Patents Assigned to Global Unichip Corporation
  • Patent number: 8816708
    Abstract: Electronic test system and associated method, including a first and a second connection terminals respectively coupled to two pins of a chip under test, a signal source terminal coupled to a signal generator, a first and a second measurement terminals coupled to a tester, a fifth switch, a seventh switch and a switch circuit which has a first and a fourth front terminals coupled to the signal source terminal, has a first and a fourth back terminals coupled to the first and second connection terminals, and controls conduction between the first front terminal and the first back terminal, as well as conduction between the fourth front terminal and the fourth back terminal. The fifth switch is coupled between the fourth back terminal and the first measurement terminal, and the seventh switch is coupled between the first connection terminal and the second measurement terminal.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: August 26, 2014
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Shin-Cheng Chu, Ching-Tsung Chen, Teng-Hui Lee, Chia-Jen Kao
  • Patent number: 8779739
    Abstract: A DC converter is provided for converting a first supply voltage into a second supply voltage. The first supply voltage is higher than the second supply voltage. The DC converter includes a driving stage and an output stage. The driving stage includes a modulation circuit, a pull-up driving unit, a pull-up unit, a pull-down driving unit, and a pull-down unit. The modulation circuit generates a control signal according to the second supply voltage. The pull-up driving unit generates a first P-type driving signal and a second P-type driving signal to the pull-up unit according to the control signal. The pull-down driving unit generates a first N-type driving signal and a second N-type driving signal to the pull-down unit according to the control signal.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: July 15, 2014
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chao-Yen Huang, Jung-Tsun Chuang
  • Publication number: 20140152364
    Abstract: Phase offset cancellation circuit and associated clock generator, include a first modifying phase interpolator and a second modifying phase interpolator, and provide a first modified clock and a second modified clock according to a first to a fourth input clocks; wherein the first and the third clocks are of opposite phases. The first modifying phase interpolator performs equal phase interpolation between the first and the second input clocks to generate the first modified clock, and the second modifying phase interpolator performs equal phase interpolation between the third and the fourth input clocks to generate the second modified clock, such that a phase difference between the first modified clock and the second modified clock is of substantially 90 degrees, against phase offsets between the first to the fourth input clocks.
    Type: Application
    Filed: November 27, 2013
    Publication date: June 5, 2014
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., GLOBAL UNICHIP CORPORATION
    Inventor: Chen-Yang Pan
  • Patent number: 8744832
    Abstract: A hybrid electronic design system and a reconfigurable connection matrix thereof are disclosed. The electronic design system includes a virtual unit, a hybrid unit and a communication channel. The virtual unit further includes a plurality of proxy units, a plurality of virtual components and a driver. The virtual components are connected with the driver via the proxy units. The hybrid unit further includes an emulate unit, a physical unit and a chip level transactor. The chip level transactor is connected with the emulate unit and the physical unit. The communication channel is connected with the driver of the virtual unit and the chip level transactor of the hybrid unit.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: June 3, 2014
    Assignee: Global Unichip Corporation
    Inventor: Peisheng Alan Su
  • Patent number: 8724269
    Abstract: ESD protection circuit is provided, which includes a detection circuit, a trigger circuit and a clamp circuit. The detection circuit includes two stacked capacitors reflecting occurrence of ESD events. The trigger circuit includes three stacked transistors controlling triggering of the clamp circuit according to operation of the detection circuit. The clamp circuit includes two stacked transistors conducting ESD path when triggered.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: May 13, 2014
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Tai Wang, Sheng-Tsai Huang, Chao-Yen Huang
  • Publication number: 20140103965
    Abstract: A two-stage post driver circuit includes a controlling circuit, a pull-up unit and a pull-down unit. A first N-type transistor of the pull-down unit and a first P-type transistor of the pull-up unit are both connected to an output pad. The controlling circuit is used for controlling the first N-type transistor and the first P-type transistor. Consequently, when the pull-up unit or the pull-down unit is turned on, the voltage difference between the drain terminal and the source terminal of the first N-type transistor or the first P-type transistor is lower than a voltage stress.
