Abstract: Systems, methods and devices are descried. A method of controlling a segmented flash having a plurality of flash segments each arranged to illuminate a portion of the scene includes determining an amount of light for illuminating each portion of the scene, measuring forward voltages of each of the flash segments, and adjusting a brightness of each of the flash segments to the determined amount of light for illuminating each portion of the scene. The adjusting is performed by at least one of adjusting a magnitude of a drive current to each of the flash segments, adjusting a duty cycle of the drive current to each of the flash segments, or scheduling a dummy flash, based at least in part on the measured forward voltages.

Abstract: An apparatus projecting light onto a projection surface comprises: a substrate having disposed thereon two or more LED clusters and two or more micro-lenses, each LED cluster comprising a plurality of LEDs and each of the micro-lenses being disposed the plurality of LEDs. Each of the LED clusters is arranged to emit light through each of the micro-lenses in a pattern of dots. A center of at least one LED cluster is off-set from an optical center of the micro-lens of its LED cluster. A projected image includes arrangements of individual dots and/or areas of smooth light resulting from the pattern of dots.

Abstract: Described are light emitting diode (LED) devices having patterned substrates and methods for effectively growing epitaxial III-nitride layers on them. A nucleation layer, comprising a III-nitride material, is grown on a substrate before any patterning takes place. The nucleation layer results in growth of smooth coalesced III-nitride layers over the patterns.

Abstract: Light emitting diode (LED) devices comprise: a patterned substrate comprising a substrate body, a plurality of integral features protruding from the substrate body, and a base surface defined by spaces between the plurality of integral features; a selective layer comprising a dielectric material located on the surfaces of the integral features, wherein there is an absence of the selective layer on the base surface; and a III-nitride layer comprising a III-nitride material on the selective layer and the base surface.

Abstract: A lighting circuit and methods of manufacturing and controlling a lighting circuit are described. The lighting circuit includes a first array of semiconductor light sources, a separate second array of semiconductor light sources, and a shared array of semiconductor light sources. A first driver is electrically coupled to provide a first drive current to the first array and the shared array. A second driver is electrically coupled to provide a second drive current to the shared array and the second array.

Abstract: Embodiments of the invention include a wavelength-converting composition as defined by R3-x-y-zAx+yMzSi6-w1Alw1O3x+y+w1N11-7x/3-y-w1?2-2x/3, with ? being vacancies of the structure that are filled by oxygen atoms with 0<x?3, ?3?y<3, 0<z<1,0?w1?6, 0?x+y, x+y+z?3, 11?7/3x?y?w1?0, and 3x+y+w1?13. R is selected from the group comprising trivalent La, Gd, Tb, Y, Lu; A is selected from the group comprising bivalent Ca, Mg, Sr, Ba, and Eu; and M is selected from the group comprising trivalent Ce, Pr and Sm.

Abstract: A light emitting diode module comprising: at least one light emitting diode structure, an integrated reflector arrangement that comprises a reflector surface for reflecting light from a light emitting area of the light emitting diode structure. The integrated reflector arrangement further comprises a back reflection surface for diffusely reflecting light emitted via a side surface of the light emitting diode structure back to the light emitting diode structure. The back reflection surface is directly attached to at least a part of the side surface such that during operation of the light emitting diode module an emission of stray light by means of the side surface is reduced. The invention finally describes a flash module, an automotive front lighting or a projection light emitting diode system comprising at least one light emitting diode module.

Abstract: A nano-structure layer is disclosed. The nano-structure layer includes a plurality of nano-photonic structures that are configured in a first configuration such that light incident upon the nano-structured layer below a cutoff angle passes through the nano-structured layer and light incident upon the nano-structured layer above the cutoff angle is reflected back in direction of the incidence.

Abstract: Segmented LED arrays with various diffusing elements are disclosed. An example segmented LED array includes a plurality of LEDs arranged in a plurality of sections where a given section may include one or more LEDs and where each section may be aligned with a different respective optical element such as a lens. Each LED may be a wavelength-converting LED in that it may include a light emitter arrangement and a wavelength-converter structure. In various embodiments, diffusing elements in the form of one or more structures of a diffuser material may be provided over the wavelength-converter structure of one or more LEDs, the one or more structures being in a light path between the wavelength-converter structure and at least one of the plurality of optical elements, and configured to diffuse light emerging from the wavelength-converter structure.

Abstract: Sidewall reflectors disposed on the sidewalls of an LED or pcLED comprise porous (for example, hollow) high refractive index light scattering particles dispersed in a transparent binder. The porous particles exhibit a high refractive index contrast and corresponding strong scattering at the interfaces between the porous particle material and one or more air-filled voids in each particle. These sidewall reflectors can provide light confinement with thin reflector structures, allowing close spacing between LEDs and pcLEDs, and may be advantageously employed in microLED arrays.

