Abstract: A data processing device and a method for performing a round of an N point Fast Fourier Transform are described. The round comprises computing N output operands on the basis of N input operands by applying a set of N/P radix-P butterflies to the N input operands, wherein P is greater or equal two and the input operands are representable as N/(M*P)?2 input operand matrices, wherein M is greater or equal one, each input operand matrix is a square matrix with M*P lines and M*P columns, and each column of each input operand matrix contains the input operands for M of said butterflies.

Abstract: Methods and systems are disclosed for imminent read failure detection based upon changes in error voltage windows for non-volatile memory (NVM) cells. In certain embodiments, data stored within an array of NVM cells is checked at a first time using a diagnostic mode and high/low read voltage sweeps to determine a first error voltage window where high/low uncorrectable errors are detected. Stored data is then checked at a second time using the diagnostic mode and high/low read voltage sweeps to determine a second error voltage window where high/low uncorrectable errors are detected. The difference between the error voltage windows are then compared against a voltage difference threshold value to determine whether or not to indicate an imminent read failure condition. An address sequencer, error correction code (ECC) logic, and a bias generator can be used to implement the imminent failure detection.

Abstract: A micro controller unit including an error indicator hardware module, the error indicator module being arranged to respond to event signals representative of internal and external fault and error events perturbing the micro controller unit function by registering in non-volatile memory a record of the nature of each of the events, wherein the record of the events is inaccessible to alteration.

Abstract: Methods and systems are disclosed for imminent read failure detection based upon unacceptable wear for non-volatile memory (NVM) cells. In certain embodiments, a first failure time is recorded when a first diagnostic mode detects an uncorrectable error within the NVM cell array using a first set of read voltage levels below and above a normal read voltage level. A second failure time is recorded when a second diagnostic mode detects an uncorrectable error within the NVM cell array using a second set of read voltage levels below and above a normal read voltage level. The first and second failure times are then compared against a threshold wear time value to determine whether or not an imminent read failure is indicated. The diagnostic modes can be run separately for erased NVM cell distributions and programmed NVM cell distributions to provide separate wear rate determinations.

Abstract: Methods and systems are disclosed for imminent read failure detection using high/low read voltage levels. In certain embodiments, data stored within an array of non-volatile memory (NVM) cells is checked using read voltage levels below and above a normal read voltage level. An imminent read failure is then indicated if errors are detected within the same address for both voltage checks. Further, data stored can be checked using read voltage levels that are incrementally decreased below and incrementally increased above a normal read voltage level. An imminent read failure is then indicated if read errors are detected within the same address for both voltage sweeps and if high/low read voltage levels triggering faults differ by less than a predetermined threshold value. An address sequencer, error correction code (ECC) logic, and a bias generator can be used to implement the imminent failure detection.

Abstract: First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.

Abstract: The invention provides an apparatus and method which allows identification of the system which provided images for each pixel of a touchscreen display which displays merged images of arbitrary shapes supplied from a plurality of systems. It further allows routing of user inputs to the appropriate system for further processing. Colour keying may be used to superimpose one image onto another. The invention finds particular application in the automotive field where images produced by an infotainment system may be merged with those produced by a mobile phone onto the in-vehicle display screen.

Abstract: Integrated circuit devices with counter-doped conductive gates. The devices have a semiconductor substrate that has a substrate surface. The devices also have a first well of a first conductivity type, a source of a second conductivity type, and a drain of the second conductivity type. A channel extends between the source and the drain. A conductive gate extends across the channel. The conductive gate includes a first gate region and a second gate region of the second conductivity type and a third gate region of the first conductivity type. The third gate region extends between the first and second gate regions. The devices further include a gate dielectric that extends between the conductive gate and the substrate and also include a silicide region in electrical communication with the first, second, and third gate regions. The methods include methods of manufacturing the devices.

Abstract: The embodiments described herein provide for the formation of circuit waveguide interfaces during a wafer-scale die packaging (WSDP) process. Specifically, during the packaging process singulated die are arranged on a wafer-like panel and covered with molding compound that will provide the bodies of the packages. A circuit waveguide interface is formed in the molding compound and subsequent metallization layers. This circuit waveguide interface can include an array of first conductors arranged in the molding compound, and a reflector interface and excitation element formed during metallization.