    Type: Application
    Filed: December 16, 2013
    Publication date: April 17, 2014
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., GLOBAL UNICHIP CORPORATION
    Inventors: Wen-Tai Wang, Chao-Yen Huang
  • Publication number: 20140103966
    Abstract: A two-stage post driver circuit includes a controlling circuit, a pull-up unit and a pull-down unit. A first N-type transistor of the pull-down unit and a first P-type transistor of the pull-up unit are both connected to an output pad. The controlling circuit is used for controlling the first N-type transistor and the first P-type transistor. Consequently, when the pull-up unit or the pull-down unit is turned on, the voltage difference between the drain terminal and the source terminal of the first N-type transistor or the first P-type transistor is lower than a voltage stress.
    Type: Application
    Filed: December 16, 2013
    Publication date: April 17, 2014
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., GLOBAL UNICHIP CORPORATION
    Inventors: Wen-Tai Wang, Chao-Yen Huang
  • Patent number: 8669803
    Abstract: A high speed level shifter is provided for converting a low input voltage into a wide-range high output voltage. By utilizing two switching units to improve the latching speed of the latching unit of the level shifter, the duty cycle of the input signal is nearly equal to the duty cycle of the output signal.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: March 11, 2014
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chao-Yen Huang, Jung-Tsun Chuang
  • Patent number: 8633737
    Abstract: A two-stage post driver circuit includes a controlling circuit, a pull-up unit and a pull-down unit. A first N-type transistor of the pull-down unit and a first P-type transistor of the pull-up unit are both connected to an output pad. The controlling circuit is used for controlling the first N-type transistor and the first P-type transistor. Consequently, when the pull-up unit or the pull-down unit is turned on, the voltage difference between the drain terminal and the source terminal of the first N-type transistor or the first P-type transistor is lower than a voltage stress.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: January 21, 2014
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Wen-Tai Wang, Chao-Yen Huang
  • Patent number: 8593215
    Abstract: The invention discloses a power gating for in-rush current mitigation. Firstly the circuit uses small power switch cells at first stage, such that those power switch cells run in saturation region. Secondly a delay unit delays a switch signal to control the dwell time of current to reduce the peak value of the current. Thirdly large power switch cells are used at the rest, such that those power switch cells operate in linear region.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: November 26, 2013
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company Limited
    Inventor: Shih-Hao Chen
  • Publication number: 20130283221
    Abstract: Method for input/output (IO) design of a chip, including: according to a signal IO pin sequence and associated driving parameters, sequentially placing a signal IO cell in the IO design associated with each of the signal IO pins; after a signal IO cell is placed, performing a simultaneous switching output (SSO) verification step according to physical layout parameters and locations of the signal IO cells placed in the IO design, so as to check whether an SSO specification is violated; if not violated, continuing to place a signal IO cell of a next signal IO pin; if violated, including a decoupling capacitor, an IO power cell and/or an IO ground cell in the IO design.
    Type: Application
    Filed: April 16, 2013
    Publication date: October 24, 2013
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., GLOBAL UNICHIP CORPORATION
    Inventors: Shi-Hao Chen, Tsung-Ying Tsai, Chao-Yen Huang
  • Publication number: 20130272358
    Abstract: Eye diagram scan circuit and associated method for a receiver circuit, including a level adjust circuit, a phase interpolator and a control module. The receiver circuit provides a first data signal and a primary phase data according to a received signal. The control module provides a phase offset data and a level offset data. The level adjust circuit adjusts a level of the received signal in respond to the level offset data; the phase interpolator triggers according to a sum of the phase offset data and the primary phase data, so a second data signal is provide in response to the level-adjusted received signal. The control module compares the first data signal and the second data signal, and accordingly provides an eye diagram scan result for the phase offset data and the level offset data.
