Abstract: Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.

Abstract: A light emitting device comprises a first group of one or more LEDs each configured to emit light having a blue color point in the 1931 CIE x,y Chromaticity Diagram, a second group of one or more LEDs each configured to emit light having a cyan or yellow color point in the 1931 CIE x,y Chromaticity Diagram, and a third group of one or more LEDs each configured to emit light having a red color point in the 1931 CIE x,y Chromaticity Diagram.

Abstract: An autostereoscopic 3D display assembly includes pixels configured to generate a first image intended for a user's left eye, and a second image intended for a user's right eye. Each of the images is projected with a respective line pattern, where the bright portions of the left eye line pattern alternate with the bright portions of the right eye line pattern. The left eye and right eye line patterns are formed using a grating or a double grating. In one embodiment, right eye pixels and left eye pixels each include a double grating, with a different offset between the first grating and second grating to generate the different line patterns. In another embodiment, right eye pixels and left eye pixels each include a grating and one or more micro-LEDs, with a different offset between the grating and the micro-LEDs to generate the different line patterns.

Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalk. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.

Abstract: Described is a CMOS power plane including interleaving contact areas, alternating Vled and Vcat contact areas, on at least two long sides of the ?LED display area. By this way, Vled and cathode current are injected uniformly along the four sides of the ?LED display panel. A large cathode current distribution ring on Vled and Vcat circuits is used to distribute the current along the four sides of the panel. The current distribution ring surrounds a pixel die area. An insulated area may be included on the cathode current redistribution ring adjacent one of the of ?bumps.

Abstract: Described is a CMOS power plane including interleaving contact areas, alternating Vled and Vcat contact areas, on at least two long sides of the ?LED display area. By this way, Vled and cathode current are injected uniformly along the four sides of the ?LED display panel. A large cathode current distribution ring on Vled and Vcat circuits is used to distribute the current along the four sides of the panel. The current distribution ring surrounds a pixel die area. An insulated area may be included on the cathode current redistribution ring adjacent one of the of ?bumps.

Abstract: A light-emitting device (LED) module is described. The LED module includes a heatsink, at least one LED on a top surface of the heatsink, and mounting features protruding from the top surface of the heat sink for alignment with an optical component. A thermally insulating material is adjacent at least portions of the mounting features that would otherwise be in contact with the optical component when mounted.

Abstract: An LED module is described herein. The LED module includes a heatsink with an LED mounting area and a referencing part that is separate from the heatsink. The referencing part is fixed to the heatsink and includes an LED alignment feature and an optical component alignment feature. At least one LED is provided on the LED mounting area of the heatsink and aligned with the LED alignment feature of the referencing part.

Abstract: A downconverter layer transfer device, and methods of making and using the downconverter layer transfer device, are disclosed.

Abstract: A display, system and method of providing a display are described. The display includes sets of microLEDs. Each set of microLEDs corresponds to one of a plurality of pixels of the display and produces a combination of light that forms a color of the corresponding one of the pixels. Lenses control an emission angle and emission profile of the light emitted by the sets of microLEDs. Each set of microLEDs has a red microLED that emits red light, a green microLED that emits green light, a blue microLED that emits blue light, and another microLED that emits light along a red-green locus. The red-green locus light is selected to enhance efficiency at a white point to compensate for reduced emission from the red microLED dependent on a size of the red microLED.

Abstract: A LED controller includes an image buffer to hold image data. An LED pixel forming a part of a large pixel array is activatable in response to image data, LDO state, and pulse width modulation module state. A logic module including a pixel diagnostic mode using an LDO bypass is connected to modify LDO state and allow direct addressing of the LED pixel for diagnostic purposes without needing to use image data from the image buffer.

Abstract: This specification discloses LEDs and LED arrays configured such that an electric field may be applied during operation of the device to drive charge carriers (electrons or holes) away from perimeter semiconductor surfaces of the LEDs, thereby reducing non-radiative recombination near those perimeter surfaces. These LEDs and LED arrays comprise (e.g., metal) field plates, arranged around the perimeter surfaces of the LEDs, by which the electric field may be applied. In some variations, the bias voltage applied to the field plates to produce the electric fields may be separately controlled for some, or each, LED in an array. In other variations the bias applied to the field plates is the same for each LED in an array.

