contact with particular places of the semiconductor wafer to improve the uniformity of the in-plane temperature distribution of the semiconductor wafer.

Abstract: The inventive substrate treatment apparatus includes a change controlling unit which changes at least one of a protection liquid application position relative to a liquid droplet nozzle and a protection liquid incident angle relative to the liquid droplet nozzle, the protection liquid application position being a position at which the protection liquid is applied on an upper surface of the substrate, the protection liquid incident angle being an angle at which the protection liquid is incident on the liquid application position; wherein the change controlling unit controls the liquid application position and the incident angle in a first condition when the spraying region is located on an upper surface center portion of the substrate, and controls the liquid application position and the incident angle in a second condition when the spraying region is located on an upper surface peripheral portion of the substrate.

Abstract: An ejection inspection part of a substrate processing apparatus includes a light emitting part and an imaging part. The light emitting part emits light along a predetermined light existing plane to irradiate a processing liquid ejected from outlets of an ejection head with the light. The imaging part captures an image of the processing liquid passing through planar light emitted from the light emitting part to acquire an inspection image including bright dots. In the ejection inspection part, a determination frame setting part sets normal ejection determination frames corresponding to the outlets in the inspection image. The determination part acquires existence information indicating whether or not a bright dot exists in each normal ejection determination frame and uses the existence information to determine the quality of the ejection operation of the outlet corresponding to the normal ejection determination frame.

Abstract: In an inkjet printer, a cap part for receiving ink from a head unit during maintenance includes a liquid receiving part and an exhaust part disposed laterally to the liquid receiving part. In the liquid receiving part, a second liquid receiving chamber is disposed further from the exhaust part than is a first liquid receiving part. A second flow path is disposed below the first liquid receiving chamber without passing through the first liquid receiving chamber. In the exhaust part, a first fan part is connected to the first liquid receiving chamber, and a second fan part is connected to the second liquid receiving chamber through the second flow path. Accordingly, it is possible to appropriately exhaust a gas contained within the second liquid receiving chamber, independently of the first liquid receiving chamber. Consequently, a mist in the liquid receiving part can be discharged efficiently.

Abstract: A substrate processing apparatus for processing a substrate comprises: a plurality of chuck pins each having an accommodating groove for accommodating a portion of peripheral part of the substrate, holding the substrate at a hold position in a horizontal posture by pressing inner faces of the accommodating grooves toward portions of peripheral part of the substrate; and a plurality of guide members, being disposed on or above the respective plurality of chuck pins, guiding process liquid discharged from the substrate to a surrounding area of the substrate; wherein each of the plurality of guide member includes: an inner-edge guide disposed at a position inward and above the accommodating groove; and an outer-edge guide disposed at a position level with or below the inner-edge guide and outward the chuck pin.

Abstract: A light-emission output of a flash lamp for performing a light-irradiation heat treatment on a substrate in which impurities are implanted is increased up to a target value L1 over a period of time from 1 to 100 milliseconds, is kept for 5 to 100 milliseconds within a fluctuation range of plus or minus 30% from the target value L1, and is then attenuated from the target value L1 to zero over a period of time from 1 to 100 milliseconds. That is, compared with conventional flash lamp annealing, the light-emission output of the flash lamp is increased more gradually, is kept to be constant for a certain period of time, and is then decreased more gradually. As a result, a total heat amount of a surface of the substrate increases compared with the conventional case, but a surface temperature thereof rises more gradually and then drops more gradually compared with the conventional case.

Abstract: A drawing apparatus which performs a drawing process on a substrate includes a holding plate having a holding surface configured to be opposed a back surface of the substrate, a vacuum suction port formed in the holding surface and configured to attract the substrate to the holding surface by vacuum suction, and a plurality of Bernoulli suction ports formed in the holding surface and configured to attract the substrate to the holding surface by Bernoulli suction. The holding surface includes a circular region disposed concentrically with the center of the holding surface, and an annular region disposed concentrically with the circular region. At least one of the Bernoulli suction ports is disposed in the circular region, and at least one of the Bernoulli suction ports is disposed in the annular region.

Abstract: An inspecting device includes: an irradiation part for dividing pulsed light emitted from a femtosecond laser into measurement pump light and measurement probe light, to irradiate a solar cell; a detection part for detecting an electromagnetic wave emitted from the solar cell in accordance with the irradiation with the measurement probe light; and a measurement delay part for delaying the time of arrival of the measurement probe light at the solar cell relatively to the measurement pump light. The irradiation part is provided with a galvano mirror for scanning with the measurement probe light a wide range which is wider than an irradiated range (pump light spot) being irradiated with the measurement pump light in a solar cell.

Abstract: Provided is a printed matter for measuring printing precision of a printing apparatus configured to perform printing to both sides of a printing medium. The printed matter includes a plurality of positioning reference marks printed orthogonal to a transportation direction of the printing medium; and an inspecting window bored in a positioning reference mark of the plurality of positioning reference marks, the positioning reference mark corresponding to an object to be inspected. The printing medium is folded so as to make another positioning reference mark on the printing medium visible through the inspecting window, and the positioning reference mark on a side of the inspecting window is compared with the positioning reference mark visible through the inspecting window, whereby printing precision is measured.

Abstract: The invention aims at reducing unevenness at the intersections of mutually crossing electrodes with a method of and an apparatus for forming electrodes on a substrate. After forming a number of finger electrodes on a substrate, wide bus electrodes intersecting them are formed by application of an application liquid. Upon applying the application liquid which contains an electrode material and a photo-curing resin to the substrate, the application liquid is irradiated with UV light after a predetermined time and the application liquid is thus made to harden. A time difference since applying until light irradiation is set based on the result of measurement on changes of the height of the application liquid experimentally applied.

Abstract: A preprocess step for supplying an inert gas into an enclosed space in which a substrate is disposed, while exhausting gas by sucking out of the enclosed space. And then, an etching step for supplying a process vapor into the enclosed space while exhausting gas out of the enclosed space at an rate lower than a rate in the preprocess step. And then a post-process step for supplying an inert gas into the enclosed space while exhausting gas by sucking out of the enclosed space at a rate higher than the rate in the etching step.

Abstract: A liquid hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. A solvent, lower in surface tension than water and capable of dissolving the hydrophobizing agent, is supplied to the substrate in a pre-drying rinsing step. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized.

Abstract: An electrode 10 for battery comprises: a base member 11 which serves as a current collector; and an active material layer 12 of an active material which is formed by a plurality of active material lines extending on a surface of the base member 11 along a predetermined longitudinal direction, wherein the active material lines include first lines 121 whose width in orthogonal cross section to the longitudinal direction is a first width W1 and second lines 122 whose width is a second width W2 which is wider than the first width W1 and whose height H2 measured from the surface of the base member is equal to or higher than a height H1 of the first lines.