Patents Assigned to IMEC
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Patent number: 7510959Abstract: A method of manufacturing a semiconductor device having damascene structures with air gaps is provided. In one embodiment, the method comprises the steps of depositing and patterning a disposable layer, depositing a first barrier layer on top of the patterned disposable layer, depositing a metal layer, planarizing the metal layer, depositing a second barrier layer, planarizing the second barrier layer until substantially no barrier layer material is present on top of the disposable layer, depositing a permeable layer, removing the disposable layer through the permeable layer to form air gaps.Type: GrantFiled: March 16, 2005Date of Patent: March 31, 2009Assignees: Interuniversitair Microelektronica Centrum (IMEC), Koninklikje Phillips ElectronicsInventors: Roel Daamen, Viet Nguyen Hoang
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Patent number: 7511116Abstract: A technique is described for the preparation of polymers according to a process in which the starting compound of formula (I) is polymerized in the presence of a base in an organic solvent. No end chain controlling agents are required during the polymerisation to obtain soluble precursor polymers. The precursor polymer such obtained comprises structural units of the formula (II). In a next step, the precursor polymer (II) is subjected to a conversion reaction towards a soluble or insoluble conjugated polymer by thermal treatment. The arylene or heteroarylene polymer comprises structural units of the formula III. In this process the dithiocarbamate group acts as a leaving group and permits the formation of a precursor polymer of structural formula (II), which has an average molecular weight from 5000 to 1000000 Dalton and is soluble in common organic solvents. The precursor polymer with structural units of formula (II) is thermally converted to the conjugated polymer with structural formula (III).Type: GrantFiled: July 18, 2007Date of Patent: March 31, 2009Assignees: Interuniversitair Microelektronica Centrum (IMEC), Limburgs Universitair CentrumInventors: Dirk Vanderzande, Laurence Lutsen, Anja Henckens, Kristof Colladet
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Publication number: 20090079494Abstract: A method of operating a quantum system comprising computational elements, including an insulated ring of superconductive material, and semi-closed rings used as an interface between the computational elements and the external world, is disclosed. In one aspect, the method comprises providing an electrical signal, e.g. a current, in an input ring magnetically coupled to a computational element, which generates a magnetic field in the computational element and sensing the change in the current and/or voltage of an output element magnetically coupled to the computational element. The electrical input signal can be an AC signal or a DC signal. The computational element is electromagnetically coupled with other adjacent computational elements and/or with the interface elements. The corresponding magnetic flux between the computational elements and/or the interface elements acts as an information carrier. Ferromagnetic cores are used to improve the magnetic coupling between adjacent elements.Type: ApplicationFiled: September 25, 2008Publication date: March 26, 2009Applicants: Interuniversitair Microelektronica Centrum vzw (IMEC), Katholieke Universiteit LeuvenInventors: Christoph Kerner, Wim Magnus, Dusan Golubovic
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Patent number: 7508718Abstract: A method for determining programming/erase conditions and a method for operating a charge-trapping semiconductor device are disclosed. Programming and erase conditions are determined such that a first net charge distribution variation profile, upon going from programmed to erased state, is substantially the opposite of a second net charge distribution variation profile, upon going from erased to programmed state.Type: GrantFiled: June 2, 2006Date of Patent: March 24, 2009Assignee: Interuniversitair Microelektronica Centrum (IMEC)Inventor: Arnaud Adrien Furnemont
