Abstract: A method and system for detecting anomalies in waveforms in an industrial plant. During a learning stage, one or more training waveforms are received from sensors monitoring a plurality of equipment in the industrial plant. The one or more training waveforms are used to generate a representative waveform and deviations of the one or more training waveforms from the representative waveform are determined. Based on the deviations, groups are created. A model may be associated with each group for building an expected waveform pattern. When test waveforms are received, based on the electrical and physical properties of the test waveforms, each test waveform is classified into one of the groups. Thereafter, each waveform is compared with the expected waveform pattern associated with the group to which the respective test waveform belongs, to detect the anomaly.

Abstract: A semiconductor device according to an embodiment includes an N-well region, a first gate electrode, a single-crystal first semiconductor, and a first contact. The N-well region includes two P-type impurity diffusion regions. The first gate electrode is provided above the N-well region between the two P-type impurity diffusion regions. The first gate electrode is opposed to the N-well region via a gate insulating film. The single-crystal first semiconductor is provided in a columnar shape on the P-type impurity diffusion region. The first contact includes a polycrystalline second semiconductor. The second semiconductor is provided on the first semiconductor and includes P-type impurities.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control unit. The memory cell array includes a plurality of memory cells arranged in a matrix. The control unit erases data of the memory cells. The control unit interrupts the erase operation of the memory cells and holds an erase condition before the interrupt in accordance with a first command during the erase operation, and resumes the erase operation based on the held erase condition in accordance with a second command.

Abstract: In one embodiment, a method for managing overprovisioning in a solid state storage drive array comprises receiving usage data from each of a plurality of solid state storage drives, determining a predicted service life value for each of the plurality of solid state storage drives based on at least the usage data, comparing each of the predicted service life values with a predetermined service life value for each respective solid state storage drive, and dynamically adjusting an available logical storage capacity for at least one of the plurality of solid state storage drives based on a result of the step of comparing.

Abstract: According to one embodiment, a memory system manages a plurality of management tables corresponding to a plurality of first blocks in a nonvolatile memory. Each management table includes a plurality of reference counts corresponding to a plurality of data in a corresponding first block. The memory system copies a set of data included in a copy-source block for garbage collection and corresponding respectively to reference counts belonging to a first reference count range to a first copy-destination block, and copies a set of data included in the copy-source block and corresponding respectively to reference counts belonging to a second reference count range having a lower limit higher than an upper limit of the first reference count range to a second copy-destination block.

Abstract: According to embodiments, a semiconductor memory device includes a plurality of control gate electrodes laminated above a substrate and extend in a first direction and a second direction, and a memory pillar that has one end connected to the substrate, has longitudinally a third direction intersecting with the first direction and the second direction, and is opposed to the plurality of control gate electrodes. The memory pillar includes a core insulating layer and a semiconductor layer arranged around the core insulating layer. The semiconductor layer includes a first portion and a second portion positioned at a substrate side of the first portion. A width in the first direction or the second direction of the semiconductor layer at at least a part of the first portion is larger than a width in the first direction or the second direction of the second portion.

Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

Abstract: According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Abstract: In one embodiment, a semiconductor device includes a first substrate including first and second regions on its surface, a first control circuit on the first substrate in the first region, a first memory cell array above the first control circuit in the first region and connected to the first control circuit, and a first pad above the first memory cell array in the first region and connected to the first control circuit. The device further includes a second control circuit on the first substrate in the second region, a second memory cell array above the second control circuit in the second region and connected to the second control circuit, a second pad above the second memory cell array in the second region and connected to the second control circuit, and a connection line above the first and second memory cell arrays and connecting the first and second pads.

Abstract: An electronic apparatus includes a first board, a second board, a housing, and a first thermal conductive assembly. The housing accommodates the first board and the second board. The first thermal conductive assembly connects a face of the first board, the face of the first board fronting a region between the first board and the second board, to a first face of the housing or a second face of the housing. The first face is opposed to the first board, the second face is opposed to the second board.

Abstract: According to the embodiment, a semiconductor memory device includes a first conductive layer, a second conductive layer, a first memory cell, a second memory cell, a third conductive layer, a first contact, a intermediate memory cell, a fourth conductive layer, a third memory cell, a fifth conductive layer, and a second contact. The third conductive layer is separated from the first conductive layer and the second conductive layer in a third direction crossing a first direction and crossing a second direction and extends in the second direction. The fifth conductive layer is separated from the second conductive layer in the third direction and extends in the second direction. A first length of the second conductive layer along the second direction is shorter than a second length of the fifth conductive layer along the second direction.

