Patents Assigned to .Engineering, Inc.
  • Publication number: 20240304584
    Abstract: A package structure is provided. The package structure includes a semiconductor substrate. The semiconductor substrate includes a lower portion and an upper portion. The upper portion of the semiconductor substrate defines a high speed signal transmission region. The high speed signal transmission region includes a first region configured to communicate with a first electronic component and a second region configured to communicate with an external device.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hai-Ming CHEN, Hung-Yi LIN, Cheng-Yuan KUNG
  • Patent number: 12085417
    Abstract: Described are systems and methods to provide agnostic sensor data obtained from a sensor and transmitted to a central database by a transmitter device. In one aspect, a value sensed by a sensor component is converted at the transmitter device to an agnostic value defined by a dimensionless universal scale and offset. The agnostic value is then sent to a data acquisition database where it is converted back to the original value. This is accomplished by first providing the data acquisition database with a sensor definition of a scale and offset used to convert the sensor values in addition to any sensor indicia and other parameters to display the data acquired at the data acquisition database. The wireless sensors database and user interface are also automatically updated when a new sensor type is attached to the network utilizing configuration data that resides in the new sensor that is sent to the database on its first connection.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: September 10, 2024
    Assignee: Phase IV Engineering Inc.
    Inventors: Jason Michael Wild, Jacob Anthony Baldwin, Scott David Dalgleish, David Scott Kramer
  • Publication number: 20240297090
    Abstract: A package structure is provided. The package structure includes an electronic component, a heat dissipating element, and an adhesive layer. The heat dissipating element is disposed over the electronic component. The adhesive layer is disposed between the electronic component and the heat dissipating element and spaced apart from the electronic component by a first space. The first space is configured to reduce a thermal conductive region between the electronic component and the heat dissipating element occupied by the adhesive layer.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 5, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jui-Shan HSU, Kuang-Hsiung CHEN, Yu-Wei LIANG
  • Publication number: 20240297086
    Abstract: An interconnection structure and a package structure are provided. The interconnection structure includes a substrate, a conductive layer, a bonding layer, and a moderating layer. The conductive layer is over the substrate and has a top surface. The bonding layer is over the top surface of the conductive layer. The moderating layer is between the conductive layer and the bonding layer and configured to mitigate an increase in a surface roughness of the top surface of the conductive layer during an electroless plating process for forming the bonding layer.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 5, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Wei CHIANG, Yun-Ching HUNG, Yung-Sheng LIN
  • Patent number: 12076036
    Abstract: Described herein are systems, devices, and methods for aspiration and mechanical thrombectomy. In some embodiments, a thrombectomy device for removing a thrombus from a vessel can include a handle assembly, a vacuum source, an aspiration catheter with an expandable distal portion, and a flexible shaft configured to rotate within the aspiration catheter.
    Type: Grant
    Filed: January 20, 2023
    Date of Patent: September 3, 2024
    Assignee: Endovascular Engineering, Inc.
    Inventors: Scott J. Baron, Michael Rosenthal, David Snow, Brian Domecus
  • Patent number: 12078518
    Abstract: There is provided a method of estimating flowrate in a pipeline based on acoustic behaviour of the pipe. First acoustic data is measured from the pipeline. A flowrate of the fluid in the pipeline is then estimated. The estimation is based on the first acoustic data and based on a correlation established between second acoustic data and corresponding flowrate data from an experimental pipeline. The correlation is established by a machine learning process (which may include the use of an artificial neural network, such as an autoencoder). The second acoustic data and corresponding flowrate data are used as inputs to the machine learning process.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: September 3, 2024
    Assignee: Hifi Engineering Inc.
