Patents Assigned to Engineering
  • Patent number: 6914094
    Abstract: An article formed from a polyolefin resin blend reaction product that includes at least one propylene-based polyolefin-metal salt and at least one property-modifying agent. Optionally, the article includes a polyethylene-based polyolefin-metal salt, thermoplastic elastomer, such as a hydrogenated styrene-butadiene random copolymer or any other styrenic block copolymer, semi-crystalline polyolefin component, or the like, or combinations thereof. Such articles have enhanced scratch and mar resistance while still retaining acceptable impact toughness. Methods of preparing articles and the blends used to form such articles are also part of the invention.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: July 5, 2005
    Assignee: Solvay Engineered Polymers, Inc.
    Inventors: Rui-dong Ding, Satchit Srinivasan
  • Patent number: 6913785
    Abstract: A method of forming a wear-resistant reinforcing coating on a substrate, such as concrete, wood, metal or particulate. A reinforcing fiber mat is placed on the substrate and a liquid matrix material is mixed with small colored stones. The mixture of matrix material and stones is poured onto the mat, and the liquid wets the mat and contacts the substrate. After curing, a composite coating is formed with stones as the wearing surface. A membrane can be interposed between the substrate and the reinforcing coating to prevent adhesion and “starving” of the mat.
    Type: Grant
    Filed: November 29, 2003
    Date of Patent: July 5, 2005
    Assignee: Engineered Composite Systems, Inc.
    Inventor: Steven E. Morton
  • Publication number: 20050139970
    Abstract: A leadless semiconductor package mainly comprises a leadless lead-frame, a chip, a silver paste and a plurality of electrically conductive wires. The lead frame includes a chip paddle and a plurality of leads surrounding the chip paddle wherein the chip paddle has a cavity serving as a chip disposal area and a grounding area surrounding the cavity, and at least there is one recession formed on the grounding area. Besides, the chip is disposed in the cavity so that the back surface of the chip faces the chip paddle and attached onto the chip paddle via the silver paste. Moreover, the chip is electrically connected to the leads. As mentioned above, the grounding area has at least one recession formed therein, so the contact area of the leadless lead-frame with the encapsulation will be increased to enhance the attachment of the encapsulation to the leadless lead-frame.
    Type: Application
    Filed: June 28, 2004
    Publication date: June 30, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chao-Ming Tseng
  • Publication number: 20050139997
    Abstract: A chip assembly package mainly comprises a substrate, a chip, a plurality of electrically conductive wires, a flat heat spreader. The substrate comprises an upper surface having a chip disposal area and a bonding area surrounding the chip disposal area wherein the flat heat spreader is mounted on the upper surface and at least exposes the bonding area. The chip is disposed above the chip disposal area and mounted on the flat heat spreader. Moreover, the chip is electrically connected to the bonding area by the electrically conductive wires. Besides, an encapsulation is provided to encapsulate the chip, the flat heat spreader and the electrically conductive wires.
    Type: Application
    Filed: June 28, 2004
    Publication date: June 30, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Che-Ya Chou
  • Publication number: 20050142837
    Abstract: A method for forming an underfill layer on a bumped wafer is disclosed. A film is provided wherein the film includes a base layer, a removable layer and the underfill layer. The film is disposed on a bump wafer and then pressing the film under heating is performed to have the bumps of the wafer embedded in the underfill layer. Then, the removable layer with base film attached thereto is removed, so the underfill layer well encloses the bumps of the wafer and is easily separated from the base film layer and the removable layer without damaging the bumps formed on the wafer.
    Type: Application
    Filed: November 9, 2004
    Publication date: June 30, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pen Tsai, Kuo-Pin Yang, Wu-Chung Chiang
  • Publication number: 20050142696
    Abstract: A method for backside grinding a bumped wafer is disclosed. A wafer has a plurality of bumps formed on the active surface thereof. Prior to grinding the back surface of the wafer, a hot-melt adhesive layer is formed on the active surface of the wafer so as to be adhered to the active surface and cover the bumps. Also a grinding film is attached to the hot-melt adhesive layer. After grinding the back surface of the wafer, the grinding film is removed but the hot-melt adhesive layer is remained on the wafer for the following wafer-dicing step.
    Type: Application
    Filed: December 23, 2004
    Publication date: June 30, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yu-Pen Tsai
  • Patent number: 6911082
    Abstract: Multi-layered semiconductor nanoparticles having a very narrow grain-size distribution and exhibiting a spectrum having a narrow wavelength-width peak are prepared by a manufacturing method combining a monodisperse semiconductor nanoparticle manufacturing method and a multi-layer semiconductor nanoparticle preparation method. The nature of a solution of monodisperse semiconductor nanoparticles that is stabilized by a surface stabilizer is transformed between hydrophilic and lipophilic by substituting the surface stabilizer. The stabilized semiconductor nanoparticles are then shifted between an aqueous layer and an organic layer. The semiconductor nanoparticles are coated with multiple layers in the organic layer, and the organic layer is drawn off to recover the semiconductor nanoparticles therefrom.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: June 28, 2005
    Assignee: Hitachi Software Engineering Co., LTD
    Inventors: Keiichi Sato, Susumu Kuwabata
  • Patent number: 6910246
    Abstract: A novel furniture leg glide is disclosed for reducing a screeching sound made by a furniture leg being dragged across a floor. The furniture leg glide is formed from a hollow body portion having an end cap disposed thereon with a flexible coupling formed along the hollow body portion between first and second ends thereof. A piece of felt type material is bonded to the end cap and the flexible coupling permits the piece of felt type material to contact the floor when the furniture leg is angularly displaced in relation to the floor within a predetermined number of degrees. The flexible coupling flexes and compresses in relation to the angular movement of the furniture leg. In accordance with another embodiment of the invention a furniture leg glide is provided for attaching to a furniture leg having a swivel base furniture leg glide disposed thereon.
