Abstract: A safety system comprising: a safety apparatus adapted to be mounted at the rear of a bicycle and comprising a processor, a motion sensor, a threat sensing device and a user alert device, all coupled to the processor, wherein the processor is adapted to: control the driver alert device based on a threat position value and/or the threat speed value; control the user alert device based on at least one of a motion-based value, an ambient light-based value, the threat position value and the threat speed value. It is also claimed the safety apparatus and a collaborative safety system comprising a plurality of safety systems, each being coupled to a communication device through which the processor is further adapted to control the driver alert device and/or the user alert device of the others of the plurality in response to the sensing of a threat.

Abstract: A system comprises a first plurality of flip-flop circuits, a second plurality of flip-flop circuits, and a gating control module. At a first processor frequency, gating of clock signals is enabled for the first and second plurality of flip-flop circuits. At a second processor frequency, gating of a first of the clock signals is disabled for the first plurality of flip-flop circuits and gating of a second of the clock signals is enabled for the second plurality of flip-flop circuits.

Abstract: A die temperature measurement system (300) includes an external test environment setup (352) and an integrated circuit (302). The external test environment setup (352) includes means to force and accurately measure electrical variables. The integrated circuit (302) includes a bipolar transistor (325); a selectable switch (340) for selecting from plurality of integrated resistances (342, 344) to be coupled in series between a base (322) of the bipolar transistor and a first input (362); and a selectable-gain current mirror (310) with a gain, a programmable current-mirror output coupled to the collector (326) of the bipolar transistor. The bipolar transistor and optional diodes (335) are sequentially biased with a set of proportional collector current levels. For each bias condition, the temperature-dependent voltage produced by the structure is extracted and stored. Die temperature is obtained through algebraic manipulation (450) of this data. Parasitic resistance and I/O pad leakage effects are canceled.

Abstract: A buck converter includes a comparator having first and second gain stages that operate in compare and auto-zero modes. The comparator measures voltage drop across an N-channel transistor to determine when current through an inductor reaches zero. When the inductor current reaches zero, the N-channel transistor becomes inactive to prevent a reduction in efficiency caused by allowing negative inductor current to draw current from a load. The comparator is then placed in a low power state. When the comparator is not in a compare mode, the comparator can operate in an auto-zero mode to cancel offset when measuring the input of the comparator.

Abstract: A data processing system includes a processor configured to execute processor instructions and a branch target buffer having a plurality of entries. Each entry is configured to store a branch target address and a lock indicator, wherein the lock indicator indicates whether the entry is a candidate for replacement, and wherein the processor is configured to access the branch target buffer during execution of the processor instructions. The data processing system further includes control circuitry configured to determine a fullness level of the branch target buffer, wherein in response to the fullness level reaching a fullness threshold, the control circuitry is configured to assert the lock indicator of one or more of the plurality of entries to indicate that the one or more of the plurality of entries is not a candidate for replacement.

Abstract: An angular rate sensor (20) includes a drive mass (36) flexibly coupled to a substrate (22). A sense mass (42) is suspended above the substrate (22) is and flexibly connected to the drive mass (36) via flexible support elements (44). A quadrature compensation electrode (24) is associated with the drive mass (36) and a sense electrode (28) is associated with the sense mass (42). The drive mass (36) and the sense mass (42) oscillate together relative to a sense axis (50) in response to quadrature error. The quadrature error produces a signal error component (78) between the quadrature compensation electrode (24) and the drive mass (36) and a signal error component (76) between the sense electrode (28) and the sense mass (42). The compensation and sense electrodes (24, 28) are coupled in reverse polarity so that the signal error component (78) substantially cancels the signal error component (76).

Abstract: A method and apparatus are provided for manufacturing a packaged electronic device (3) having pre-formed and placed through package circuit devices (35) which include an embedded circuit component (39) and conductor terminals (37A, 37B) extending from a molded package (38) embedding the circuit component (39). The through package circuit devices (35) are placed on end with integrated circuit die (34) and encapsulated in a molded device package (32) which leaves exposed the one or more conductor terminals (37A, 37B) positioned on first and second surfaces of the through package circuit device, where the conductor terminals (37A, 37B) and embedded circuit component (39) form a circuit path through the molded device package.

Abstract: A semiconductor device configured with one or more integrated breakdown protection diodes in non-isolated power transistor devices and electronic apparatus, and methods for fabricating the devices.

Abstract: An integrated circuit (IC) includes a digital-to-analog converter (DAC), a voltage monitoring circuit, and a controller. The voltage monitoring circuit includes low voltage detect (LVD) and low voltage warning (LVW) circuits that generate LVD and LVW reference voltage signals. The controller generates and stores a voltage margin word (a difference between first and second DAC words that correspond to the LVD and LVW reference voltage signals, respectively). The controller compares the voltage margin word with predetermined maximum and minimum voltage margin words. If the voltage margin word does not lie between the predetermined maximum and minimum voltage margin words, the controller generates a voltage trimming signal that scales the LVW reference voltage signal. After scaling, if the voltage margin word lies between the predetermined maximum and minimum voltage margin words, the controller generates a calibration pass signal, otherwise the controller generates a calibration fail signal.