    Inventors: Seyed Ehsan Jalilian, Dongliang Huang, Henry Leung, King Fai Ma
  • Publication number: 20240286097
    Abstract: A method of for mixing gases is described. The gases may include a first and a second gas wherein a gas mixing system accepts the gases and operates in a plurality of modes of operation to produce a discharge gas including a mixture thereof, and the second gas may be supplied without the first gas, and the first gas may be supplied without the second gas. The gas mixing system may be integrated with a gas processing system to produce a biogas-related product. The gas mixing system may be a compressor, a jet compressor, an ejector, an eductor, venturi jet pump, eductor-jet pump, and/or a thermocompressor, that uses a first stream of high-pressure gas to entrain a relatively lower pressure second gas, mixes the two, and discharges a third gas mixture that is of a sufficiently elevated pressure to be supplied to other areas of a production facility.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 29, 2024
    Applicant: Stearns, Conrad and Schmidt, Consulting Engineers, Inc.
    Inventor: Jeffrey GRILL
  • Publication number: 20240290515
    Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wu Chou HSU, Hung Yi CHUANG, Shin-Luh TARNG
  • Publication number: 20240288745
    Abstract: A semiconductor device is provided. The semiconductor device includes a first optical transceiver, a second optical transceiver and a component. The component is configured to provide a magnetic field to change a light emitting direction from the first optical transceiver to the second optical transceiver or from the second optical transceiver to the first optical transceiver.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Patent number: 12070730
    Abstract: A method of for mixing gases is described. The gases may include a first and a second gas wherein a gas mixing system accepts the gases and operates in a plurality of modes of operation to produce a discharge gas including a mixture thereof, and the second gas may be supplied without the first gas, and the first gas may be supplied without the second gas. The gas mixing system may be integrated with a gas processing system to produce a biogas-related product. The gas mixing system may be a compressor, a jet compressor, an ejector, an eductor, venturi jet pump, eductor-jet pump, and/or a thermocompressor, that uses a first stream of high-pressure gas to entrain a relatively lower pressure second gas, mixes the two, and discharges a third gas mixture that is of a sufficiently elevated pressure to be supplied to other areas of a production facility.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: August 27, 2024
    Assignee: Stearns, Conrad and Schmidt, Consulting Engineers, Inc.
    Inventor: Jeffrey Grill
  • Patent number: 12071874
    Abstract: A sound attenuating engine exhaust system and methods are provided for directing exhaust gases away from an internal combustion engine of a vehicle and attenuating undesirable exhaust sounds during engine operation. The sound attenuating engine exhaust system comprises an exhaust inlet configured to receive exhaust gases from the internal combustion engine. A first resonator coupled with the exhaust inlet is configured to dampen at least one frequency of exhaust sound waves by way of destructive wave interference. The first resonator includes an exhaust outlet for directing the exhaust gases out of the first resonator. A second resonator is coupled with the first resonator and configured to dampen one or more frequencies of exhaust sound waves by way of a combination of destructive wave interference and Helmholtz resonance. Hangers facilitate attaching the sound attenuating engine exhaust system to an undercarriage of the vehicle.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: August 27, 2024
    Assignee: K&N Engineering, Inc.
    Inventors: Steve E. Williams, Kevin McClelland
  • Publication number: 20240282715
    Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, a second carrier disposed over the first carrier, and a reinforcement connected to the second carrier and configured to prevent the second carrier from being recessed toward the first carrier.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wei-Hao CHANG
  • Publication number: 20240278177
    Abstract: A method to produce a halogen-depleted biogas is described. The method includes supplying biogas and/or a gas derived from a source of biogas to a halogen removal system to produce a halogen-depleted biogas. Biogas pre-processing, post-processing, and a product production system may be integrated with the halogen removal system to produce a product.
    Type: Application
    Filed: April 12, 2024
    Publication date: August 22, 2024
    Applicant: Stearns, Conrad and Schmidt, Consulting Engineers, Inc.
    Inventor: Jeffrey GRILL
  • Publication number: 20240278160
    Abstract: An air filter oil composition is provided for enhancing airflow and filtration of air passing through an air filter. The composition includes a first portion comprising paraffinic oil, a second portion comprising polyalphaolefin (PAO), and a third portion comprising black dye. Applying the air filter oil composition to a cotton air filter material causes tackiness throughout the air filter material, thereby enhancing airflow and filtration of air passing through the air filter. The composition generally is substantially non-reactive, has an excellent oxidation stability, possesses good thermal stability, and retains a suitable viscosity at normal operating temperatures of an automobile engine. In an embodiment, the composition comprises 96.74% paraffinic oil by volume, 3.20% PAO by volume, and 0.06% black dye by volume. A viscosity of the composition at 100 degrees-C. ranges between about 7.2 centistokes and about 7.6 centistokes.
