Patents Assigned to Engineering
  • Patent number: 6925363
    Abstract: The present invention relates to a method and controller for controlling power allocation in an overdemand situation of at least a passenger loading bridge. A requested amount of power and an amount of power available are determined. The amount of power available and less than the amount of power required is then apportioned on a prioritized basis amongst systems of the at least a passenger loading bridge demanding power to result in a load of the at least a passenger loading bridge requiring no more than the power available and to provide sufficient power to account for one of minimum requirements, operational requirements and ideal requirements for each system based on an operational mode of the at least a passenger loading bridge. The amount of power for provision to each system is determined in dependence upon a priority of the system for the operation of the at least a passenger loading bridge in a predetermined mode of operation.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: August 2, 2005
    Assignee: DEW Engineering and Development Limited
    Inventor: Neil Hutton
  • Patent number: 6923933
    Abstract: A take-out device for removing blow molded products from molds in a high speed rotary blow molding machine includes a plurality of transfer heads which are moved into and out of an ejection station to clamp logs or bottles stripped from the molds and move the logs or bottles away from the station toward a takeaway conveyor. The bottles or logs are turned ninety degrees before placement on a takeaway conveyor.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: August 2, 2005
    Assignee: Graham Engineering Corp.
    Inventors: David N. Fiorani, John M. Mathy, Jr.
  • Patent number: 6924326
    Abstract: A method treats ordinary filters with an electrostatic material that will turn any filter into a passive electrostatic filter. A formulation is sprayed or otherwise applied onto the filter to increase the filter's ability to effectively reduce indoor air particulates and improve indoor air quality. The formulation includes a water-soluble dielectric formulation and can also be combined with a biocide.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: August 2, 2005
    Assignee: Mainstream Engineering Corporation
    Inventors: John A. Meyer, Robert P. Scaringe
  • Patent number: 6923949
    Abstract: Pure phase, high activity ZSM-48 crystals having a SiO2/Al2O3 ratio of less than about 150/1, substantially free from ZSM-50 and Kenyaite, and fibrous morphology crystals. The crystals may further have a specific cross morphology. A method for making such crystals using heterostructural, zeolite seeds, other than ZSM-48 and ZSM-50 seeds.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: August 2, 2005
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Wenyih F. Lai, Richard B. Saunders, Machteld M. Mertens, Johannes P. Verduijn
  • Patent number: 6923097
    Abstract: Pliers for advantageously removing small screws are provided. The pliers have a pair of upper and lower arms which are pivotally supported by a shaft. Front end tips of the upper and lower arms are respectively provided with upper and lower recessed engagement parts between right and left edges, and the engagement parts vertically face each other. The upper and lower engagement parts are inclined in a manner such that they gradually become separated vertically from each other toward the rear when the jaws are closed. An inner bottom included in each of engagement parts is provided with plural projected and depressed streams extending in a back and forth direction.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: August 2, 2005
    Assignee: Kabushiki Kaisha Engineer
    Inventor: Mitsuhiro Takasaki
  • Patent number: 6924557
    Abstract: The present invention discloses a semiconductor package, wherein several chips can be packed thereinto. The present invention uses under bump metallurgies or bonding wires to connect the associated circuits of at least two chips in serial or in parallel. At least one slicing path is located between the at least two chips and a substrate is provided with an upper surface and a lower surface in which the upper surface is flip-chip bonded with the at least two chips.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: August 2, 2005
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Jen-Kuang Fang
  • Patent number: 6923049
    Abstract: A method of testing a friction component for a transmission that has first and second parts. The first part of the friction component is attached to a drive shaft and the second part is attached to a grounding element. The first part of the friction component is rotated until the drive shaft and the first part of the friction component rotate at a target sliding speed Vtarget. An actuation force is applied to the friction component at a time t0. Operation of the motor drive is continued to maintain the speed of rotation of the drive shaft at Vtarget until a predetermined level of engagement torque Tth is obtained. The motor torque is then reduced to a predetermined level Tm. The sliding speed of the drive shaft is then decreased and the test is terminated when the sliding speed falls to zero.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: August 2, 2005
    Assignee: Link Engineering Company
    Inventors: Yuji Fujii, Ted Duane Snyder, Gregory Michael Pietron, William Emil Tobler
  • Patent number: 6922942
    Abstract: A vine wire support post molded as integral unit from plastics has an elongate tapered supporting portion having upper end and lower end, a wire attachment provided on the supporting portion, a peg for holding support post in ground joined to lower end of supporting portion, a foot at the join between peg and supporting portion. The supporting portion is flexible and has variable sectional strength decreasing over a length of supporting portion from a position of higher sectional strength nearer lower end to a position of lower sectional strength nearer upper end.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: August 2, 2005
    Assignee: Vineyard Infrastracture & New Engineering Technologies Pty, Ltd.
