Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

Abstract: A captive leadscrew-type linear actuator assembly has a motor whose rotor has a rearward extending hollow bore shaft. An external nut assembly fixed to the bore shaft to rotate with rotor engages a lead screw. An anti-rotation radial support plate attaches to a front of the motor with a non-circular hole that prevents rotation of a rod or piston attached to the lead screw. Accordingly, torque applied by the rotor through the nut to the lead screw is converted into linear motion wherein the rod or piston passes through the hole. Replaceable external components lead to greater design flexibility together with improved motion accuracy and durability.

Abstract: A system and method for detecting dynamic strain of a housing. The system includes an optical fiber linearly affixed along a surface of a length of the housing and an interrogator comprising a laser source and a photodetector. The optical fiber comprises at least one pair of fiber Bragg gratings (FBGs) tuned to reflect substantially identical wavelengths with a segment of the optical fiber extending between the FBGs. The segment of the optical fiber is linearly affixed along the surface of the housing. The interrogator is configured to perform interferometry by shining laser light along the optical fiber and detecting light reflected by the FBGs. The interrogator outputs dynamic strain measurements based on interferometry performed on the reflected light.

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

Abstract: A curable composition used to produce a polyurethane foam comprises an isocyanate group-containing urethane pre-polymer (I) having an oxyalkylene ether skeleton and no siloxane skeleton, and an isocyanate group-containing urethane pre-polymer (II) having a siloxane skeleton and an oxyalkylene ether skeleton.

Abstract: A gas shield positionable over open parisons in a Blow/Fill/Seal machine prior to container forming, filling and sealing minimizes likelihood of particulate contamination of open parisons while the open parisons are transported to a container forming, filling and sealing station.

Abstract: An apparatus and methods are provided for a magnetic cover for an air filtration system for an internal combustion engine. The air filtration system includes a housing that has an interior that receives an air filter. A mount portion comprising the housing supports the air filter. The magnetic cover encloses the interior of the housing. An edge portion surrounding an opening in the housing forms an airtight connection with an edge portion of the magnetic cover. The edge portion of the housing includes a number of magnets that attach to a similar number of magnets in the edge portion of the magnetic cover to establish the airtight connection. A seal provides an airtight connection between the housing and the magnetic cover. The housing and the magnetic cover are configured for hand removal of the magnetic cover from the housing.

Abstract: An apparatus may comprise a base member being defined by a rectangular aperture configured to receive and engage an automobile intake box, the base member being further defined by a perimeter surrounding the rectangular aperture and having at least one fastener or aperture configured to receive a fastener dimensioned to avoid disturbing the automobile intake box; a gooseneck member fixedly attached to the base member, the gooseneck member having a first end opening and a second end opening, the gooseneck member having an interior cavity configured to direct air into the automobile intake box from the second end opening to the first end opening through the interior cavity; and an interchangeable bell housing removably secured to the second end opening of the gooseneck member, the interchangeable bell housing having a frustoconical shaped cross section on at least one plane.

Abstract: An example of an apparatus is provided. The apparatus includes a power sensor to measure a power used to emit light. In addition, the apparatus includes a light source controller to control a light source to change an intensity of the light emitted by the light source. Furthermore, the apparatus includes a boundary detector to detect a room boundary. The apparatus also includes a device sensor to determine a position of a proximate device. The apparatus further includes a communications interface to communicate with the proximate device to transmit measured data to the proximate device and to receive device data from the proximate device. Also, the apparatus includes a processor to calculate a lighting power density based on the proximate device data and the measured data. The lighting power density is to be used by the light source controller to adjust the power used to emit the light.

Abstract: An electronic device is provided. The electronic device includes a package structure and a power regulating element. The package structure includes an electronic component, a plurality of first conductive structures, and an encapsulant. The plurality of first conductive structures are connected to the electronic component. The encapsulant encapsulates the electronic component and exposes a portion of the plurality of first conductive structures. The power regulating component includes a plurality of second conductive structures directly bonded with the plurality of first conductive structures and configured to provide the electronic component with a power signal.

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a second electronic component, and a circuit structure. The circuit structure is supported by the first electronic component and the second electronic component. The circuit structure electrically connects the first electronic component to the second electronic component and is configured to provide the first electronic component and the second electronic component with a power.

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

Abstract: A sound attenuating engine exhaust system and methods are provided for directing exhaust gases away from an internal combustion engine of a vehicle and attenuating undesirable exhaust sounds during engine operation. The sound attenuating engine exhaust system comprises an exhaust inlet configured to receive exhaust gases from the internal combustion engine. A first resonator coupled with the exhaust inlet is configured to dampen at least one frequency of exhaust sound waves by way of destructive wave interference. The first resonator includes an exhaust outlet for directing the exhaust gases out of the first resonator. A second resonator is coupled with the first resonator and configured to dampen one or more frequencies of exhaust sound waves by way of a combination of destructive wave interference and Helmholtz resonance. Hangers facilitate attaching the sound attenuating engine exhaust system to an undercarriage of the vehicle.

Abstract: A package structure is provided. The package structure includes an electronic component, an encapsulant, a first conductive pillar, a first dielectric layer. The electronic component has an active surface. The encapsulant encapsulates the electronic component and exposes the active surface of the electronic component. The first conductive pillar is over the active surface of the electronic component, wherein an upper surface of the first conductive pillar includes a concave portion. The first dielectric layer is over the encapsulant and the active surface of the electronic component, wherein the first dielectric layer defines an opening exposing the concave portion of the first conductive pillar.

Abstract: A package structure is provided. The package structure includes a wiring structure, a first element, and a plurality of first wires. The wiring structure has a first recess recessed from a first surface of the wiring structure. The first element is disposed over the first surface of the wiring structure. The first wires are disposed in the first recess and extending in a direction from the wiring structure to the first element. The first wires are configured to reduce an inclination of the first element with respect to the first surface of the wiring structure.

Abstract: A package structure is provided. The package structure includes a substrate, a wiring structure, and a wire bundle structure. The wiring structure is over the substrate. The wire bundle structure is between the wiring structure and the substrate. The wire bundle structure includes a first wire bundle extending from the substrate and a second wire bundle extending from the wiring structure and contacting the first nanowire bundle. The wire bundle structure is configured to reduce a variation in a distance of a gap between the substrate and the wiring structure.

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component and an optical interposer. The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.