Abstract: Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

Abstract: A lighting system is described that includes a first lighting device, a second lighting device and a pattern element. The first lighting device includes at least one individual light-emitting element configured to emit light with a first beam profile. The second lighting device includes at least one individual light-emitting element configured to emit light with a second beam profile such that a third beam profile, different from the first beam profile and the second beam profile, is provided as a combination of the first beam profile and the second beam profile. The pattern element is configured to generate a pattern on at least one of the first beam profile and the second beam profile and a pattern on the third beam profile.

Abstract: A luminescent material is disclosed with emission in the near infrared wavelength range, the luminescent material including Sc1-x-yAyRE:Crx, wherein MO=P3O9, BP3O12, SiP3O12; A=Lu, In, Yb, Tm, Y, Ga, Al, where 0?x?0.75, 0?y?0.9. A wavelength converting structure including the luminescent phosphor is also disclosed.

Abstract: A lighting device, automotive lighting system and method of manufacturing a light device are described. A lighting device includes a mounting portion, at least one first light emitting element, at least one second light emitting element, and at least one optical component. The mounting portion includes at least a central mounting face and at least one lateral mounting face at an angle with respect to the central mounting face. The at least one first light emitting element is mounted on the central mounting face. The at least one second light emitting element is mounted on the at least one lateral mounting face. The at least one optical component is mounted to the mounting portion and configured to adjust an intensity distribution of light emitted from the at least one of the at least one first light emitting element or the at least one second light emitting element.

Abstract: Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. A hard mask layer is above the semiconductor layers, the hard mask layer having a plurality of openings therein, each partially filled with a liner layer and partially filled with a P-metal material plug, the P-metal material plug having a width; and a passivation film is on the hard mask layer, the passivation film having a plurality of passivation film openings therein defining a width, the width of each passivation film opening being less than the width of a combination of the P-metal material plug and the liner layer.

Abstract: A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.

Abstract: Systems, devices, and methods are disclosed in which one or more light sources, a detector, a processor and a controller are configured such that light from the one or more light sources can provide illumination or projections that can reduce accidents while the vehicle is in motion and when parked and may also provide information and illumination to the driver and vehicle occupants when entering or exiting the vehicle. These systems may, for example, provide spot illumination to moving objects or pedestrians on the road surface, with the spot illumination following the moving object. Alternatively or in addition these systems may project images on the ground, for example to communicate information to occupants of the vehicle, to occupants of another vehicle, or to pedestrians.

Abstract: A device is described that includes a carrier that has a plurality of light-emitting diode (LED) mounting areas. Each of the LED mounting areas includes a pair of contact pads, which are electrically coupled to the LED mounting area in a first subset of the plurality of LED mounting areas or electrically connected in series with a shunting element in the respective LED mounting area in a second subset of the plurality of LED mounting areas. In some embodiments, LEDs may be placed in the first subset of the plurality of LED mounting areas.

Abstract: A lighting device includes a carrier having at least one section that has a triangular cross section. The carrier includes at least one mounting portion on an edge of the triangular cross section, and a heat sink body portion adjacent to, and protruding sidewards from, the at least one mounting portion. At least one structure is mounted to the at least one mounting portion. The at least one structure includes at least one mounting face having an arrangement direction. The at least one lighting module is mounted along the arrangement direction on the at least one mounting face. The at least one light guide is optically coupled to the at least one lighting module.

Abstract: An inorganic coating may be applied to bond optically scattering particles or components. Optically scattering particles bonded via the inorganic coating may form a three dimensional film which can receive a light emission, convert, and emit the light emission with one or more changed properties. The inorganic coating may be deposited using a low-pressure deposition technique such as an atomic layer deposition (ALD) technique. Two or more components, such as an LED and a ceramic phosphor layer may be bonded together by depositing an inorganic coating using the ALD technique.