    Type: Application
    Filed: April 16, 2013
    Publication date: October 17, 2013
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., GLOBAL UNICHIP CORPORATION
    Inventors: Liang-Hung Chen, Yen-Chung Chen, Jung-Chi Huang
  • Patent number: 8547149
    Abstract: This invention provides a clock and data recovery system, which comprises a plurality of gm cells, control device, resistor and capacitor. The gm cells respectively have an input end and an output end. The control devices are connected to these output ends. According to a time value, the control device controls a part of the plurality of gm cells to form a first gm cell, and the control device controls another part of the plurality of gm cells to form a second gm cell. The resistor is connected between the first gm cell and the second gm cell. The capacitor is connected to the second gm cell. Wherein, the control device controls the ratio of the first gm cell and the second gm cell in accordance with a time-division multiplexed manner.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: October 1, 2013
    Assignee: Global Unichip Corporation
    Inventors: Fu-Tai An, Jen-Tai Hsu, Yi-Lin Lee
  • Patent number: 8518722
    Abstract: A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back side, and a plurality of first connecting elements on the active surface of the chip; mounting and electrically connecting the active surface of the chip on the substrate; performing at least once IR reflow to fix the plurality of first connecting elements on the substrate; filling an encapsulate material to cover the active surface of the chip and the plurality of first connecting elements; performing a detecting process to detect that void is not formed between the active surface of the chip and the plurality of first elements; and forming a plurality of second connecting elements on the back side of the substrate to obtain a flip chip ball grid array package structure.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: August 27, 2013
    Assignee: Global Unichip Corporation
    Inventors: Chien-Wen Chen, Chia-Jen Kao, Jui-Cheng Chuang
  • Publication number: 20130214838
    Abstract: A high speed level shifter is provided for converting a low input voltage into a wide-range high output voltage. By utilizing two switching units to improve the latching speed of the latching unit of the level shifter, the duty cycle of the input signal is nearly equal to the duty cycle of the output signal.
    Type: Application
    Filed: February 21, 2013
    Publication date: August 22, 2013
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., GLOBAL UNICHIP CORPORATION
    Inventors: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
  • Publication number: 20130214749
    Abstract: A DC converter is provided for converting a first supply voltage into a second supply voltage. The first supply voltage is higher than the second supply voltage. The DC converter includes a driving stage and an output stage. The driving stage includes a modulation circuit, a pull-up driving unit, a pull-up unit, a pull-down driving unit, and a pull-down unit. The modulation circuit generates a control signal according to the second supply voltage. The pull-up driving unit generates a first P-type driving signal and a second P-type driving signal to the pull-up unit according to the control signal. The pull-down driving unit generates a first N-type driving signal and a second N-type driving signal to the pull-down unit according to the control signal.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 22, 2013
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., GLOBAL UNICHIP CORPORATION
    Inventors: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Co., Ltd.
  • Patent number: 8487642
    Abstract: A burn-in socket for carrying an electronic device to let the electronic device electrically connect to a circuit board via the burn-in socket is provided. The electronic device has a body and at least a lead. The burn-in socket comprises a frame and a carrier, the frame has an opening and a plurality of first aligning potions, wherein the opening fits onto the contour of the body, and the first aligning portions surrounds the opening. The carrier has a plurality of second aligning portions. The frame is assembled to the carrier with the conjunction of the first aligning portions and the second aligning portions. The body is capable of fitting into the opening to let the lead electrically connect to the circuit board via the carrier.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: July 16, 2013
    Assignee: Global Unichip Corporation
    Inventors: Yu-Min Sun, Chih-Feng Cheng
  • Patent number: 8487645
    Abstract: A through-silicon via (TSV) testing structure is disclosed herein and includes a plurality of controllers, a plurality of transmitters and a plurality of receivers. The controllers are configured to output a first controlling signal and a second controlling signal. The transmitters are respectively connected to the output end of the through-silicon via and one of the controllers, and output a testing output signal in accordance with the first controlling signal and the second controlling signal. The receivers are respectively connected to the input end of the through-silicon via and another one of the controllers, and input a testing input signal in accordance with the first controlling signal and the second controlling signal.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: July 16, 2013
    Assignee: Global Unichip Corporation
    Inventors: Ming-Tung Chang, Min-Hsiu Tsai, Chih-Mou Tseng
  • Patent number: 8488731
    Abstract: The invention creates a slicing level and sampling phase adaptation circuitry for data recovery systems. The invention explores the boundary of the eye opening to decide the optimal slicing level and sampling phase with a simple bit error rate estimation technique. Bit error rate estimation is achieved with several collaborating samplers.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: July 16, 2013
    Assignee: Global Unichip Corporation
    Inventors: Fu-Tai An, Jen-Tai Hsu
  • Patent number: 8473793
    Abstract: A boundary scan circuit containing a freeze circuit and a transparency circuit that provides a capability to selectively place portions of a system logic in a sleep mode and thereby conserving power. There are two transparency circuit configurations, one that connects to an input pad cell and one that connects to an output pad cell. The circuitry in the transparency circuit is controlled in such a manner as to establish at the output of transparency circuit a known logic state to control leakage current resulting from the circuitry of the various pad cell configurations, which further conserves power during sleep mode.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: June 25, 2013
    Assignee: Global Unichip Corporation
    Inventor: Min-Hsiu Tsai