Abstract: According to one embodiment, a semiconductor memory device includes a first conductive layer, a first semiconductor body, a second semiconductor body, a first memory layer, and a second memory layer. The first conductive layer includes first to fourth extension regions, and a first connection region. The first extension region extends in a first direction. The second extension region extends in the first direction and is arranged with the first extension region in the first direction. The third extension region extends in the first direction and is arranged with the first extension region in a second direction crossing the first direction. The fourth extension region extends in the first direction, is arranged with the third extension region in the first direction, and is arranged with the second extension region in the second direction.

Abstract: A semiconductor memory device includes a connecting member including a semiconductor material, a first electrode film, a first insulating film, a stacked body and three or more semiconductor pillars. The stacked body includes second electrode films and second insulating films that alternately stacked. The semiconductor pillars are arrayed along two or more directions, extend in a stacking direction, pierce through the stacked body and the first insulating film, and are connected to the connecting member. The device includes a third insulating film provided between the semiconductor pillars and the stacked body and between the connecting member and the first electrode film. A charge storage layer is provided at least between one of the second electrode films and the third insulating film.

Abstract: A semiconductor memory according to an embodiment includes a first conductor, a first insulator and memory pillars. The first conductor and the first insulator are alternately stacked along a first direction. The memory pillars penetrates through the stacked first conductor and first insulator. Each of the memory pillars include a semiconductor, a tunnel insulating film, a second insulator, and a block insulating film. The memory pillars include a first memory pillar. The stacked first insulator includes a first layer and a second layer that are adjacent to each other in the first direction. The first conductor between the first layer and the second layer includes a first conductive part, a second conductive part, and a first dissimilar conductive part.

Abstract: According to one embodiment, a semiconductor memory device includes a first conductor extending in a first direction, bit lines, sense amplifiers, and a second conductor extending in the first direction. A plurality of first memory cells being connected to the first conductor. The bit lines respectively connected to the first memory cells. The first sense amplifiers are respectively connected to a plurality of first bit lines included in the bit lines, each of the first sense amplifiers including a first sense node, and a first transistor connected between the first sense node and a corresponding one of the first bit lines. The second conductor function as gate electrodes of the first transistors included in the first sense amplifiers.

Abstract: A semiconductor memory device according to an embodiment, includes a plurality of semiconductor pillars extending in a first direction and being arranged along a second direction crossing the first direction, two interconnects extending in the second direction and being provided on two sides of the plurality of semiconductor pillars in a third direction crossing the first direction and the second direction, and an electrode film disposed between each of the semiconductor pillars and each of the interconnects. The two interconnects are drivable independently from each other.

Abstract: According to one embodiment, there is provided a nonvolatile memory including a memory cell array, as input/output buffer, one or more intermediate buffers, and a control circuit. The memory cell array includes a plurality of pages. Each of the one or more intermediate buffers is electrically connected between the memory cell array and the input/output buffer. The control circuit is configured to store, in a first intermediate buffer, data read through sensing operation from a first page out of the plurality of pages in accordance with a first command that includes a sensing operation instruction and designation of the first intermediate buffer among the one or more intermediate buffers.

Abstract: According to the embodiments, a nonvolatile memory device is configured to store a normal operating system, and store a bootloader. A host device is capable of initiating the normal operating system by using the bootloader. The host device is configured to determine whether a first condition is established based on information obtained from the nonvolatile memory device; and rewrite, when determined the first condition is established, the bootloader so that an emergency software is initiated when booting the host device. The emergency software is executed on the host device. The host device is capable of issuing only a read command to the nonvolatile memory device under a control of the emergency software.

Abstract: A semiconductor memory device includes a semiconductor substrate including a diode formed in an upper layer portion of the semiconductor substrate, a first insulating film provided above the semiconductor substrate, a first conductive film provided above the first insulating film and coupled to the diode, a stacked body provided above the first conductive film, an insulator and an electrode film being stacked alternately in the stacked body, a semiconductor member piercing the stacked body and being connected to the first conductive film, and a charge storage member provided between the electrode film and the semiconductor member.

Abstract: A method includes enabling, by a processor, a user to create indication of configuration of a virtual subsystem. The processor enables the user to create, in the indication of configuration of the virtual subsystem, indication of a namespace associated with one of storage devices, indication of a controller, indication of a host, and indication of connectivity between a controller and a namespace or between a host and a namespace. The processor enables the user to select the indicated controller and the indicated namespace, select the indicated host and the indicated controller, and create, in the indication of configuration of virtual subsystem, indication of connectivity between the controller and the namespace and indication of connectivity between the host and the controller. The processor implements the configuration of the virtual subsystem in an appliance to cause the appliance to provide the host with storage access to the namespace via the controller.