Patents Assigned to LSI
  • Patent number: 8384205
    Abstract: A method of manufacturing an electronic device package. Coating a first side of a metallic layer with a first insulating layer and coating a second opposite side of the metallic layer with a second insulating layer. Patterning the first insulating layer to expose bonding locations on the first side of the metallic layer, and patterning the second insulating layer such that remaining portions of the second insulating layer on the second opposite side are located directly opposite to the bonding locations on the first side. Selectively removing portions of the metallic layer that are not covered by the remaining portions of the second insulating layer on the second opposite side to form separated coplanar metallic layers. The separated coplanar metallic layers include the bonding locations. Selectively removing remaining portions of the second insulating layer thereby exposing second bonding locations on the second opposite sides of the separated coplanar metallic layers.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventors: Qwai Low, Patrick Variot
  • Patent number: 8385061
    Abstract: The present invention is a system for implementing a meta-disk aggregation model for storage controllers. The system includes a storage controller configured for communicatively coupling with a server. The system further includes a meta-disk drive group having a plurality of disk drives, the meta-disk drive group configured for being communicatively coupled with the storage controller, each of the plurality of disk drives including a drive interface connector. Additionally, each drive interface connector of the plurality of disk drives of the meta-disk drive group is configured for being communicatively coupled to each of the remaining drive interface connectors of the plurality of disk drives, thereby allowing the plurality of disk drives to communicate as a single device with the storage controller.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventors: Sridhar Balasubramanian, Kenneth Hass
  • Patent number: 8382334
    Abstract: A lighting apparatus is shown and described. In one aspect, the lighting apparatus includes a light source, a plate, and frame. The light source can include one or more lighting elements that are in thermal communication with the light source. The plate can have a dissipative portion extending outward from a point of thermal communication between the plate and the light source. The frame can at least partially enclose the light source and may also be in thermal communication therewith.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: February 26, 2013
    Assignee: LSI Industries, Inc.
    Inventors: James G. Vanden Eynden, James P. Sferra, Larry A. Akers, John D. Boyer
  • Patent number: 8384226
    Abstract: A device fabricated on a chip is disclosed. The device generally includes (A) a first pattern and a second pattern both created in an intermediate conductive layer of the chip, (B) at least one via created in an insulating layer above the intermediate conductive layer and (C) a first bump created in a top conductive layer above the insulating layer. The first pattern generally establishes a first of a plurality of plates of a first capacitor. The via may be aligned with the second pattern. The first bump may (i) be located directly above the first plate, (ii) establish a second of the plates of the first capacitor, (iii) be suitable for flip-chip bonding, (iv) connect to the second pattern through the via such that both of the plates of the first capacitor are accessible in the intermediate conductive layer. The first pattern and the second pattern may be shaped as interlocking combs.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventors: Yikui (Jen) Dong, Steven L. Howard, Freeman Y. Zhong, David S. Lowrie
  • Patent number: 8382340
    Abstract: A lighting apparatus is shown and described. In one aspect, the lighting apparatus includes a lighting component and a mounting structure. The lighting component can include a light source, a plate, and a frame. The light source can include one or more lighting elements, such as light emitting diodes. The lighting component can be releasably secured to the mounting structure.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: February 26, 2013
    Assignee: LSI Industries, Inc.
    Inventors: John D. Boyer, Brian D. Cranston, James G. Vanden Eynden
  • Patent number: 8385014
    Abstract: Various embodiments of the present invention provide systems and methods for medium utilization control. As an example, a method for identifying potentially damaged media regions is discussed that includes receiving a data set; performing a data detection process on the data set to yield a detected output and a status value corresponding to the data set; performing a data decoding process on the detected output to yield a decoded output; and identifying a region of a storage medium from which the data set was derived as failing based at least in part on the status value.