    Inventor: Ricardo Michele Stefanutti
  • Patent number: 6924868
    Abstract: A liquid crystal display device comprises a liquid crystal display panel and a semiconductor integrated circuit for driving and controlling the liquid crystal display panel. The number of input/output wires connected to I/O terminals (bonding pads) of the semiconductor integrated circuit is reduced so as to simplify wiring patterns of the I/O wires, whereby degrees of freedom in arranging the I/O wiring patterns are enhanced. The panel has a pair of insulating substrate, and the semiconductor integrated circuit is mounted on one of the paired substrates. The semiconductor integrated circuit has a mode terminal which is fixed to a power supply potential or to a reference potential during operation of the integrated circuit, and power supply dummy terminals connected to the power supply potential or reference potential inside the semiconductor integrated circuit. The wiring patterns formed on the paired insulating substrates connect the mode terminal to the power supply dummy terminals.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: August 2, 2005
    Assignees: Renesas Technology Corp., Hitachi Device Engineering Co., Ltd.
    Inventors: Kazuhisa Higuchi, Yoshikazu Yokota, Kimihiko Sugiyama
  • Patent number: 6923263
    Abstract: An apparatus for forming a plug in a casing includes a body of plug material and a carrier for insertion into a casing. The carrier supports the body of plug material. The carrier includes a mandrel and at least two circular flanges spaced apart along the mandrel. The carrier also includes a heater for heating the mandrel. The mandrel is heated to a temperature above the melting point of the material and the plug material slumps into the casing between the at least two circular flanges. The at least two circular flanges force the expanded solidifying plug material against the casing which aids the transfer of heat between the mandrel and the plug material, and resists creep of the solidified material along the casing.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: August 2, 2005
    Assignee: Rawwater Engineering Company, Limited
    Inventors: Robert David Eden, Robert Henry Eden
  • Patent number: 6924782
    Abstract: A liquid crystal display device has a semiconductor integrated circuit capable of outputting a voltage equal to or higher than the source-drain withstand voltage of a component transistor. A switching circuit has first conducting-type first and second transistors connected in series between a first input terminal and a common output terminal and second conducting-type third and fourth transistors connected between a second input terminal and the common output terminal and a switching control circuit for controlling the switching circuit. The switching control circuit applies first and second bias voltages for turning on the second and fourth transistors to the gate electrodes of the second and fourth transistors, and applies a control voltage for selectively turning on/off the first or third transistor to the gate electrodes of the first and third transistors.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: August 2, 2005
    Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.
    Inventors: Takahiro Fujioka, Kazunari Kurokawa, Hiroshi Katayanagi, Mitsuru Goto, Yukihide Ode, Akira Ogura, Kentaro Agata
  • Patent number: 6925361
    Abstract: A system that couples distributed power generators together as a collective unit for the purposes of selling or purchasing energy from the electrical power grid. The apparatus includes a charge/discharge controller and an adaptive controller. The charge/discharge controller transfers energy generated by the plurality of distributed power generators to the power grid. The adaptive controller directs when the charge/discharge controller transfers energy generated by at least one of the plurality of distributed power generators to the electrical grid.
    Type: Grant
    Filed: October 28, 2000
    Date of Patent: August 2, 2005
    Assignee: Orion Engineering Corp.
    Inventor: Herbert James Sinnock
  • Publication number: 20050163801
    Abstract: A novel composition and health food having a good pharmacological activity and which can be readily absorbed through an alimentary canal are provided. The composition induced apoptosis of cells and includes an agaricus extract. The composition may further comprise a pharmaceutically acceptable carrier. Typically, the cells are cancer cells. The composition may further include a differentiation inductionagent. Preferably, the differentiation induction agent is a vitamin A derivative. The vitamin A derivative may be tretinoin. The agaricus extract may include a main fraction eluted chromatographically of a molecular weight of 100 to 2000, which is obtained by the steps of extraction with hot water from a fruiting body of agaricus, dialyzing the extract and performing a,chromatography process on the dialyzate.
    Type: Application
    Filed: December 16, 2002
    Publication date: July 28, 2005
    Applicants: Kyowa Engineering Co., Ltd., Sundory Co., Ltd.
    Inventor: Takeshi Mori
  • Publication number: 20050162029
    Abstract: A magnetic gap is provided between a permanent magnet of a rotor and an auxiliary magnet pole portion which is arranged adjacent to the permanent magnet in a peripheral direction. A gradual change in a magnetic flux density distribution of a surface of the rotor is obtained and a cogging torque and a torque pulsation are restrained. By obtaining a reluctance torque according to the auxiliary magnetic pole, a permanent magnet electric rotating machine in which the cogging torque and the torque pulsation are restrained can be obtained and further an electromotive vehicle having the permanent magnet electric rotating machine can be provided.
    Type: Application
    Filed: March 17, 2005
    Publication date: July 28, 2005
    Applicants: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Fumio Tajima, Yutaka Matsunobu, Shouichi Kawamata, Suetaro Shibukawa, Osamu Koizumi, Keiji Oda
  • Patent number: 6921968
    Abstract: A stacked flip-chip package comprises a substrate having an opening, a back-to-face chip module, and an encapsulant. The back-to-face chip module is attached to the substrate and encapsulated by the encapsulant. The back-to-face chip module includes a first chip and a second chip. The first chip has a first active surface and a first back surface. Redistributed traces are formed on the first back surface. The second chip is flip-chip mounted on the first back surface of the first chip and electrically connected to the redistributed traces. A plurality of bumps connect the redistributed traces to the top surface of the substrate. Thus the second chip can be accommodated inside the opening and the redistributed traces are electrically connected to the second chip and the substrate so as to achieve fine pitch flip-chip mounting and improve the electrical performance and heat dissipation efficiency for the back-to-face chip module.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: July 26, 2005
    Assignee: Advance Semiconductor Engineering, Inc.
    Inventor: Chih-Ming Chung
  • Patent number: 6921189
    Abstract: There is disclosed a barrel mixer (11) comprising a support (12) for a rotary mixer barrel (13), including a tipping arrangement (14) for said barrel (13) limiting tipping between a mixing position in which the barrel (13) is angled so as to retain its contents and a tipping position in which the barrel (13) is angled so that its contents are poured out, a motor (15) and transmission (16) mounted on said support (12) for rotating the barrel including step-down gearing between the motor (15) and the barrel (13), the motor (15) and gearing (33) tipping with the barrel (13), the motor shaft (15b) being, at an intermediate position between mixing and tipping positions of the barrel (13), vertical, and the motor (15) being of a type having a mounting plate (31) surrounding the motor shaft (15b).
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: July 26, 2005
    Assignee: Belle Engineering (Sheen) Limited
    Inventor: Ronald Samuel Blackhurst
  • Patent number: 6921716
    Abstract: A wafer bumping process is disclosed. A wafer having a plurality of bonding pads formed thereon is provided. A first under bump metallurgy layer is formed to cover the bonding pads. A first patterned photoresist layer having a plurality of first openings is formed on the first under bump metallurgy layer, wherein a portion of the first under bump metallurgy layer is exposed within the first openings. A second under bump metallurgy layer is formed within the first openings, wherein the second under bump metallurgy layer is much thicker than the first under bump metallurgy layer. A second patterned photoresist layer having a plurality of second openings is formed on the first patterned photoresist layer, wherein the second openings being larger than the first openings.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: July 26, 2005
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Min-Lung Huang, Chi-Long Tsai, Chao-Fu Weng, Ching-Huei Su
  • Patent number: 6921981
    Abstract: A BGA package comprises a chip with an array pad design disposed on the top surface of a substrate. The chip has a plurality of bonding pads located about the periphery thereof. The bonding pads of the chip are positioned in three rows, an inner row, a middle row, and an outer row along the sides of the chip. All of the power supply pads and ground pads are adjacent to one another and designed in the outer row of the bonding pads, and the I/O pads are designed in the outer row, the middle row and the inner row of the bonding pads. The outer row, middle row, and the inner row of the bonding pads are electrically connected to the substrate through three tiers of bonding wires with different loop height, respectively.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: July 26, 2005
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Yun Hsiang Tien
  • Patent number: 6921515
    Abstract: In a chemical decontamination apparatus, a catalyst decomposition column in an upstream side of an ion exchange resin column and a hydrogen peroxide injection apparatus in a further upstream side, reduce the amount of waste products caused by a chemical decontaminating agent where a mixed decontaminating agent for a composition trapped in a cation resin column and for a composition trapped in an anion exchange resin are used for the chemical decontaminating agent, selectively decompose the composition trapped in the cation resin column in an inlet side of a cleaning apparatus when radioactive nuclides in the decontaminating agent are cleansed using the cation resin column during decontamination, and decompose both compositions after completion of the decontamination. The chemical decontamination thus selectively decomposes the chemical decontaminating agent, which is a component of the load to the cation resin column.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: July 26, 2005
    Assignees: Hitachi, Ltd., Kurita Engineering Co., Ltd.
    Inventors: Makoto Nagase, Naohito Uetake, Kazushige Ishida, Fumito Nakamura, Kazumi Anazawa, Tadashi Tamagawa, Hiroo Yoshikawa
  • Patent number: D507705
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: July 26, 2005
    Assignee: Merrick Engineering, Inc.
    Inventors: Abraham Abdi, Muna Abdi, Terry Lee Oster, Charles L. Coulter