Abstract: An apparatus comprising (i) an input circuit configured to provide a predetermined voltage tolerance in response to a plurality of control signals and (ii) a control circuit configured to generate the plurality of control signals in response to one or more input signals.

Abstract: A multipurpose configurable bus independent simulation bus functional model for testing a circuit is described. The multipurpose bus functional model utilizes a configurable data structure to interact with a device being tested by providing high-level test generation routines defined by the bus interface specified. The configurable data structure allows for verification of both signal timing and functional operation bus specifications. This data structure technique utilizes a standardized and parameterized method that allows variations and multiple instances of test bench models to be generated and instantiated in a design test environment. The bus functional model also sub-divides general functions and data structures into separate re-usable functional blocks. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other researcher to quickly ascertain the subject matter of the technical disclosure.

Abstract: An automatic delay matching circuit for a data serializer includes a phase-locked loop for synthesizing a transmitter clock signal for an external circuit, a phase interpolator coupled to the phase-locked loop for delaying or advancing the transmitter clock signal in response to a phase control signal to generate a delayed or advanced transmitter clock signal for the data serializer, a phase detector for measuring a phase difference between the delayed or advanced transmitter clock signal further delayed through the data serializer and the transmitter clock signal delayed through an external circuit, and a loop filter coupled to the phase detector for generating the phase control signal as a function of the phase difference between the delayed or advanced transmitter clock signal further delayed through the data serializer and the transmitter clock signal delayed through the external circuit.

Abstract: The present invention is directed to a system and method for reading and writing N-way mirrored storage devices. A method of reading data in a data storage system, where the data storage system may include a first data storage device, a second data storage device and a third data storage device, is provided. A first item of data is read from a first data storage device, a second item of data is read from a second data storage device, and a third item of data is read from a third storage device. The first item of data from the first storage device is compared with the second item of data from the second storage device and the third item of data from the third storage device. If the first item of data matches at least one of the second item of data and the third item of data, the first item of data is valid. If the first item of data does not match at least one of the second item of data and the third item of data, the second item of data is valid.

Abstract: Block-level storage is managed in a computerized storage system by recording into a write-ahead log a description of block-level updates made to data in a volume in a main memory and in a storage device of the computerized storage system. The write-ahead logging enables directory updates for each block-level write request to be logged, so the write request can be allowed to complete independently of other write requests.

Abstract: Methods of operation and systems for a standardized scatter/gather list processor component within DMACs and intelligent IOPs. The standardized circuit architecture and methods provide a register interface and associated processing capabilities to simplify firmware processing to save and restore context information regarding block transfer operations that are paused and resumed prior to completion. Furthermore, the invention provides for architecture and associated methods for processing of standard scatter/gather list elements by a standardized scatter/gather list processor embedded within DMACs and IOPs. Specifically, as applied in the context of SCSI or Fibre Channel IOPs, the scatter/gather list processor of the present invention simplifies IOP firmware processing to save the current block transfer context on occurrence of a SCSI disconnect and to restore the saved context on occurrence of a SCSI reselect.

Abstract: Provided is an incrementing/decrementing apparatus that includes an adder having a first input and a second input, each of the first input and the second input comprising multiple bits. A first multi-bit signal is connected to the first input, and a second multi-bit signal is connected to the second input, the second multi-bit signal including multiple bits. The adder increments the first multi-bit signal by a quantity when an increment/decrement signal has a first value and decrements the first multi-bit signal by the quantity when the increment/decrement signal has a second value. The multiple bits of the second multi-bit signal include at least one bit based solely on a corresponding bit in the quantity and at least one bit based solely on a value of the increment/decrement signal.

Abstract: A resistor having a desired temperature coefficient of resistance and a total electrical resistance. A first resistor segment has a first temperature coefficient of resistance and a first electrical resistance. A second resistor segment has a second temperature coefficient of resistance and a second electrical resistance. The first resistor segment is electrically connected in series with the second resistor segment, and the total electrical resistance equals a sum of the first electrical resistance and the second electrical resistance. The desired temperature coefficient of resistance is determined at least in part by the first temperature coefficient of resistance and the first electrical resistance of the first resistor and the second temperature coefficient of resistance and the second electrical resistance of the second resistor.

Abstract: An apparatus comprising (i) a first circuit configured to generate one or more node signals at one or more internal nodes and (ii) a second circuit configured to present one or more of the node signals and a trigger signal in response to one or more control signals.

Abstract: A method for designing and mapping a power-bus grid in an integrated circuit. A floor plan is created by mapping wire segments of the power-bus grid to various metal layers of the IC core. Power zones which specify the current consumption of analog, digital, and memory block regions are also mapped to the IC core. A netlist of the floor plan design is generated and simulated, with the simulation returning current density and a voltage drop values in the wire segments with respect to the power zones. Calculated current density and voltage drop values are analyzed using a color map to indicate the current density and voltage drop levels of the wire segments. Power-bus wire segments are displayed in colors matched to the current density and voltage drop levels in the color map, helping the designer identify potential electromigration and voltage drop problems. The floor plan design can be modified if the calculated density and voltage drop values indicate potential electromigration or voltage drop problems.

