Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.

Abstract: A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

Abstract: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.

Abstract: Methods and systems related to detecting disease, such as oral cancer, in a patient, using a viewing scope to investigate a patient's tissues. The systems and methods excite and detect fluorescence from the tissue. The fluorescence can then be evaluated, and the possibility of certain diseases such as cancer can be determined. The devices include an ambient light management system (ALMS, often referred to as a “vestibular device”) that manages background light in the health practitioner's office. This device can be used with scope systems for fluorescence based detection of abnormal tissue.

Abstract: A light emitting diode and a method for fabricating the same are provided. The light emitting diode includes: a transparent substrate; a semiconductor material layer formed on the top surface of a substrate with an active layer generating light; and a fluorescent layer formed on the back surface of the substrate with controlled varied thicknesses. The ratio of light whose wavelength is shifted while propagating through the fluorescent layer and the original light generated in the active layer can be controlled by adjusting the thickness of the fluorescent layer, to emit desirable homogeneous white light from the light emitting diode.

Abstract: Provided are a top-emitting nitride based light emitting device having an n-type clad layer, an active layer and a p-type clad layer sequentially stacked thereon, comprising an interface modification layer formed on the p-type clad layer and a transparent conductive thin film layer made up of a transparent conductive material formed on the interface modification layer; and a process for preparing the same. In accordance with the top-emitting nitride-based light emitting device of the present invention and a process for preparing the same, there are provided advantages such as improved ohmic contact with the p-type clad layer, leading to increased wire bonding efficiency and yield upon packaging the light emitting device, capability to improve luminous efficiency and life span of the device due to low specific contact resistance and excellent current-voltage properties.

Abstract: Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

Abstract: Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

Abstract: A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.

Abstract: There is provided a semiconductor light emitting device having a patterned substrate and a manufacturing method of the same. The semiconductor light emitting device includes a substrate; a first conductivity type nitride semiconductor layer, an active layer and a second conductivity type nitride semiconductor layer sequentially formed on the substrate, wherein the substrate is provided on a surface thereof with a pattern having a plurality of convex portions, wherein out of the plurality of convex portions of the pattern, a distance between a first convex portion and an adjacent one of the convex portions is different from a distance between a second convex portion and an adjacent one of the convex portions.

Abstract: Provided are an alkaline earth metal silicate-based phosphor which is a compound represented by Formula 1 below, and a white light-emitting device (LED) including the same: (M11-x-yAxBy)aMgbM2cOdZe??Formula 1 wherein, M1 is one selected from the group consisting of Ba, Ca, and Sr; M2 is at least one selected from Si or Ge; A and B are each independently one selected from the group consisting of Eu, Ce, Mn, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, Bi, Sn, and Sb; Z is at least one selected from the group consisting of a monovalent or divalent element, H, and N; and 0<x<1, 0?y?1, 6.3<a<7.7, 0.9<b<1.1, 3.6<c<4.4, 14.4<d<17.6, 14.4<d+e<17.6, and 0?e?0.18. The alkaline earth metal silicate-based phosphor has a broad excitation wavelength range, and thus, both a UV-LED and a blue LED can be used as excitation sources for white LEDs.

Abstract: A method of making an LED lamp circuit achieves uniform heating and cooling of an LED lamp to extend its lifetime. Steps include: providing a circuit board for an LED lamp and dispersing a plurality of light emitting diodes across a surface of the circuit board; distributing an LED driver on a surface of the circuit board so that the light-emitting-diode driver is not a distinctly identifiable component, does not interfere with the light output of the LEDs, and enables the LED driver to uniformly heat the LEDs when powering the LEDs; configuring the LED driver to attach to a power input; and integrating a heat sink to a surface of the circuit board, the heat sink configured to uniformly remove heat from the LEDs and the LED driver. The invention includes an LED lamp circuit made according to the method.

Abstract: A light emitting diode module for a line light source includes a circuit board having a wire pattern formed thereon and a plurality of LED chips directly mounted and disposed in a longitudinal direction on the circuit board and electrically connected to the wire pattern. The module also includes a reflecting wall installed on the circuit board to surround the plurality of LED chips, reflecting light from the LED chips. The module further includes a heat sink plate underlying the circuit board to radiate heat generated from the LED chip.

Abstract: There is provided a white light emitting device that prevents a red phosphor from resorbing wavelength-converted light to improve white luminous efficiency. A white light emitting device according to an aspect of the invention includes a package body; at least two LED chips mounted to the package body and emitting excitation light; and a molding unit including phosphors, absorbing the excitation light and emitting wavelength-converted light, in regions of the molding unit divided according to the LED chips and molding the LED chips. According to the aspect of the invention, since the phosphor for converted red light can be prevented from resorbing light generated from other regions of the molding unit, the white light emitting device that can improve white luminous efficiency or control color rendering and color temperature by adjusting a mixing ratio of converted light for white light emission.

Abstract: Disclosed are an illumination apparatus for adjusting a color temperature and brightness, which can determine duties of pulse width modulation (PWM) control pulses for driving two light sources having different color temperatures, and an illumination system including the same. The illumination apparatus includes first and second light source units emitting light of different color temperatures, first and second pulse width modulation (PWM) driving units respectively driving the first and second light source units by a PWM control method, and a duty control unit controlling respective duties of PWM control pulses of the first and second PWM driving units according to a color-temperature set value and a brightness set value input from the outside. The duty control unit controls the duties such that the color-temperature set value is reflected in the respective duties of the PWM control pulses of the first and second PWM driving units in a complementary relation.

Abstract: An alternating current (AC) driven light emitting device includes a substrate, K number of first light emitting diode (LED) cells arranged in a row on a top surface of the substrate, where K is an integer satisfying K?3, K number of second LED cells arranged in a row parallel to the row of the first LED cells on the top surface of the substrate, and (K?1) number of third LED cells arranged in a row between the respective rows of the first and second LED cells on the top surface of the substrate. The AC driven light emitting device has a connection structure between LED cells to be operable at an AC.

Abstract: A white light emitting diode (LED) package with multilayered encapsulation structure and the packaging methods are disclosed. The white LED package structure includes metal electrodes, a heat dissipation base, a PPA plastic for fixing the electrodes and the heat dissipation base together, at least one LED die, a die attaching material, gold wires for electrically connecting the LED die to the electrodes, a first type of silicone encapsulant, a second type of silicone encapsulant, and a phosphor containing layer. The invention utilizes a low-refractive index silicone (the second type of silicone encapsulant) to separate the phosphor containing layer away from the first type of silicone, which covers the LED die, to prevent/reduce emitted light going backward and hitting the LED die.

Abstract: There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.

Abstract: A high intensity LED based lighting array for use in an obstruction light with efficient uniform light output is disclosed. The high intensity LED based lighting array has a first concentric ring having a plurality of reflectors and light emitting diodes. The concentric ring has a planar surface mounting each of the plurality of reflectors in perpendicular relation to a respective one of the plurality of light emitting diodes. A second concentric ring is mounted on the first concentric ring. The second concentric ring has a second plurality of reflectors and light emitting diodes. The second concentric ring has a planar surface mounting each of the plurality of reflectors in perpendicular relation to a respective one of the plurality of light emitting diodes. The second plurality of reflectors and light emitting diodes are offset from the reflectors and light emitting diodes of the first concentric ring.

Abstract: There is provided a semiconductor light emitting device, a method of manufacturing the same, and a semiconductor light emitting device package using the same. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein the second electrode layer has an exposed area at the interface between the second electrode layer and the second conductivity type semiconductor layer, and the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer.