Abstract: A backlight apparatus can include a light emitting element configured to emit visible light. The backlight apparatus can include a polarizing device including a prism situated to receive the visible light and to polarize the visible light to generate polarized light. The backlight apparatus can include a light guide panel configured to receive the polarized light at an input surface facing the polarizing device and to distribute the polarized light to a major surface of the light guide panel facing a display screen.

Abstract: Lighting device, in particular for automotive applications, comprising a plurality of lighting elements, wherein each lighting element comprises at least one or more light emitting diodes (LEDs). The lighting device comprises a first connector for connecting the lighting device to a lighting driver. The lighting elements are arranged in a row in order to form a luminous band. The plurality of lighting elements is divided into more than one group, each group consisting of at least one or more lighting elements. The lighting elements of one group are electrically connected in series. The groups are electrically connected in parallel in order to control each group individually.

Abstract: Embodiments of the invention include a luminescent ceramic including (Ba1-xSrx)2-zSi5-yO4yN8-4y:Euz 258 phase wavelength converting material (0.5?x?0.9; 0?y?1; 0.001?z?0.02) and M3Si3O3N4 3334 phase material (M=Ba, Sr, Eu). The M3Si3O3N4 3334 phase material comprises no more than 5 weight % of the material.

Abstract: Embodiments of the invention include a light emitting device, a first wavelength converting material, and a second wavelength converting material. The first wavelength converting material includes a nanostructured wavelength converting material. The nanostructured wavelength converting material includes particles having at least one dimension that is no more than 100 nm in length. The first wavelength converting material is spaced apart from the light emitting device.

Abstract: A device, system and method for producing enhanced external quantum efficiency (EQE) LED emission are disclosed. The device, system and method include a patterned layer configured to transform surface modes into directional radiation, a semiconductor layer formed as a III/V direct bandgap semiconductor to produce radiation, and a metal back reflector layer configured to reflect incident radiation. The patterned layer may be one-dimensional, two-dimensional or three-dimensional. The patterned layer may be submerged within the semiconductor layer or within the dielectric layer. The semiconductor layer is p-type gallium nitride (GaN). The patterned layer may be a hyperbolic metamaterials (HMM) layer and may include Photonic Hypercrystal (PhHc), or may be a low or high refractive index material or may be a metal.

Abstract: A lighting engine, system and method of fabrication are described. The engine contains a chassis having a side wall and bottom surface that define a cavity. A recess is formed in the bottom surface. A flexible printed circuit (FPC) is on the side wall and LEDs are mounted on the FPC to emit light toward a center of the cavity. A light guide positioned within the cavity receives light emitted by the LEDs through an edge of the light guide. A gasket disposed within the recess is in contact with a first surface of the light guide. A reflector within the cavity is adjacent to a second surface of the light guide opposite the first surface of the light guide. A backplate is attached to the chassis and configured to seal the cavity. Other apparatuses, systems, and methods are also disclosed.

Abstract: A lens comprises an elongated shape. The lens has a short axis and a long axis. The lens comprises an upper surface through which a substantial majority of light exits the lens when a light emitting element is situated at or below a base of the lens. The upper surface includes a trough that extends along at least one of the short and the long axis. The upper surface includes a surface of a curved wall that joins the upper surface to the base of the lens. A lower surface of the trough is curved along the short axis and along the long axis. The lower surface of the trough has a curvature along the short axis that differs from a curvature along the long axis.

Abstract: A multi-stage lamination process is used to laminate a wavelength conversion film to a transparent substrate, and subsequently to a light emitting element. The wavelength conversion film may be an uncured phosphor-embedded silicone polymer, and the lamination process includes heating the polymer so that it adheres to the transparent substrate, but is not fully cured. The phosphor-laminated transparent substrate is sliced/diced and the wavelength conversion film of each diced substrate is placed upon each light emitting element. The semi-cured wavelength conversion film is then laminated to the light emitting element via heating, consequently curing the phosphor film. Throughout the process, no glue is used, and the optical losses associated with glue material are not introduced.