Abstract: An optical coupler is described herein. The optical coupler includes at least one optical coupler unit. The at least one optical coupler includes an optical coupler entrance face and an optical coupler exit face. The optical coupler entrance face is configured to face, and receive light emitted by, at least one LED during operation. The optical coupler exit face is shaped as a Fresnel lens with a focal point at or behind a light emitting area of the at least one LED and is configured to face a lightguide entrance face of a slab lightguide. The optical coupler exit face has dimensions that match at least a part of the lightguide entrance face. The optical coupler entrance and exit faces are configured to refract light emitted by the at least one LED during operation.

Abstract: A two-part device, automotive lighting unit and method of manufacture are described herein. A two-part device includes an assembly. The assembly includes a first part having a first fixation face and a second part separate from the first part. The second part has a second fixation face. The first and second parts are arranged adjacent one another with the first fixation face in contact with the second fixation face. The assembly further includes a circlip fixation position that has a rounded shape transverse to the fixation face. The two-part device also includes a circlip, which engages the rounded shape at the circlip fixation position, fixing the first and second parts together.

Abstract: A lighting device and method for manufacturing the lighting device are provided. A substrate contains at least a first surface and a second surface opposing the first surface. Light-sensitive material is provided on the first surface and/or the second surface. The light-sensitive material is exposed to light by applying the light from a light source onto a mask having a periodic pattern of light-attenuating features with interspaced light-permeable features. The light forms a periodic distribution of high intensity regions with interspaced low intensity regions at the first surface and/or the second surface. A periodic structure is formed based on the exposed light-sensitive material and includes light-attenuating features and light-permeable features corresponding to the light-attenuating features and light-permeable features of the mask.

Abstract: Systems, devices and methods are described herein. A device includes a power stage circuit, a switch and a first circuit. The switch is electrically coupled to the power stage circuit. The first circuit is electrically coupled to the power stage circuit and the switch and has a single output. The first circuit is configured to provide a first circuit output voltage at the single output. The first circuit output voltage has a first level on a condition that the power stage circuit is conducting at a peak current level. The first circuit output voltage has a second level on a condition that the power stage circuit is not conducting.

Abstract: Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

Abstract: Multi-color flash with image post-processing that uses a camera device with a multi-color flash and implements post-processing to generate images is described. In one aspect, the multi-color flash with image post-processing may be implemented by a controller configured to control a camera and flashes of at least two different colors. The controller may be configured to cause the camera to acquire a first image of a scene while the scene is being illuminated with the first flash but not the second flash, then cause the camera to acquire a second image of the scene while the scene is being illuminated with the second flash but not the first flash, and generate a final image of the scene in post-processing based on a combination of the first image and the second image.

Abstract: A vehicle headlamp system includes a vehicle supported power and control system including a data bus. A sensor module can be connected to the data bus to provide information related to environmental conditions or information relating to presence and position of other vehicles and pedestrians. A separate headlamp controller can be connected to the vehicle supported power and control system and the sensor module through the bus. The headlamp controller can include an image frame buffer that can refresh held images at greater than 30 Hz speed. An active LED pixel array can be connected to the headlamp controller to project light according to a pattern and intensity defined by the image held in the image frame buffer and a standby image buffer can be connected to the image frame buffer to hold a default image.

Abstract: An LED lighting strip, method of manufacturing an LED lighting strip and an automotive lighting system are described. The LED lighting strip includes at least two outer wires, at least one central wire between the two outer wires, LEDs arranged along the LED lighting strip and electrically coupled at least to the at least two outer wires, and an enclosing member enclosing the at least two outer wires, the at one central wire and the LEDs. The at least two outer wires and the least one central wire have a bend in sections between at least some adjacent LEDs.