Abstract: A base station and method of synchronizing with a user equipment (UE) in a cell of the base station. The base station signals to the UE an indication relating to a subset of preambles chosen for synchronization with the cell from a set of preambles derivable from one or more given root sequences. The subset of preambles is chosen to provide an increased cell radius compared to the cell radius achievable if the specified full set of preambles for random access procedures was generated from the given root sequences using a given cyclic shift value.

Abstract: A method includes determining, for a first thread of execution, a first speculative decoded operands signal and determining, for a second thread of execution, a second speculative decoded operands signal. The method further includes determining, for the first thread of execution, a first constant and determining, for the second thread of execution, a second constant. The method further compares the first speculative decoded operands signal to the second speculative decoded operands signal and uses the first and second constant to detect a wordline collision for accessing the memory array.

Abstract: A bidirectional trench FET device includes a semiconductor substrate, a trench in the substrate extending vertically from the surface of the substrate, and a body region laterally adjacent the trench. A source region is disposed in the semiconductor substrate between the body region and the surface of the substrate. A dielectric layer is disposed over the surface and a body electrode is disposed over the dielectric layer. A body contact plug extends through the dielectric layer to interconnect the body region with the body electrode, and the body contact plug is electrically isolated from the source region. Two separate metal layers are implemented to make multiple body and source contacts electrically isolated from one another throughout the active area of the device. The low resistive path by the body contact plug and the separate metal layers enables suppression of bipolar snapback without losing bidirectional switching capability.

Abstract: A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron.

Abstract: A memory system includes a memory and a content addressable memory (CAM). The memory includes a plurality of address locations, wherein each address location configured to store data and one or more error correction bits corresponding to the data. The CAM includes a plurality of entries, wherein each entry configured to store an address value of an address location of the memory and one or more extended error correction bits corresponding to the data stored at the address location of the memory.

Abstract: A method forms a connecting pillar to a bonding pad of an integrated circuit. A seed layer is formed over the bond pad. Photoresist is deposited over the integrated circuit. An opening is formed in the photoresist over the bond pad. The connecting pillar is formed in the opening by plating.

Abstract: A method of testing a semiconductor device includes forming a test circuit over a semiconductor substrate. The test circuit includes a plurality of interconnects electrically connected to a set of device structures supported by the semiconductor substrate. A test, such as a gate stress or leakage current test, of each device structure is conducted with the test circuit. The plurality of interconnects are removed after conducting the test.

Abstract: An interconnect offload component arranged to operate in an offloading mode, and a memory access component for enabling access to a memory element for functional data transmitted over a debug network of a signal processing device. In the offloading mode the interconnect offload component is arranged to receive functional data from an interconnect client component for communication to a destination component, and forward at least a part of the received functional data to a debug network for communication to the destination component via the debug network. The memory access component is arranged to receive a debug format message transmitted over the debug network, extract functional data from the received debug format message, said functional data originating from an interconnect client component for communication to a memory element, and perform a direct memory access to the memory element comprising the extracted functional data.

Abstract: A driver circuit for testing a saturation level in an insulated gate bipolar transistor (“IGBT”) includes a comparator having a first input coupled to a reference voltage and a second input coupled to a saturation test node, and a first transistor having a first current electrode coupled to the first input of the comparator, a second current electrode coupled to a supply voltage, and a control electrode coupled to a first output of a test circuit. The first output is associated with a test initiation function of an internal test process. A second transistor has a first current electrode coupled to a control electrode of the IBGT transistor, a second current electrode coupled to the supply voltage, and a control electrode coupled to a second output of the test circuit. The second output is associated with an over-current indication of the internal test process.

Abstract: A memory device can include an array of NOR memory cells, each memory cell including a floating gate, a source on a source side of the floating gate, a drain on a drain side of the floating gate, a drain contact on the drain, and a source contact on the source. The source contacts are connected to a common source line. A plurality of bit lines are connected to respective drains in a column of the memory cells. A plurality of word lines, each word line coupled to respective floating gates in a row of the memory cells. Spacing between the word lines on the drain side is greater than spacing between the word lines on the source side.

Abstract: A memory cell includes a first bi-directional resistive element having a cathode coupled to a first power rail and an anode coupled to an internal node, a second bi-directional resistive element having a cathode coupled to the internal node and an anode coupled to a second power rail, and a first transistor having a control electrode coupled to the internal node, a first current electrode coupled to a first bitline, and a second current electrode coupled to a third power rail.