Abstract: A voltage regulator for digital loads combines a closed loop regulation circuit with an open loop topology. A transistor and a bank of transistors share the same voltage source VDD and gate control current. Each of the bank of transistors is sized to match different current load requirements and one or more may be switched in or out as appropriate when the digital load transitions from one operating mode to another. The regulator has good DC load regulation and unconditional stability regardless of output capacitance.

Abstract: A non-isolated capacitive AC-DC conversion power supply includes a current limiting input module that receives AC input power and has an output capacitor that supplies DC power. Charge storage stages have charge storage capacitors, a rectifier supplying rectified current from the input module to charge the charge storage capacitors and the output capacitor during a first part-cycle of the AC input power. The charge storage stages also include current amplifiers and unidirectional elements that conduct discharge current from the charge storage capacitors to charge the output capacitor during a second part-cycle of the AC input power. Ground of the DC output can be connected to the live AC input.

Abstract: A multi-region (81, 83) lateral-diffused-metal-oxide-semiconductor (LDMOS) device (40) has a semiconductor-on-insulator (SOI) support structure (21) on or over which are formed a substantially symmetrical, laterally internal, first LDMOS region (81) and a substantially asymmetric, laterally edge-proximate, second LDMOS region (83). A deep trench isolation (DTI) wall (60) substantially laterally terminates the laterally edge-proximate second LDMOS region (83). Electric field enhancement and lower source-drain breakdown voltages (BVDSS) exhibited by the laterally edge-proximate second LDMOS region (83) associated with the DTI wall (60) are avoided by providing a doped SC buried layer region (86) in the SOI support structure (21) proximate the DTI wall (60), underlying a portion of the laterally edge-proximate second LDMOS region (83) and of opposite conductivity type than a drain region (31) of the laterally edge-proximate second LDMOS region (83).

Abstract: A signal processing device includes at least one timestamp generation component arranged to generate at least one local timestamp value, and to provide the at least one local timestamp value to at least one data link layer module for timestamping of data packets. The signal processing device further includes at least one debug module arranged to receive the at least one local timestamp value and to timestamp debug information based at least partly on the at least one local timestamp value.

Abstract: A signal delay cell for use in resolving hold time violations in an IC has a first multiplexer having a first functional data input node and a scan data input node TI and a second multiplexer having a second functional data input node, a second input node connected to the output of the first multiplexer and a flip-flop module. The propagation of a data input signal applied to the first multiplexer is delayed, and the hold margin of the flip-flop module is increased by transit through the first multiplexer. The signal delay cell is available to replace a flip-flop having a scan data hold problem, and also for use in solving a functional data violation in the same or another cell.

Abstract: A method and apparatus for an asynchronous multicore common debugging system is described. Debug signals from a plurality of processor cores are synchronized to a common timing domain. Processing completed within the plurality of processor cores during a common timing interval is tracked. A single debugging tool chain is utilized to provide debugging results in response to the tracking the processing completed within the plurality of processor cores during the common timing interval.

Abstract: A direct-sequence spread spectrum signal receiving device may comprise a receiver unit, a chip sequence generating unit, a correlation unit, and comparison unit. The receiver unit may extract a chip stream from a radio-frequency signal, said chip stream containing a first chip sequence. The chip sequence generating unit may generate a plurality of trial chip sequences on the basis of a first trial chip sequence and on the basis of a plurality of index rotations. The correlation unit may determine a plurality of correlation values on the basis of said plurality of trial chip sequences and on the basis of said first chip sequence, each of said correlation values indicating a degree of correlation between a respective one of said trial chip sequences and said first chip sequence. The comparison unit may determine whether a maximum one of said correlation values exceeds a defined threshold value.

Abstract: An apparatus includes a first circuit of a first type that couples an output node to a first power supply node in response to a first value of a control signal. The apparatus includes a second circuit of a second type to couple the output node to the first power supply node in response to a first value of a first signal having a first voltage swing. The apparatus includes a third circuit of the second type to couple the output node to a second power supply node in response to a second value of the first signal. The apparatus includes a control circuit that generates the control signal based on the first signal and an output signal on the output node. The first, second, and third circuits generate an output signal on the output node. The output signal has a second voltage swing less than the first voltage swing.

Abstract: An electronic circuit includes a processor having a functional mode and a low power mode, said processor comprising state flip-flops and additional flip-flops; said state flip flips are arranged to store state information about a state of the processor when the processor is in the functional mode; said state flip-flops comprise non-reset flip-flops that are arranged to store at least one non-reset value when the processor exits the functional mode; a power management circuit for providing power to the processor when the processor is in the functional mode, and for preventing power from the processor when the processor is in the low power mode; a non-reset value identification module, coupled to the state flip-flops, said non-reset value identification module is arranged to identify the non-reset flip-flops and to generate non-reset information that identifies the non-reset flip-flops; and a recovery circuit, coupled to a memory module and to the state flip-flops.

Abstract: A method of assembling semiconductor devices with semiconductor dies of alternative different configurations uses the same substrate panel. The dies of the selected configuration are placed in an array, mounted, and connected to internal electrical contact pads on a first face of the panel using main fiducial markings and an array of subsidiary fiducial markings corresponding universally to arrays of semiconductor dies of the different alternative configurations. The pitch of the subsidiary fiducial markings is equal to the spacing between adjacent rows of the internal electrical contact pads on the panel and is a sub-multiple of the pitch of the array of dies.

Abstract: A packaged RF device is provided that can provide improved performance and flexibility though the use of flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.