    Type: Grant
    Filed: October 11, 2010
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventor: Shaohua Yang
  • Patent number: 8386708
    Abstract: A method for metadata management in a storage system configured for supporting sub-LUN tiering. The method may comprise providing a metadata queue of a specific size; determining whether the metadata for a particular sub-LUN is cached in the metadata queue; updating the metadata for the particular sub-LUN when the metadata for the particular sub-LUN is cached in the metadata queue; inserting the metadata for the particular sub-LUN to the metadata queue when the metadata queue is not full and the metadata is not cached; replacing an entry in the metadata queue with the metadata for the particular sub-LUN when the metadata queue is full and the metadata is not cached; and identifying at least one frequently accessed sub-LUN for moving to a higher performing tier in the storage system, the at least one frequently accessed sub-LUN being identified based on the metadata cached in the metadata queue.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventor: Martin Jess
  • Patent number: 8384165
    Abstract: A method to maintain a well-defined gate stack profile, deposit or grow a uniform gate dielectric, and maintain gate length CD control by means of an inert insulating liner deposited after dummy gate etch and before the spacer process. The liner material is selective to wet chemicals used to remove the dummy gate oxide thereby preventing undercut in the spacer region. The method is aimed at making the metal gate electrode technology a feasible technology with maximum compatibility with the existing fabrication environment for multiple generations of CMOS transistors, including those belonging to the 65 nm, 45 nm and 25 nm technology nodes, that are being used in analog, digital or mixed signal integrated circuit for various applications such as communication, entertainment, education and security products.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventors: Richard J. Carter, Wai Lo, Sey-Shing Sun, Hong Lin, Verne Hornback
  • Patent number: 8387067
    Abstract: A message tracking and verifying system for verifying the correctness of messages being passed may comprise a tracking module for tracking a request message and a verifying module for verifying a response message. The tracking module may be configured to store a calculated source address and a calculated response address range. The verifying module may be configured to obtain an actual source address from the response message and an actual response address range for the response message. The correctness of the response message is determined based on the comparison of the calculated source address with the actual source address and the comparison of the calculated response address range with the actual response address range.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventor: Babu H. Prakash
  • Patent number: 8385144
    Abstract: A method for training an electronic memory may include receiving a first delay value and a second delay value. The first delay value and the second delay value may be associated with a first data strobe indicating when to sample data on a first memory lane of the electronic memory. The method may also include determining a difference between the first delay value and the second delay value. The method may further include receiving a third delay value associated with a second data strobe indicating when to sample data on a second memory lane of the electronic memory. The method may also include determining a fourth delay value for the second memory lane of the electronic memory utilizing the third delay value and the determined difference between the first delay value and the second delay value.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventor: Brandon L. Hunt
  • Patent number: 8386827
    Abstract: Various embodiments of the present invention provide systems and methods for event alignment control. For example, an event alignment control circuit is disclosed that includes a delay table, a flag write controller circuit, and a signal reconstruction circuit. The delay table includes at least a first register and a last register, and is operable to transfer data from the first register to the last register. The flag write controller circuit is operable to receive an indication of assertion of an event flag and to write information relevant to the event flag to the first register of the delay table. The signal reconstruction circuit is electrically coupled to the last register, and reconstructs the event flag based at least in part on the information relevant to the event flag obtained from the last register.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventor: Changyou Xu
  • Patent number: 8385489
    Abstract: Methods and apparatus are provided for wireless channel estimation using interpolation elimination in the Eigen domain. Channel components at known OFDM symbol locations are interpolated to other OFDM symbol locations. Methods and apparatus are provided for interpolating in the Eigen domain between reference signals (i.e., training signals) to estimate the equalizer coefficients with a reduced complexity. In particular, one aspect of the present invention performs the required interpolation before a required matrix inversion in the Eigen domain.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: February 26, 2013
    Assignee: LSI Corporation
    Inventors: Kameran Azadet, Samer Hijazi, Albert Molina, Joe H. Othmer, Ramon Sanchez
  • Publication number: 20130047129
    Abstract: A method of verifying integrated circuit designs, by constructing a series of atomic generators in a staged, hierarchical order, applying a lowest of the hierarchical generator stages to device level test cases of the verification process, applying a highest of the hierarchical generator stages to system level test cases of the verification process, reusing code written for and used in the lowest hierarchical generator stage in a next higher generator stage, creating a constraint scenario in the highest hierarchical generator stage, and injecting the constraint scenario into a next lower generator stage.