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Publication number: 20090072222Abstract: Preferred embodiments provide a method for forming at least one catalyst nanoparticle on at least one sidewall of a three-dimensional structure on a main surface of a substrate, the main surface lying in a plane and the sidewall of the three-dimensional structure lying in a plane substantially perpendicular to the plane of the main surface of the substrate. The method comprises obtaining a three-dimensional structure on the main surface, the three-dimensional structure comprising catalyst nanoparticles embedded in a non-catalytic matrix and selectively removing at least part of the non-catalytic matrix at the sidewalls of the three-dimensional structure to thereby expose at least one catalyst nanoparticle. According to preferred embodiments a method is also provided for forming at least one elongated nanostructure, such as e.g. a nanowire or carbon nanotube, using the catalyst nanoparticles formed by the method according to preferred embodiments as a catalyst.Type: ApplicationFiled: June 26, 2008Publication date: March 19, 2009Applicant: Interuniversitair Microelektronica Centrum vzw (IMEC)Inventors: Aleksandar Radisic, Philippe M. Vereecken
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Publication number: 20090073621Abstract: A method and apparatus for designing an ESD protection circuit comprising a main ESD device and a triggering device connected to a triggering node of the main ESD device by means of which the main ESD device can be triggered for conducting ESD current at a reduced voltage. The triggering device is located in an initial current path for the ESD current. In this initial current path, there is at least one triggering component which can be triggered from an off-state to an on-state. The triggering speed of this component is considered and its design is optimised in view of increasing its triggering speed. Further shown is an ESD protection circuit in which at least one triggering component is selected to be of a predetermined type for achieving a fast triggering speed, preferably of the gated diode type.Type: ApplicationFiled: September 12, 2008Publication date: March 19, 2009Applicant: Interuniversitair Microelektronica Centrum (IMEC)Inventors: Steven Thijs, David Eric Tremouilles
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Patent number: 7504329Abstract: Low work function metals for use as gate electrode in nMOS devices are provided. The low work function metals include alloys of lanthanide(s), metal and semiconductor. In particular, an alloy of nickel-ytterbium (NiYb) is used to fully silicide (FUSI) a silicon gate. The resulting nickel-ytterbium-silicon gate electrode has a work function of about 4.22 eV.Type: GrantFiled: May 11, 2006Date of Patent: March 17, 2009Assignees: Interuniversitair Microelektronica Centrum (IMEC), National University of Singapore (NUS), Texas Instruments IncorporatedInventors: HongYu Yu, Chen JingDe, Li Mingfu, Dim-Lee Kwong, Serge Biesemans, Jorge Adrian Kittl
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Publication number: 20090065025Abstract: An improved reaction chamber cleaning process is provided for removing water residues that makes use of noble-gas plasma reactions. The method is easy applicable and may be combined with standard cleaning procedure. A noble-gas plasma (e.g. He) that emits high energy EUV photons (E>20 eV) which is able to destruct water molecules to form electronically excited oxygen atoms is used to remove the adsorbed water.Type: ApplicationFiled: September 5, 2008Publication date: March 12, 2009Applicants: Interuniversitair Microelektronica Centrum vzw (IMEC), Katholieke Universiteit Leuven, K.U. Leuven R&DInventors: Adam Michal Urbanowicz, Mikhail Baklanov, Denis Shamiryan, Stefan De Gendt
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Publication number: 20090070552Abstract: A signal processing device adapted for simultaneous processing of at least two process threads in a multi-processing manner is disclosed. In one embodiment, the device comprises a plurality of functional units capable of executing word- or subword-level operations on data. The device further comprises means for interconnecting the plurality of functional units, the means for interconnecting supporting a plurality of dynamically switchable interconnect arrangements, and at least one of the interconnect arrangements interconnects the plurality of functional units into at least two non-overlapping processing units each with a pre-determined topology. The device further comprises at least two control modules each assigned to one of the processing units.Type: ApplicationFiled: September 12, 2008Publication date: March 12, 2009Applicants: Interuniversitair Microelektronica Centrum vzw (IMEC), Freescale Semiconductor Inc.Inventors: Andreas Kanstein, Mladen Berekovic