Abstract: A system, method and device for use as a reflector for a light emitting diode (LED) are disclosed. The system, method and device include a first layer designed to reflect transverse-electric (TE) radiation emitted by the LED, a second layer designed to block transverse-magnetic (TM) radiation emitted from the LED, and a plurality of ITO layers designed to operate as a transparent conducting oxide layer. The first layer may be a one-dimension (1D) distributed Bragg reflective (DBR) layer. The second layer may be a two-dimension (2D) photonic crystal (PhC), a three-dimension (3D) PhC, and/or a hyperbolic metamaterial (HMM). The 2D PhC may include horizontal cylinder bars, vertical cylinder bars, or both. The system, method and device may include a bottom metal reflector that may be Ag free and may act as a bonding layer.

Abstract: An LED device holder, an LED lighting system and a method of manufacturing an LED lighting system are described herein. An LED lighting system includes a holder defining an aperture. The aperture has a perimeter and a fillet adjacent the perimeter. The fillet has a radius greater than or equal to 2.0 mm and less than or equal to 4.6 mm. An LED array is mechanically coupled to the holder. The LED array has a light emitting surface exposed through the aperture.

Abstract: Described herein is source sensitive optic that uses reconfigurable chip-on-board (CoB) light emitting diode (LED) arrays as light sources. In an implementation, the reconfigurable CoB LED array includes a predetermined number of LEDs that are configurable for a variety of illumination scenarios. In an implementation, the reconfigurable CoB LED array is multiple CoB LED arrays that are configured for use with the source sensitive optic as described herein. The source sensitive optic includes surface shapes that are responsive to the reconfigurable CoB LED array. The source sensitive optic is configured to provide beam profile and radiation pattern differentiation based on a CoB LED array configuration configured from the reconfigurable CoB LED. Each configurable CoB LED array configuration radiates a different beam pattern via the surface shapes due to proximity and surface shape geometries.

Abstract: A light source includes an array of light emitters, with at least some light emitters having a central patterned surface and an unpatterned border; a light blocking metal layer positioned between each of the array of light emitters; and down-converter material positioned on each of the array of light emitters.

Abstract: Pixelated array light emitters are formed with closely-spaced pixels having ultra-smooth sidewalk. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.

Abstract: Methods of manufacturing a system are described. A method includes attaching a silicon backplane to a carrier and molding the silicon backplane on the carrier such that a molding material surrounds side surfaces of the silicon backplane to form a structure comprising a substrate with an embedded silicon backplane. The structure has a first surface opposite the carrier, a second surface adjacent the carrier, and side surfaces. At least one via is formed through the molding material and filled with a metal material. A metal layer is formed on a central region of the first surface of the structure. Redistribution layers are formed on the first surface of the structure adjacent the metal layer.

Abstract: Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.

Abstract: LED lighting systems and vehicle headlamp systems are described. An LED lighting system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces. First redistribution layers are provided on the top surface of the silicon backplane and the top surface of the substrate. Second redistribution layers are provided on the bottom surface of the silicon backplane and the bottom surface of the substrate. At least one via extends through the substrate between the first redistribution layers and the second redistribution layers and is filled with a metal material.

Abstract: Systems, methods and devices are for optical imaging are described. A system includes a light source and a light detection unit. The light source includes a light-emitting device and a first spectral filter opposite the light emitting device. The first spectral filter includes at least one dielectric filter and has a first angular dependence of a transmission passband. The light source further includes at least one reflector adjacent side surfaces of the light emitting device. The light detection unit includes an optical sensor and a second spectral filter opposite the optical sensor. The second spatial filter has a second angular dependence of a transmission passband that is matched to the first angular dependence.

Abstract: A LED controller for an LED pixel array includes a switch K1 activated in response to a row and column select signal; a switch K2 activated in response to a pulse width modulation duty cycle; and a switch K3 providing a current source from Vbias. Pixel activation is determined at least in part by state of switch K1 and K2. In operation, the LED pixel in the LED pixel array is selected by switch K1 and a fault determination for the LED pixel is made based on determined Vf on a Vf bus.

Abstract: One or more light sources, one or more detectors, a processor, and a controller are configured to provide spot illumination that follows a moving object, a moving occupant, or a portion of a moving occupant in the vehicle.

Abstract: Embodiments of the invention include a flip chip semiconductor light emitting device and a wavelength converting structure disposed in a path of light extracted from the flip chip semiconductor light emitting device. A substrate with a textured top surface is positioned with the bottom surface facing the wavelength converting structure. The wavelength converting structure is disposed between the substrate and the flip chip semiconductor light emitting device.