    Type: Application
    Filed: October 23, 2012
    Publication date: February 21, 2013
    Applicant: LSI CORPORATION
    Inventor: LSI CORPORATION
  • Publication number: 20130043602
    Abstract: A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.
    Type: Application
    Filed: October 22, 2012
    Publication date: February 21, 2013
    Applicant: LSI Corporation
    Inventor: LSI Corporation
  • Publication number: 20130044475
    Abstract: Luminaires are disclosed that include refractive and/or reflective structures that can provide or distribute lighting for a given area with high uniformity and efficiency. The structures can be used to distribute light from one or more light sources for lighting target areas with a desired light distribution. The lighting structures can be included in light strips or luminaires. Such luminaire can be utilized in place of fluorescent lights and can facilitate quick and easy retrofit for previous fluorescent lighting applications. The disclosed techniques and systems (including components and structures) can be particularly useful when employing one or more LEDs as light sources.
    Type: Application
    Filed: August 19, 2011
    Publication date: February 21, 2013
    Applicant: LSI Industries, Inc.
    Inventor: Daniel C. Hutchens
  • Patent number: 8379711
    Abstract: Methods and apparatus are provided for decision-feedback equalization with an oversampled phase detector. A method is provided for detecting data in a receiver employing decision-feedback equalization. A received signal is sampled using a data clock and a transition clock to generate a data sample signal and a transition sample signal. A DFE correction is obtained for each of the data sample and transition sample signals to generate DFE detected data and DFE transition data. One or more coefficients used for the DFE correction for the transition sample signals are adapted using the DFE transition data.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: February 19, 2013
    Assignee: LSI Corporation
    Inventors: Pervez M. Aziz, Adam B. Healey, Amaresh Malipatil, Lizhi Zhong
  • Patent number: 8380668
    Abstract: Partner mirroring is provided with tray loss protection in an N node storage cluster architecture. A master proxy receives and records broadcasts of nodes in a cluster and selects mirror partners in a round robin fashion, so that even numbered nodes are mirrored with other even numbered nodes and odd numbered nodes are mirrored with other odd numbered nodes. In an N node storage cluster architecture which includes a cluster of dual controllers, tray loss protection is provided using such an odd numbered and even numbered mirror pairing process.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: February 19, 2013
    Assignee: LSI Corporation
    Inventors: Girish Kumar Bk, Arindam Banerjee
  • Patent number: 8377633
    Abstract: The present invention provides methods and apparatus for accomplishing optical direct write phase shift lithography. A lithography system and method are provided wherein a mirror array is configured to generate vortex phase shift optical patterns that are directed onto a photosensitive layer of a substrate. The lithography methods and systems facilitate pattern transfer using such vortex phase shift exposure patterns.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: February 19, 2013
    Assignee: LSI Corporation
    Inventors: Nicholas K. Eib, Ebo H. Croffie, Neal P. Callan
  • Patent number: 8378485
    Abstract: A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: February 19, 2013
    Assignee: LSI Corporation
    Inventors: Mark A. Bachman, John W. Osenbach, Kishor V. Desai
  • Patent number: 8381074
    Abstract: Various embodiments of the present invention provide systems and methods for data processing. For example, a method for data processing is disclosed that includes: providing a data detection circuit including a first detection processing circuit, a second detection processing circuit, a decoder processing circuit, and a memory circuit; performing a data detection algorithm on an input data set by the first detection processing circuit to yield a first detected output; writing a derivative of the first detected output to the memory circuit; accessing the derivative of the first detected output from the memory circuit; performing a decoder algorithm on the derivative of the first detected output using the decoder processing circuit to yield a decoded output; writing the decoded output to the memory circuit; accessing the decoded output from the memory circuit; and performing the data detection algorithm on a combination of the input data set and the decoded output to yield a second detected output.
    Type: Grant
    Filed: May 21, 2010
    Date of Patent: February 19, 2013
    Assignee: LSI Corporation
    Inventors: Kiran Gunnam, Shaohua Yang