Abstract: A semiconductor light-emitting device includes a junction between doped semiconductor layers, a first set of multiple independent contacts connected to a first doped layer and a second set of one or more contacts connected to the second doped layer. Multiple conductive vias connect the independent contacts to the first doped layer, enabling differing corresponding via currents to be applied to the first doped layer through the vias independent of one another. A spatial distribution of via currents among the multiple vias can be selected to yield a corresponding spatial distribution of emission intensity. Alteration of the via current distribution results in corresponding alteration of the emission intensity distribution; such alterations can be implemented dynamically. Multiple devices can be arranged as a light-emitting array.

Abstract: A method includes mounting a ceramic phosphor on an acrylic-free and metal-containing catalyst-free tacky layer of a dicing tape, dicing the ceramic phosphor from the dicing tape into ceramic phosphor plates, removing the ceramic phosphor plates from the dicing tape, and attaching the ceramic phosphor plates on light-emitting device (LED) dies.

Abstract: A composite array has two two-dimensional arrays on a substrate each having two rows of LEDs. The LEDs in each array have the same orientation as all other LEDs in that array. First electrical traces sequentially couple LEDs in the first string and the second string by beginning at opposite corners of the composite array and alternating between rows of each of the first and second arrays. A second electrical trace couples ends of the first and second strings across rows of the composite array. Third electrical traces route outside the composite array and are coupled, respectively, to a beginning of the first string for the row of the composite array containing the beginning of the first string, a beginning of the second string for the other row, the end of the first LED string for the other row, and electrodes of LEDs in the other row.

Abstract: A first pixel with a first pixel sidewall is disclosed. A second pixel with a second pixel sidewall facing the first pixel sidewall is also disclosed. A first dynamic optical isolation material between the first pixel sidewall and the second pixel sidewall and configured to change an optical state based on a state trigger such that a light behavior at the first pixel sidewall for a light emitted by one of the first pixel and the second pixel is determined by the optical state, is also disclosed.

Abstract: Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area.

Abstract: An apparatus is disclosed including: a light source, a Fresnel lens, and a lens array. The Fresnel lens is disposed upstream from the light source to collimate light output by the light source. The lens array is disposed upstream from the Fresnel lens to mix collimated light that is output from the Fresnel lens. The lens array includes a plurality of optical elements arranged on a substrate. Each optical element includes a respective first planar surface arranged to face towards a different respective portion of the Fresnel lens and a second convex surface arranged to face away from the Fresnel lens.

Abstract: A lighting device according to the invention comprises at least one semiconductor layer; at least one light emission surface comprising an array of high luminance areas configured to emit light at a first local luminance level and low luminance areas configured to emit no light or to emit light at a second local luminance level lower than the first local luminance level; a plurality of semiconductor light emitting devices formed in the semiconductor layer to define the plurality of high luminance areas; wherein the high luminance areas and the low luminance areas are arranged in accordance with a predefined light emission profile of the light emission surface.

Abstract: Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 ?m and less than 10 ?m.

Abstract: Described are light emitting diode (LED) devices including a combination of electroluminescent quantum wells and photo-luminescent active regions in the same wafer. A first group of QWs with shortest emission wavelength is placed between the p- and n-layers of a p-n junction. Other groups of QWs with longer wavelengths are placed outside the p-n junction in a part of the LED structure where electrical injection of minority carriers does not occur. Electroluminescence emitted by the first group of QWs is absorbed by other group(s) and re-emitted as longer wavelength light. The color of an individual die made on the wafer can be controlled by either etching away unwanted groups of longer-wavelength QWs at the position of that die, or keeping them intact. Wavelength-selective mirrors that increase down conversion efficiency may be selectively applied to die where longer wavelength emission is desired.

Abstract: This specification discloses methods of enhancing the stability and performance of Eu2+ doped narrow band red emitting phosphors. In one embodiment the resulting phosphor compositions are characterized by crystallizing in ordered structure variants of the UCr4C4 crystal structure type and having a composition of AE1?xLi3?2yAl1+y?zSizO4?4y?zN4y+z:Eux (AE=Ca, Sr, Ba, or a combination thereof, 0<x<0.04, 0?y<1, 0<z<0.05, y+z?1). It is believed that the formal substitution (Al,O)+ by (Si,N)+ reduces the concentration of unwanted Eu3+ and thus enhances properties of the phosphor such as stability and conversion efficiency.