    Type: Grant
    Filed: August 22, 2004
    Date of Patent: June 28, 2005
    Assignee: Innovation Engineering Group
    Inventor: Pierre Desmarais
  • Patent number: 6910804
    Abstract: An RTD system includes multiple pluralities of RTDs and RTD bank assembly to which each plurality of RTDs are connected. Each RTD bank assembly includes a current source for the RTDs connected thereto, a multiplexer switching system for switching the current source successively between the RTDs, and a measurement function for measuring the voltage drop across the RTDs produced by the current source. The system includes a circuit for determining resistance of the RTD from the current applied thereto and the voltage drop there across. The system further includes a plurality of low pass filters associated, respectively, with each RTD, wherein the low pass filters are charged before the voltage measurement is made. The system includes a precharging arrangement where the low pass filter associated with the next RTD in a voltage sampling sequence is precharged, so that the delay between sampling of the voltage from the low pass filters associated with successive RTDs is significantly reduced.
    Type: Grant
    Filed: September 9, 2003
    Date of Patent: June 28, 2005
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Carl V. Mattoon, Travis L. Mooney
  • Patent number: 6911101
    Abstract: From a supply reel which is set in position at an ACF (Anisotropic Concuctive Film) feeding station, an ACF tape having an ACF laminated on one side of a liner tape is drawn out by an ACF bonding means. At least two reel mount members are provided on a reel stand at the ACF feeding station to mount two ACF tape supply reels concurrently thereon. The reel stand is connected to a switch means thereby to switch the two reel mount members either to an operating or tape supplying position or a standby position. As soon as an ACF tape from a supply reel in the operating position is consumed completely, a fresh supply reel in the standby position is switched into the operating position to continue the supply of the ACF tape.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: June 28, 2005
    Assignee: Hitachi High-Tech Electronics Engineering Co., Ltd.
    Inventors: Jun Onoshiro, Kenya Wada, Ichiyo Ando
  • Patent number: 6910693
    Abstract: A drawn down chuck for gripping the inner or outer diameter of a workpiece. The chuck includes rotatable jaws disposed in a chuck body. The rotatable jaws helically and then linearly retract into the chuck body to secure workpieces having a shaft and an enlarged offset such as a hub or flange proximate to the end of the shaft. Cam assemblies interact with the jaw rods to provide the helical and linear movement. The cam assemblies include a cam groove and a cam follower, wherein the cam groove has a linear and a helical segment. The cam follower is operatively engaged on the cam groove as the jaw rod moves between the extended and retracted position so that when the jaw rod is retracted it first moves helically and then axially.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: June 28, 2005
    Assignee: MP Tool & Engineering, Co.
    Inventors: Edmund J. Onyszkiewicz, Frederick J. Pifko, Longine V. Morawski
  • Patent number: 6910732
    Abstract: In a side body structure, a front reinforce is provided between a side body outer panel and a side body inner panel and also, a rear roof side reinforce is provided so as to couple the front reinforce to a rear pillar reinforce along the upper edge of an opening of a rear door, and vehicle body rigidity of the periphery of the opening of the rear door as well as the periphery of an opening of a front door is enhanced.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: June 28, 2005
    Assignees: Mitsubishi Jidosha Kogyo Kabushiki Kaisha, Mitsubishi Jidosha Engineering Kabushiki Kaisha
    Inventors: Shinsuke Miyoshi, Satoshi Arakawa, Takashi Yakata, Keishi Goto, Takashi Kikuchi
  • Patent number: 6911821
    Abstract: A gradient coil structure for use in MRI apparatus has a main gradient coil 20 and a shielding coil 21, a portion of the shielding coil being disposed outwardly from the main coil. The coils are configured so that in a peripheral region 25 relative to the image region 22 the are almost coincident and the coils extend forwardly at an angle to the remainder of the main coil so that the main coil appears concave from the imaging region 22. This arrangement provides improved shielding efficiency.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: June 28, 2005
    Assignee: Tesla Engineering Ltd.
    Inventor: Frederick Thomas David Goldie
  • Patent number: 6910522
    Abstract: A system and method for heat treating castings and removing sand cores therefrom. The castings are initially located in indexed positions with their x, y, and z coordinates known. The castings are passed through a heat treatment station typically having a series of nozzles mounted in preset positions corresponding to the known indexed positions of the castings passing through the heat treatment station. The nozzles apply fluid to the castings for heat treating the castings and degrading the sand cores for removal from the castings.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: June 28, 2005
    Assignee: Consolidated Engineering Company, Inc.