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Publication number: 20090066555Abstract: The present invention discloses an analogue-to-digital converter comprising at least two voltage comparator devices. Each of the voltage comparator devices comprises a differential structure of transistors and is arranged for being fed with a same input signal and for generating an own internal voltage reference by means of an imbalance in the differential structure, said two internal voltage references being different. Each voltage comparator is arranged for generating an output signal indicative of a bit position of a digital approximation of the input signal.Type: ApplicationFiled: August 13, 2008Publication date: March 12, 2009Applicant: Interuniversitair Microelektronica Centrum(IMEC)Inventors: Geert Van Der Plas, Pierluigi Nuzzo, Fernando De Bernardinis
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Publication number: 20090068768Abstract: A non-destructive and simple analytical method is provided which allows in situ monitoring of plasma damage during the plasma processing such as resist stripping. If a low-k film is damaged during plasma processing, one of the reaction products is water, which is remained adsorbed onto the low-k film (into pores), if the temperature is lower than 100-150 C. A plasma (e.g. He) that emits high energy EUV photons (E>20 eV) which is able to destruct water molecules forming electronically excited oxygen atoms is used to detect the adsorbed water. The excited oxygen is detected from optical emission at 777 nm. Therefore, the higher the adsorbed water concentration (higher damage), a more intensive (oxygen) signal is detected. Therefore, intensity of oxygen signal is a measure of plasma damage in the previous strip step.Type: ApplicationFiled: September 4, 2008Publication date: March 12, 2009Applicants: Interuniversitair Microelektronica Centrum vzw (IMEC), Katholieke Universiteit Leuven, K.U. LEUVEN R&DInventors: Adam Michal Urbanowicz, Mikhail Baklanov
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Patent number: 7500387Abstract: One inventive aspect is related to an atomic force microscopy probe. The probe comprises a tip configuration with two probe tips on one cantilever arm. The probe tips are electrically isolated from each other and of approximately the same height with respect to the cantilever arm. The outer surface of the tip configuration has the shape of a body with a base plane and an apex. The body is divided into two sub-parts by a gap located approximately symmetrically with respect to the apex and approximately perpendicular to the base plane. Another inventive aspect related to methods for producing such an AFM probe.Type: GrantFiled: July 28, 2006Date of Patent: March 10, 2009Assignee: Interuniversitair Microelektronica Centrum vzw (IMEC)Inventor: Marc Fouchier
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Publication number: 20090050982Abstract: A new MOSFET device is described comprising a metal gate electrode, a gate dielectric and an interfacial layer. The interfacial layer comprises a lanthanum hafnium oxide material for modulating the effective work function of the metal gate. The gate dielectric material in contact with the interfacial layer is different that the interfacial layer material. A method for its manufacture is also provided and its applications.Type: ApplicationFiled: May 29, 2007Publication date: February 26, 2009Applicants: Interuniversitair Microelektronica Centrum (IMEC), National University of Singapore (NUS), Infineon Technologies AGInventors: Luigi Pantisano, Tom Schram, Stefan De Gendt, Amal Akheyar, XinPeng Wang, Mingfu Li, HongYu Yu
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Patent number: 7494902Abstract: A method is disclosed for relaxing strain in a multi-gate device, the method comprising providing a substrate with a strained material, patterning a plurality of fins in the strained material, defining a first region comprising at least one fin, defining a second region comprising at least one fin, providing a diffusion barrier layer on the first region, performing a hydrogen anneal such that the strain in the second region is relaxed.Type: GrantFiled: June 22, 2007Date of Patent: February 24, 2009Assignee: Interuniversitair Microelektronica Centrum vzw (IMEC)Inventors: Malgorzata Jurczak, Rita Rooyackers, Nadine Collaert
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Publication number: 20090049319Abstract: An electronic power conversion circuit is presented for converting an input power to an output power. The circuit comprises at least one conversion block and a clock generator. Each conversion block comprises an input, an output and a plurality of charge storage elements and switches between the input and output. Each block is alternately switchable between a first state in which electric charge is loaded from the input and a second state in which electric charge is supplied as converted power to the output. The clock generator generates clock signals for controlling the switches and thereby switches between the first and second states. The circuit is characterized in that the clock generator comprises at least one input node for receiving at least one input parameter and in that the clock generator is provided for varying the frequency of the clock signals in relation to the at least one input parameter.Type: ApplicationFiled: July 21, 2008Publication date: February 19, 2009Applicant: STICHTING IMEC NEDERLANDInventor: Guy Meynants