Abstract: A lighting device includes a first LED configured to emit a first light, a second LED configured to emit a third light, a first phosphor disposed over the first LED and second LED, and arranged to absorb a portion of the first light and in response emit a second light of a longer wavelength than the first light, and a second phosphor disposed over the second LED, the second phosphor arranged to absorb a portion of the third light and in response emit a fourth light of a longer wavelength than the third light, and the fourth light exits the second phosphor into the first phosphor, and both the second light and fourth light exit the lighting device though the first phosphor.

Abstract: A device for controlling illumination of a scene using an LED array that includes a plurality of individually addressable LEDs, built into a hand-held device, is disclosed. The device includes a controller arranged to configure a first sub-set of the LEDs to provide illumination for a target spot in the scene and to monitor movement of the hand-held device. If the controller detects movement of the hand-held device while the first sub-set of the LEDs is providing illumination, then the controller may configure a second sub-set of the LEDs to continue providing illumination of the target spot. In this manner, even though there may have been movement that could change the specific area illuminated by the LED array, the movement is compensated for, at least partially, by selecting one or more other LEDs to illuminate the same target spot in a manner that is substantially unnoticeable to the user.

Abstract: A method to produce a light-emitting device package includes mounting junctions on pads of a metalized substrate, where the junctions are at least partially electrically insulated from each other, and forming wavelength converters, where each wavelength converter is located over a different junction and separated by a gap from neighboring wavelength converters.

Abstract: A device for controlling illumination of a scene using an LED array that includes a plurality of individually addressable LEDs, built into a hand-held device, is disclosed. The device includes a controller arranged to configure a first sub-set of the LEDs to provide illumination for a target spot in the scene and to monitor movement of the hand-held device. If the controller detects movement of the hand-held device while the first sub-set of the LEDs is providing illumination, then the controller may configure a second sub-set of the LEDs to continue providing illumination of the target spot. In this manner, even though there may have been movement that could change the specific area illuminated by the LED array, the movement is compensated for, at least partially, by selecting one or more other LEDs to illuminate the same target spot in a manner that is substantially unnoticeable to the user.

Abstract: A light-emitting device includes a semiconductor diode structure with one or more light-emitting active layers, an anti-reflection coating on its front surface, and a redirection layer on its back surface. Active-layer output light propagates within the diode structure. The anti-reflection coating on the front surface increases transmission of active-layer output light incident below the critical angle ?C. Active-layer output light incident on the redirection layer at an incidence angle greater than ?C is redirected to propagate toward the front surface at an incidence angle that is less than ?C. Device output light is transmitted by the front surface to propagate in an ambient medium, and includes first and second portions of the active-layer output light incident on the front surface at an incidence angle less than ?C, the first portion without redirection by the redirection layer and the second portion with redirection by the redirection layer.

Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.

Abstract: A method comprises forming a mask on a first surface of a substrate. The mask is patterned to form openings on the first surface of the substrate. Notches are formed in the first surface of the substrate in the openings. The mask is removed from the first surface of the substrate A plurality of LEDs are provided on the first surface of the substrate and between notches. A second surface of the substrate is thinned to expose the notches and separate the LEDs. The second surface of the substrate is opposite of the first surface of the substrate.

Abstract: A method according to embodiments of the invention includes providing a light emitting semiconductor structure grown on a substrate. The substrate has a front side and a back side opposite the front side. Notches are formed in the substrate. The notches extend from the front side of the substrate into the substrate. After forming notches in the substrate, the back side of the substrate is thinned to expose the notches.

Abstract: This specification discloses a method of enhancing the stability and performance of Eu2+ doped narrow band red emitting phosphors. The resulting phosphor compositions are characterized by crystallizing in ordered structure variants of the UCr4C4 crystal structure type and having a composition of AE1?xLi3?2yAl1+2y?zSizO4?4y?zN4y+z:EUx(AE=Ca, Sr, Ba; 0<x<0.04, 0?y<1, 0<z<0.05, y+z?1). It is believed that the formal substitution (Al,O)+ by (Si,N)+ reduces the concentration of unwanted Eu3+ and thus enhances properties of the phosphor such as stability and conversion efficiency.

Abstract: The invention describes a method of manufacturing an OLED device (1) comprising an OLED (10) and an integrated negative overvoltage protection diode (11), which method comprises at least the steps of: depositing a first OLED electrode (100) and a separate second OLED electrode contact (101C) on a carrier (12), which second OLED electrode contact (101C) incorporates a first overvoltage protection diode electrode (110); depositing an organic material layer stack (14) to define an active region (14OLED) of the OLED (10) and an active region (14OPD) of the overvoltage protection diode (11); depositing a second OLED electrode (101) to extend over the active region (14OLED) of the OLED (10) and the second OLED electrode contact (101C); and depositing a second overvoltage protection diode electrode (111) to extend over the active region (14OPD) of the overvoltage protection diode (11) and the first OLED electrode (100).