    Type: Application
    Filed: May 2, 2024
    Publication date: August 22, 2024
    Applicant: K&N Engineering, Inc.
    Inventor: Steve Williams
  • Publication number: 20240279618
    Abstract: A receptor tyrosine kinase agonist which is a single-domain antibody having a cell growth activity, and is at least one receptor tyrosine kinase agonist selected from the group consisting of a human fibroblast growth factor receptor 1 (FGFR1), a human fibroblast growth factor receptor 2 (FGFR2), a human fibroblast growth factor receptor 3 (FGFR3), and a human fibroblast growth factor receptor 4 (FGFR4).
    Type: Application
    Filed: June 21, 2022
    Publication date: August 22, 2024
    Applicants: SEKISUI CHEMICAL CO., LTD., Epsilon Molecular Engineering, Inc.
    Inventors: Kenji KASHIWAGI, Teruhiko YANAGISAWA, Ryo YONEHARA, Shigefumi KUMACHI, Kanako NAKAO, Masayuki TSUCHIYA
  • Publication number: 20240283165
    Abstract: An electronic device is provided. The electronic device includes a carrier, an antenna element, a first parasitic patch, and a first current distribution unit. The antenna element is at least partially over the carrier. The first parasitic patch is adjacent to the antenna element. The first current distribution unit is configured to form a first equivalent patch area of the first parasitic patch. The first equivalent patch area has a first length extending in a direction substantially parallel to a first direction of electric current of the antenna element and substantially equal to ?/2, and ? is a wavelength of an operating frequency of the antenna element.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Hong-Sheng HUANG
  • Publication number: 20240282694
    Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.
    Type: Application
    Filed: April 30, 2024
    Publication date: August 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO
  • Publication number: 20240284578
    Abstract: An example of an apparatus is provided. The apparatus includes a communications interface to receive data from a plurality of lighting devices. The data from a lighting device includes a distance and a bearing for neighboring lighting devices of the lighting device. The neighboring lighting devices are selected from the plurality of lighting devices. In addition, the apparatus includes a memory storage unit to store the data received via the communications interface, wherein the data is to be stored in a database. Furthermore, the apparatus includes an aggregator to generate aggregated data for each lighting device from the data in the database. The aggregated data includes data from the plurality of lighting devices. The apparatus also includes a processor to classify each lighting device of the plurality of lighting devices in a group selected from a plurality of groups based on the aggregated data.
    Type: Application
    Filed: June 9, 2022
    Publication date: August 22, 2024
    Applicant: JDRF Electromag Engineering Inc.
    Inventors: James Graham MCANANAMA, Paul Quevedo, Carlos Fernandes, Elias Boukhers, Roumanos Dableh
  • Patent number: 12066356
    Abstract: An apparatus and a method are provided for an oil filter-leak pressure-test station. The oil filter-leak pressure-test station comprises an air pump, a pressure gauge, a vent valve, an overflow reservoir, and a manifold configured to receive an oil filter. The oil filter-leak pressure-test station is configured to apply a desired internal air pressure to an oil filter for observing the oil filter assembly for any potential leaks, such as along a seal ring, rolled seam or a nut-end. The oil filter-leak pressure-test station is also configured to be mounted in a vise or similar mechanical attachment for observation to determine the extent or existence of any leak in the oil filter. The oil filter-leak pressure-test station may also be submerged in water using a submersion reservoir, so as to determine the existence and location of any leaks.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: August 20, 2024
    Assignee: K&N Engineering, Inc.
    Inventors: Joel Valles, Steve Williams, Jonathan Richard Fiello
  • Patent number: D1040725
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: September 3, 2024
    Assignee: OTR Wheel Engineering, Inc.
    Inventor: Leonard Austin Hensel