Patents Assigned to .Engineering, Inc.
  • Patent number: 11927158
    Abstract: An apparatus and methods are provided for an air cleaner to be mounted onto an air inlet of an internal combustion engine. The air cleaner comprises an air filter that includes a filter medium disposed between a curved base and a cover. The curved base provides an interface between the air filter and the air inlet, and comprises a shape that provides clearance between the curved base and an electric choke installed onto a carburetor comprising the air inlet. The cover secures the air filter and the curved base to the air inlet such that an airstream is drawn through the filter medium and is conducted into the air inlet. A raised portion of the cover is configured to cooperate with the curved base to ensure a desired volume of the airstream is available to the air inlet at substantially all engine speeds.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: March 12, 2024
    Assignee: K&N Engineering, Inc.
    Inventors: Steve E. Williams, Jere James Wall
  • Patent number: 11929357
    Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: March 12, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jr-Wei Lin, Mei-Ju Lu
  • Patent number: 11929705
    Abstract: Systems and methods for providing and controlling solar panel arrays are provided. The solar panel array may include one or more articulating joints that may provide variability in the arrangement of solar panels, which may allow the solar panel array to be distributed over varying types of underlying surfaces. The articulating joints may allow orientations of solar panels to be different relative to one another. The articulating joints may convey rotational force across the joints, so that a rotational force used to drive a first solar panel may also be conveyed across the joint and used to drive a second solar panel. The controls system may include row-specific semi-autonomous, or autonomous, controllers as well as controllers to interface with multiple rows. The controllers may include sensors to measure system power generation and basic operations aspects of the solar field to directly measure, or infer, module shading within the solar field.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: March 12, 2024
    Assignee: Nevados Engineering, Inc.
    Inventors: Yezin Taha, Norman Xiao
  • Publication number: 20240076145
    Abstract: An apparatus and related method for a dock housing for a pre-existing loading dock. The dock housing includes a base with top and bottom surfaces and front, back and opposed sidewalls. The front wall has integral fork pockets for interaction with forks on a fork truck for movement of the base into a desired location and the top surface has an opening to receive a dock leveler into such opening. Also included is a modular frame mounted onto the base in sections, the sections including a frame-front wall, opposed frame-sidewalls and a frame-top wall, the frame-front wall having a trailer-receiving opening to receive a trailer, the frame-sidewalls including a slotted-base attachment for securement of the base and sidewalls together. The dock housing is formed by securing the frame-sidewalls to a wall of a pre-existing building as well as securing the base, the frame-front wall and the frame-top wall together.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 7, 2024
    Applicant: Leum Engineering, Inc. d/b/a Dockzilla Co.
    Inventors: Grant Leum, Eric Demerath, Nick Benz
  • Publication number: 20240076146
    Abstract: A modular loading dock with a mobile base which includes two, opposing, adjustable leg members and top and bottom surfaces, the top surface having an opening to receive a dock leveler into such opening, the dock leveler includes a lower end and an upper end, the upper end abuts a preexisting structure and the lower end includes a lower edge having a lip, the lip is able to be activated between an extended/engaged position to contact a truck bed and a retracted/disengaged position. The mobile base also includes a housing with a modular frame mounted onto the base in sections and can receive a back end of a vehicle. The modular frame has a tensioned vinyl covering. The modular loading dock can also include an extension portion with a covering.
    Type: Application
    Filed: April 4, 2023
    Publication date: March 7, 2024
    Applicant: Leum Engineering, Inc. d/b/a Dockzilla Co.
    Inventors: Grant Leum, Eric Demerath
  • Publication number: 20240076147
    Abstract: A modular loading dock with a mobile base which includes two, opposing, adjustable leg members and top and bottom surfaces, the top surface having an opening to receive a dock leveler into such opening, the dock leveler includes a lower end and an upper end, the upper end abuts a preexisting structure and the lower end includes a lower edge having a lip, the lip is able to be activated between an extended/engaged position to contact a truck bed and a retracted/disengaged position. The mobile base also includes a housing with a modular frame mounted onto the base in sections, the sections include a frame-front wall, opposed frame-sidewalls and a frame-top wall, the frame-front wall has a vehicle-receiving opening to receive a back end of a vehicle.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 7, 2024
    Applicant: Leum Engineering, Inc. d/b/a Dockzilla Co.