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Patent number: 7488669Abstract: A method of making at least one marker (MX) for double gate SOI processing on a SOI wafer is disclosed. The marker has a diffracting structure in a first direction and the diffracting structure is configured to generate an asymmetrical diffraction pattern during use in an alignment and overlay detection system for detection in the first direction.Type: GrantFiled: March 16, 2005Date of Patent: February 10, 2009Assignees: Interuniversitair Microelektronica Centrum vzw (IMEC), Koninklijke Philips ElectronicsInventors: Josine Johanna Gerarda Petra Loo, Youri V. Ponomarev, David William Laidler
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Patent number: 7487587Abstract: Methods of producing a composite substrate and devices made by the methods are disclosed. One of the methods comprises providing a flexible sacrificial layer, producing one or more patterned conducting layers on the flexible sacrificial layer, bending the sacrificial layer into a predetermined shape, providing a stretchable and/or flexible material on top of and in between features of the one or more patterned layers.Type: GrantFiled: March 22, 2006Date of Patent: February 10, 2009Assignees: Interuniversitair Microelektronica Centrum vzw (IMEC), Universiteit GentInventors: Jan Vanfleteren, Dominique Brosteaux, Fabrice Axisa
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Publication number: 20090032811Abstract: A method is provided for modifying a poly(arylene vinylene) or poly(heteroarylene vinylene) precursor polymer having dithiocarbamate moieties by reacting it with an acid and further optionally reacting the acid-modified polymer with a nucleophillic agent. Also provided are novel polymers and copolymers bearing nucleophillic side groups which are useful as components of electronic devices, e.g. in the form of thin layers.Type: ApplicationFiled: July 31, 2008Publication date: February 5, 2009Applicants: Interuniversitair Microelektronica Centrum (IMEC), Universiteit HasseltInventors: Laurence Lutsen, Dirk Vanderzande, Fateme Banishoeib
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Publication number: 20090035597Abstract: A method is provided for modifying a poly(arylene vinylene) or poly(heteroarylene vinylene) precursor polymer having dithiocarbamate moieties by reacting it with an acid and further optionally reacting the acid-modified polymer with a nucleophilic agent. Also provided are novel polymers and copolymers bearing nucleophilic side groups which are useful as components of electronic devices, e.g. in the form of thin layers.Type: ApplicationFiled: February 5, 2008Publication date: February 5, 2009Applicants: Interuniversitair Microelektronica Centrum (IMEC), Universiteit HasseltInventors: Laurence Lutsen, Dirk Vanderzande, Fanteme Banishoeib
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Publication number: 20090027063Abstract: The present disclosure relates to a method for calibrating transient behaviour of an electrostatic discharge (ESD) test system. The system includes an ESD pulse generator and probe needles for applying a predetermined pulse on a device under test. The probe needles are connected to the ESD pulse generator via conductors. The test system includes measurement equipment for detecting transient behaviour of the device under test by simultaneously capturing voltage and current waveforms the device as a result of the pulse. The method comprises the steps of: (a) applying the ESD test system on a first known system with a first known impedance, (b) applying the ESD test system on a second known system with a known second impedance, and (c) determining calibration data for the transient behaviour the ESD test system on the basis of captured voltage and current waveforms, taking into account said known first and second impedances.Type: ApplicationFiled: March 19, 2008Publication date: January 29, 2009Applicants: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC), HANWA ELECTRONICS IND. CO., LTD.Inventors: Mirko Scholz, David Eric Tremouilles, Steven Thijs, Dimitri Linten