Patents Assigned to .Engineering, Inc.
  • Patent number: 12129806
    Abstract: A system and methods for a turbo-boost control system are disclosed for providing a driver of a vehicle with greater control over vehicle performance. The turbo-boost control system instructs an electronic control unit of the vehicle to increase the manifold pressure to a higher level before releasing the pressure through a waste gate so as to provide a greater power output of the engine. The turbo-boost control system includes a control module, a wiring harness, and a signal adjuster. The wiring harness couples the control module with a turbo inlet pressure sensor, a manifold absolute pressure sensor, and an electronic control unit of the vehicle. The control module sends signals to the electronic control unit based on input readings from the turbo inlet pressure sensor and the manifold absolute pressure sensor. The signal adjuster includes a rheostat that enables manual adjustment of the power output of the engine.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: October 29, 2024
    Assignee: K&N Engineering, Inc.
    Inventor: Steve Williams
  • Patent number: 12128341
    Abstract: An apparatus and a method are provided for a heating, ventilation, and air conditioning (HVAC) air filter to remove airborne molecular contaminants and volatile organic compounds (VOCs) from air within building spaces. The air filter comprises a support frame having a shape and size suitable to orient the air filter within a HVAC system. A compound filter medium is retained within the support frame to remove the airborne molecular contaminants and VOCs from air flowing through the HVAC system. A portion of the first media layer is pleated and may comprise a combination of media layers configured to exhibit a relatively high filtration efficiency and a low air pressure drop across the filter medium. A second portion of the filter medium is coupled to the first portion and maintains a uniform distribution of the pleats with the first portion.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: October 29, 2024
    Assignee: K&N Engineering, Inc.
    Inventors: Jere James Wall, Steve Williams
  • Patent number: 12127582
    Abstract: Pre-roll infusing apparatus includes fluid vessel, a fluid pump and an infusion needle for spraying fluid into the pre-roll. An elevator includes a tube nest for receiving a support tube containing the pre-roll and selectively raises the pre-roll to be pierced by the needle. A needle heater is supported for travel along the needle as the elevator moves up and down. The elevator tube nest includes a motor-driven rotatable base for rotating the support tube and pre-roll during infusion. A stepper motor equipped with an encoder controls the raising and lowering of the elevator. The needle may include two or more spaced spray ports. A needle pointer indicates to a user the location of the needle spray ports. The fluid vessel includes a stirrer motor, and the current draw thereof is used to determine the viscosity of the fluid. Different support tubes are provided to accommodate different pre-roll styles.
    Type: Grant
    Filed: May 13, 2024
    Date of Patent: October 29, 2024
    Assignee: Credence Engineering, Inc
    Inventor: James Edward Ellis
  • Publication number: 20240355793
    Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under the first part and electrically connected to the second part. The first part is configured to be electrically connected to a device disposed over the first part.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 24, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kay Stefan ESSIG, You-Lung YEN, Bernd Karl APPELT, Jean Marc YANNOU
  • Publication number: 20240357751
    Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a second circuit structure having a surface facing the first circuit structure, and a first electronic component disposed over the first circuit structure and supporting the second circuit structure. The electronic device also includes a second electronic component disposed adjacent to the second circuit structure and having a top surface at an elevation higher than the surface of the second circuit structure with respect to the first circuit structure.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 24, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin-Yu CHEN, Huei-Shyong CHO, Shih-Wen LU
  • Publication number: 20240355763
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI
  • Publication number: 20240356197
    Abstract: The present disclosure provides an electronic device, which includes an encapsulant, an electronic component, an antenna structure, and a first conductive element. The electronic component is disposed in the encapsulant. The antenna structure has an antenna pattern exposed to air and facing the encapsulant, and a first supporting element separating the antenna pattern from the encapsulant. At least a portion of the first conductive element is within the encapsulant, and electrically connects the antenna pattern to the electronic component by the first supporting element.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 24, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Weifan WU, Yong-Chang SYU, Chung Ju YU
  • Publication number: 20240347921
    Abstract: The present disclosure provides an antenna package structure, which includes antenna and a transmitting structure. The transmitting structure includes a first dielectric material and a second dielectric material of different dielectric constants, and a frequency selective surface unit. The first dielectric layer and the second dielectric layer are configured to focus the electromagnetic wave radiated between the antenna and the frequency selective surface unit.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
  • Publication number: 20240345315
    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • Publication number: 20240345343
    Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
  • Publication number: 20240345337
    Abstract: An optical device is provided. The optical device includes a first photonic component and a second photonic component. The first photonic component is configured to communicate with the second photonic component through a first optical path or an electrical path depending on a distance between the first photonic component and the second photonic component.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tai-Hsiang LIU, Hung-Yi LIN, Wen Chieh YANG
  • Publication number: 20240345341
    Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Shih-Yuan SUN, Chiu-Wen LEE, Chang Chi LEE, Chun-Yen TING, Hung-Chun KUO
  • Publication number: 20240347909
    Abstract: The present disclosure provides an antenna package structure, including a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
  • Publication number: 20240339383
    Abstract: An electronic device and a method of manufacturing an electronic device are provided. The electronic device includes an electronic component, a carrier, and a lead. The electronic component has a lateral surface. The carrier supports the electronic component. The lead is electrically connected to the electronic component and disposed adjacent to the lateral surface of the electronic component. The carrier and the lead are configured to block an electromagnetic wave between the electronic component and an external of the electronic device.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 10, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ko-Pu WU, Chih-Hung HSU, Chin Li HUANG, Chieh-Yin LIN, Yuan-Chun CHEN, Kai-Sheng PAI
  • Publication number: 20240336447
    Abstract: A modular loading dock with a mobile base includes an adjustable front section with front opposing adjustable leg members and middle opposing adjustable leg members, two adjustable feet connect each front leg member to a middle leg member, as well as an adjustable back section connected to the adjustable front section and including opposing rear adjustable leg members each having a grade plate. The mobile base has top and bottom surfaces, the top surface has an opening to receive a dock leveler into such opening, the dock leveler includes a lower end and an upper end, the upper end abuts a preexisting structure and the lower end has a lower edge having a lip, the lip being able to be activated between an extended/engaged position to contact a truck bed and a retracted/disengaged position.
    Type: Application
    Filed: April 4, 2023
    Publication date: October 10, 2024
    Applicant: Leum Engineering, Inc. d/b/a Dockzilla Co.
    Inventors: Grant Leum, Eric Demerath
  • Publication number: 20240334586
    Abstract: A package structure is provided. The package structure includes an electronic component, a heat dissipating element, a thermal interfacing unit, and a confining structure. The electronic component has an upper surface. The heat dissipating element is over the upper surface of the electronic component. The thermal interfacing unit is between the upper surface of the electronic component and the heat dissipating element. The thermal interfacing unit includes a thermal interfacing material (TIM). The TIM is attached to the confining structure by capillary force.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: An-Hsuan HSU, Hung-Hsien HUANG, Chin-Li KAO
  • Publication number: 20240329344
    Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN, Chang Chi LEE, Hung-Chun KUO, Chun-Yen TING
  • Publication number: 20240329300
    Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 3, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-I WU, Chun-Yen TING, Hung-Chun KUO, Jung Jui KANG, Chiu-Wen LEE, Shih-Yuan SUN
  • Patent number: D1048858
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: October 29, 2024
    Assignee: OTR Wheel Engineering, Inc.
    Inventor: Leonard Austin Hensel
  • Patent number: D1050188
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: November 5, 2024
    Assignee: Fleece Performance Engineering, Inc.
    Inventors: Brayden Fleece, Matthew Miller