    Inventors: Scott P. Crafton, Paul M. Crafton, Volker R. Knobloch, James L. Lewis, Jr., Ian French, Franz Ruegg
  • Publication number: 20050132814
    Abstract: The object of the present invention is to propose an etch channel sealing structure characterized by excellent impermeability to moisture and resistance to temporal change of the diaphragm in the pressure sensor produced according to the sacrificial layer etching technique, and to provide a pressure sensor characterized by excellent productivity and durability. After a very small gap is formed by the sacrificial layer etching technique, silicon oxide film is deposited by the CVD technique or the like, there by sealing the etch channel. Further, impermeable thin film of polysilicon or the like is formed to cover the oxide film. This allows an etch channel sealing structure to be simplified in the pressure sensor produced according to the sacrificial layer etching technique, and prevents entry of moisture into the cavity, thereby improving moisture resistance. Moreover, sealing material with small film stress reduces temporal deformation of the diaphragm.
    Type: Application
    Filed: February 4, 2005
    Publication date: June 23, 2005
    Applicants: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Shinya Satou, Satoshi Shimada, Atsuo Watanabe, Yasuo Onose, Seiji Kuryu, Atsushi Miyazaki, Junichi Horie, Naohiro Momma
  • Publication number: 20050135881
    Abstract: A pile based braced caisson structural support device includes a number of legs. These legs are configured in a teepee type configuration such that the footprint of the base is larger than the footprint of the opposing end. This structural support can be used as a base for an offshore drilling platform in that the support reduces the lateral forces on the support caused by wave action.
    Type: Application
    Filed: February 11, 2005
    Publication date: June 23, 2005
    Applicant: Keystone Engineering, Inc.
    Inventors: Rudolpha Hall, Ralph Shaw
  • Patent number: 6907967
    Abstract: An actuator including a housing accommodating a screw mechanism and a drive including a motor. The screw mechanism includes a nut and a screw, one of which is rotatably supported with respect to the housing. Upon relative rotation of the nut and the screw, linear movement of one of the nut and the screw is obtained. At least a rotatable component of the drive, for example, the rotor of the motor, is rotatably supported on the screw which is rotatably supported with respect to the housing.
    Type: Grant
    Filed: January 27, 2000
    Date of Patent: June 21, 2005
    Assignee: SKF Engineering & Research Centre B.V.
    Inventors: Hendrikus Jan Kapaan, Johannes Albertus Van Winden, Jacobus Zwarts, Thomas Wilhelm Fucks
  • Patent number: 6907946
    Abstract: A direct braking of a drive shaft for a tracked vehicle that moves on rotating track(s). A disc brake is connected to the same drive shaft that has sprocket(s) for engaging the track(s). Upon activation by a vehicle driver, opposing pistons engage the disc to retard rotation of the drive shaft. This, in turn, causes slower rotation of the tracks and slower movement of the vehicle.
    Type: Grant
    Filed: November 11, 2003
    Date of Patent: June 21, 2005
    Assignee: Wilwood Engineering
    Inventors: Shawn D. Buckley, Kenneth C. Ramey, William H. Wood
  • Patent number: 6907891
    Abstract: A radioactive substance decontamination method and apparatus which decontaminates a metal member contaminated by radioactive substance in a short period of time. This apparatus has (1) multiple reducing decontamination tanks having different radiation control values; (2) a carrier for immersing the metal member into the multiple reducing decontamination tanks and a washing tank; (3) a tube for transferring into the second reducing decontamination tank the reducing decontamination agent in the first reducing decontamination tank; (4) a reducing agent decomposer for decomposing a component contained in the reducing decontamination agent of the reducing decontamination tank where the radiation control value is the highest out of the reducing decontamination tanks connected by the tube; and (5) a washing tank for washing the reducing decontamination agent deposited on the decontaminated metal member.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: June 21, 2005
    Assignees: Hitachi, Ltd., Hitachi Engineering Co., Ltd.
    Inventors: Kazumi Anazawa, Motoaki Sakashita, Makoto Nagase
  • Patent number: 6908050
    Abstract: A press-machined fuel induction pipe 40, a hollow tubular type of fixed core 1 with a flange at its upper end, and a nozzle holder 18 that was press-machined into a slender tubular shape and has an orifice plate equipped with a valve seat at the lower end of the nozzle holder, are connected by welding. The upper inner surface of nozzle holder 18 and the outer surface of fixed core 1 are welded after being press-fit. A movable core 14 and a valve body 16 are connected to the welded assembly via a point 15 having a spring function. On the outer surface of nozzle holder 18 is provided an electromagnetic coil 2, the outside of which is provided with a tubular yoke 4 whose upper end is connected by welding to the flange 1a of fixed core 1 and whose lower end is press-fit on the outer surface of nozzle holder 18.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: June 21, 2005
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Atsushi Sekine, Kiyotaka Ogura, Ryuya Ando, Makoto Yamakado, Noriyuki Maekawa