    Inventors: Grant Leum, Eric Demerath
  • Patent number: 11923328
    Abstract: A semiconductor device includes a semiconductor die having a first surface and a second surface opposite to the first surface, a plurality of first real conductive pillars in a first region on the first surface, and a plurality of supporters in a second region adjacent to the first region. An area density of the plurality of supporters in the second region is in a range of from about 50% to about 100% to an area density of the plurality of first real conductive pillars in the first region. A method for manufacturing a semiconductor package including the semiconductor device is also disclosed in the present disclosure.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: March 5, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Hsin He Huang
  • Patent number: 11923285
    Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: March 5, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Po-Jen Cheng, Chien-Fan Chen
  • Patent number: 11923825
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a carrier, an element, and a first electronic component. The element is disposed on the carrier. The first electronic component is disposed above the element. The element is configured to adjust a first bandwidth of a first signal transmitted from the first electronic component.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 5, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yuan Kung, Meng-Wei Hsieh
  • Patent number: 11923274
    Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 5, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Patent number: 11920028
    Abstract: Disclosed is a curable composition comprising an elastomer (A), an epoxy resin (B) and a latent curing agent (C), wherein the latent curing agent (C) comprises a combination of two or more latent curing agents.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: March 5, 2024
    Assignee: Sunstar Engineering Inc.
    Inventors: Toshio Kobayashi, Takaaki Inoue
  • Publication number: 20240072413
    Abstract: An electronic device is provided. The electronic device includes an antenna array including a plurality of antenna patterns collectively configured to provide a scan-angle coverage. Each of the antenna patterns includes a curved surface.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yu HO, Meng-Wei HSIEH, Chih-Pin HUNG
  • Publication number: 20240071945
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a first electronic component, a second electronic component and a conductive element. The conductive element includes a first portion and a second portion. The first portion is configured to block an electromagnetic interference between the first electronic component and the second electronic component. The second portion protrudes from the first portion and contacts a shielding layer.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Zhi-Yuan LIN
  • Patent number: 11916004
    Abstract: An electronic device is provided. The electronic device includes a first carrier having a first surface, an interposer disposed over the first surface of the first carrier, wherein the interposer has a first thickness and a second thickness in a direction substantially perpendicular to the first surface of the first carrier; and a plurality of electrical connections between the first carrier and the interposer and configured to compensate a difference between the first thickness and the second thickness of the interposer.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: February 27, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Ching-Feng Cheng
  • Patent number: 11913132
    Abstract: A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: February 27, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia Chun Hsu, Chin-Feng Wang
  • Patent number: 11911657
    Abstract: A pushup exercise device for various pushup exercises in the prone position on a platform with added resistance is provided. In an embodiment, the device includes a base platform in mechanical communication with a graspable member having a graspable portion. Furthermore, an attachment component is in mechanical communication with the graspable member. Additionally, an unobstructed passage provides a route through which a cable can be attached to the attachment component. In such embodiments, the user is allowed to perform exercises with the pushup exercise device by grasping the graspable portion of the graspable member.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 27, 2024
    Assignee: OK Engineering Inc.
    Inventors: Omar Ismail KashKash, Yousef Ismail KashKash
  • Patent number: 11914930
    Abstract: A method for implementing a modeling tool that generates optimized reduced kinetics models for given operating conditions and a numerical scheme to speed-up kinetics evaluation of turbulent-chemistry coupling during CFD simulations. The tool is capable of predicting ignition and flameholding phenomenon for most propulsion systems, including gas turbine applications. A lumped-parameterization based optimization scheme may generate multi-step quasi-global kinetics models using laminar flame speed as the target data. This scheme may be further extended to include optimization of emission predictions such as CO and NOx.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: February 27, 2024
    Assignee: COMBUSTION SCIENCE & ENGINEERING, INC.
    Inventors: Ponnuthurai Gokulakrishnan, Darin Viehe, Andrew Trettel, Michael S. Klassen
  • Publication number: 20240060463
    Abstract: An apparatus and a method are provided for an air intake assembly configured for use with Pro Stock vehicles comprising fuel injection equipped engines. The air intake assembly comprises an air inlet that includes a distal opening disposed in a forward direction at a front of the vehicle and configured to direct incident air into the air intake assembly. An air duct is joined with the air inlet by way of a first coupler configured to maintain an airtight seal between the air inlet and the air duct. A throttle body adapter is joined with the air duct by way of a second coupler configured to maintain an airtight seal therebetween. The throttle body adapter is configured to establish an airtight coupling between the air intake assembly and a throttle body of the engine, such that the incident air is directed into the throttle body.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Applicant: K&N Engineering, Inc.
    Inventor: Steve Williams
  • Patent number: D1017038
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: March 5, 2024
    Assignee: Concise Engineering, Inc.
    Inventors: Justin Bushko, Giuseppe Lombardo, Daniel Riveros
  • Patent number: D1017526
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: March 12, 2024
    Assignee: OTR Wheel Engineering, Inc.
    Inventor: Chris Strabley