Abstract: A wire bond package for an integrated circuit die includes a first I/O core ring and a second I/O core ring formed in a first metal layer; a pad strap formed in a second metal layer overlapping the second I/O core ring; a via formed between the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap; a first core ring formed in a third metal layer overlapping the first I/O core ring; a via formed between the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap; a first power mesh formed in a fourth metal layer overlapping the first core ring; and a via formed between the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.

Abstract: A drum washer has a base, a barrel support structure, and a water delivery system. A hollow drum is turned over and placed on the drum washer by inserting a spray head of the water delivery system through a hole in a top cover of the drum and into the interior of the drum. The barrel support structure holds the drum at a fixed angle while water is sprayed from the spray head onto interior surfaces of the drum. The water rinses the interior surfaces of the drum and drains out the hole in the top cover of the drum.

Abstract: Tile-based routing between a bump pad and an input/output (I/O) device for implementation on a flip-chip integrated circuit (IC) die. A trace is routed between the bump pad and a position corresponding to a first I/O slot, the first I/O slot being at least partially occupied by the I/O device. A position is obtained for a device pad for the I/O device. The trace is then extended into an area corresponding to the position obtained for the device pad. It is a feature of this aspect of the invention that the trace extension extends the trace into a pad area for a second I/O slot, the second I/O slot being at least partially occupied by the I/O device. The invention also concerns a flip-chip integrated circuit (IC) die that includes a bump pad, an input/output (I/O) device, and a device pad electrically connected to the I/O device and disposed vertically adjacent to a portion of the I/O device.

Abstract: A process for removal of a photoresist mask used to etch openings in low k carbon-doped silicon oxide dielectric material of an integrated circuit structure, and for removing etch residues remaining from either the etching of the openings or removal of the resist mask, while inhibiting damage to the low k dielectric material comprises. The structure is exposed to a reducing plasma to remove a portion of the photoresist mask, and to remove a portion of the residues remaining from formation of the openings in the layer of low k dielectric material. The structure is then exposed to an oxidizing plasma to remove any remaining etch residues from the openings in the layer of low k dielectric material or removal of the resist mask.

Abstract: Embodiments of the invention include a calibration standard for semiconductor metrology tools. The standard comprises a substrate having a surface with a calibration layer formed thereon. A protective layer is formed over the underlying calibration layer. The calibration layer and protective layer are each formed to precise tolerances. The invention also includes methods for forming a calibration standard for semiconductor metrology tools.

Abstract: Optical emission spectra from a test wafer during a plasma process are measured using a spectrometer. The plasma charging voltage retained by (detected by) the test wafer is measured after the process step is completed. The emission spectra are correlated with the plasma charging voltage to identify the species contributing to the plasma charging voltage. The optical emission spectra are monitored in real time to optimize the plasma process to prevent plasma charging damage. The optical emission spectra are also monitored to control the plasma process drift.

Abstract: An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a substrate. An underfill is used to encapsulate the solder bumps and form a rigid support layer between the integrated circuit and the substrate. A heatspreader, which has larger planar dimensions than the integrated circuit, is centrally attached to an upper surface of the integrated circuit with a thermally conductive material. Lateral portions of the heatspreader extending beyond the edges of the integrated circuit are attached to the substrate and sides of the integrated circuit by a thermally conductive underfill material. The thermally conductive underfill material thus employed, among other things, provides a robust mechanical support to the heatspreader and integrated circuit structure and eliminates the need for additional support structures such as conventional stiffener rings.

Abstract: A method of forming a reticle is provided. In general, a metal containing material is vaporized through simple vaporization. The metal containing material is condensed on a substrate to form a metal containing layer on the substrate. A patterned photoresist layer is formed over the metal containing layer, defining exposed metal containing layer regions and covered metal containing layer regions. The metal containing layer in the exposed metal containing layer regions is removed from the substrate, while the metal containing layer in the covered metal containing layer regions remains on the substrate to form a metal containing mask. The substrate is plasma etched. The remaining metal containing layer is removed from the substrate.

Abstract: In a storage environment or storage area network having multiple host devices and at least one storage array, the host devices access logical data volumes stored on the storage array through array controllers disposed in the storage array. Multiple host devices can request access to shared ones of the logical data volumes through multiple paths to multiple array controllers, but each logical data volume is controlled or owned by only one array controller at a time. Thus, ownership of shared logical data volumes is transferred between the array controllers as necessary on behalf of the requesting host devices. To prevent ownership transfers from occurring too often, however, ownership of the logical data volumes is made exclusive, or “sticky,” for a period of time after each transfer. During the exclusive ownership period of time, the ownership cannot be transferred.

Abstract: A power integrity analysis integration tool for analyzing the power integrity of a semiconductor layout previously designed using a separate design tool. The power integrity analysis integration tool includes a graphic user interface that is configured to extract layout data from the design tool and perform a transistor-level analysis of the power integrity of the semiconductor layout. A method of designing a semiconductor layout and performing a transistor-level analysis of the power integrity of the semiconductor layout includes, first, using a design tool to design the semiconductor layout, and then using the power integrity analysis integration tool to extract layout data from the design tool and perform a transistor-level analysis of the power integrity of the semiconductor layout.