Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
Type:
Grant
Filed:
April 18, 2008
Date of Patent:
June 3, 2014
Assignee:
Enthone Inc.
Inventors:
Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, Jr., Cai Wang
Abstract: The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions.
Abstract: A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.
Type:
Application
Filed:
January 26, 2012
Publication date:
May 1, 2014
Applicant:
ENTHONE INC.
Inventors:
Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, JR., Cai Wang, Xuan Lin, Theodore Antonellis
Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.
Type:
Grant
Filed:
July 5, 2011
Date of Patent:
April 22, 2014
Assignee:
Enthone Inc.
Inventors:
Joseph A. Abys, Shenliang Sun, Theodore Antonellis
Abstract: A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a quaternized pyridinium salt compound for leveling.
Type:
Application
Filed:
December 17, 2013
Publication date:
April 17, 2014
Applicant:
ENTHONE INC.
Inventors:
Vincent Paneccasio, JR., Richard Hurtubise, Xuan Lin, Paul Figura
Abstract: Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.
Type:
Application
Filed:
July 25, 2012
Publication date:
January 30, 2014
Applicant:
ENTHONE INC.
Inventors:
Abayomi I. OWEI, Joseph A. ABYS, Theodore ANTONELLIS, Eric WALCH
Abstract: A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device. The plating composition comprises an electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling.
Type:
Grant
Filed:
August 22, 2011
Date of Patent:
December 17, 2013
Assignee:
Enthone Inc.
Inventors:
Vincent Paneccasio, Jr., Richard Hurtubise, Xuan Lin, Paul Figura
Abstract: The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.
Type:
Application
Filed:
March 21, 2011
Publication date:
November 28, 2013
Applicant:
ENTHONE INC.
Inventors:
Andreas Königshofen, Danica Elbick, Markus Dahlhaus
Abstract: A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.
Type:
Application
Filed:
March 5, 2013
Publication date:
September 19, 2013
Applicant:
ENTHONE INC.
Inventors:
Vincent Paneccasio, JR., Xuan Lin, Richard Hurtubise, Qingyun Chen
Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature.
Type:
Application
Filed:
May 24, 2011
Publication date:
August 8, 2013
Applicant:
ENTHONE INC.
Inventors:
Thomas B. Richardson, Wenbo Shao, Xuan Lin, Cai Wang, Vincent Paneccasio, JR., Joseph A. Abys, Yun Zhang, Richard Hurtubise, Chen Wang
Abstract: Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
Abstract: The present invention relates to a corrosion-protective composition containing a wax, an unsubstituted or substituted polyaniline in a doped form and a liquid paraffin, and articles comprising the composition applied on a substrate. It also relates to a process for manufacturing the composition, wherein i) a first dispersion of a polyaniline in a doped form is prepared; and ii) the first dispersion of the polyaniline is combined with a wax component to sufficiently disperse the polyaniline therein, and to the use of the composition as a single layer coating for the protection against corrosion of a substrate in need thereof.
Type:
Application
Filed:
March 21, 2011
Publication date:
May 23, 2013
Applicants:
ENTHONE INC., NISSAN MOTOR CO., LTD.
Inventors:
Yasuhiro Kimura, Hideaki Yaegashi, Shinji Matsuda, Bernhard Wessling, Jörg Posdorfer, Monika Schwarzenberg, Stephan Nissen, Soichiro Sugawara
Abstract: The present invention relates to an electrolyte composition as well as a method for the deposition of zinc-nickel alloy layers on substrates, in particular cast iron or steel substrates. The electrolyte compositions according to the invention comprise aminoacetic acid. The alloy layers deposited from the electrolyte compositions according to the invention are corrosion resistant and bright and nearly have no internal tension.
Type:
Grant
Filed:
July 13, 2007
Date of Patent:
May 7, 2013
Assignee:
Enthone Inc.
Inventors:
Dieter Gollan, Gerard Patron, Thomas Helden, Andreas Heinz Kirchhof
Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
Type:
Application
Filed:
March 27, 2012
Publication date:
March 28, 2013
Applicant:
ENTHONE INC.
Inventors:
Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
Abstract: A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the via feature comprises an opening in the front surface of the substrate, a sidewall extending from the front surface of the substrate inward, and a bottom. The method comprises contacting the semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising (a) a source of copper ions and (b) a leveler compound, wherein the leveler compound is a reaction product of a dipyridyl compound and an alkylating agent; and supplying electrical current to the electrolytic deposition chemistry to deposit copper metal onto the bottom and sidewall of the via feature, thereby yielding a copper filled via feature.
Type:
Grant
Filed:
November 26, 2008
Date of Patent:
March 5, 2013
Assignee:
Enthone Inc.
Inventors:
Vincent Paneccasio, Jr., Xuan Lin, Richard Hurtubise, Qingyun Chen
Abstract: A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn(II) ions in an amount sufficient to provide an initial concentration of Mn(II) ions of at least about 0.
Abstract: Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
Type:
Grant
Filed:
July 29, 2004
Date of Patent:
January 8, 2013
Assignee:
Enthone Inc.
Inventors:
Yung-Herng Yau, Thomas B. Richardson, Joseph A. Abys, Karl F. Wengenroth, Anthony Fiore, Chen Xu, Chonglun Fan, John Fudala
Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.
Type:
Application
Filed:
June 4, 2012
Publication date:
November 29, 2012
Applicant:
ENTHONE INC.
Inventors:
Andreas Königshofen, Danica Elbick, Christoph Werner, Wolfgang Clauberg, Peter Pies, Andreas Möbius
Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.
Type:
Application
Filed:
July 24, 2012
Publication date:
November 15, 2012
Applicant:
ENTHONE INC.
Inventors:
Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu
Abstract: A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.
Type:
Application
Filed:
July 10, 2012
Publication date:
November 1, 2012
Applicant:
ENTHONE INC.
Inventors:
Joseph A. Abys, Shenliang Sun, Theodore Antonellis