Abstract: A measuring system having a first magnetic field sensor, an encoder, and an evaluation circuit. The first magnetic field sensor and the second magnetic field sensor and the third magnetic field sensor are connected to the encoder. The evaluation circuit has a logic, which is set up to determine the position of the encoder based on a first measurement signal of a first magnetic field sensor and a second measurement signal of a second magnetic field sensor and a third measurement signal of a third magnetic field sensor.

Abstract: A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.

Abstract: A method for increasing the reliability of transducers, having a first and a second IC, the two ICs have exactly the same or substantially the same monolithically integrated circuit components, each with a sensor and a signal contact designed for bidirectional data transmission and a reference contact and a supply voltage contact. A signal generated as a function of the physical quantity sensed by the relevant sensor is applied to the signal contact. The signal of the first IC is compared with the signal of the second IC by a monitoring device, and then the result of the comparison is communicated to an enable device, and the signal of the first IC is sent by an enable device to the control unit if both signals lie in a predefined useful band.

Abstract: A voltage regulator, having a control element, having a current feedback circuit, having a negative voltage feedback circuit, having a component for switching between a first mode as a switching regulator and a second mode as a linear regulator and for generating a digital control signal for triggering the control element in the first mode as a switching regulator based on a sum variable, and for generating a linear control signal for triggering the control element in the second mode as a linear regulator based on the sum variable, whereby in the first mode as a switching regulator and in the second mode as a linear regulator, a first output of the current feedback circuit and a second output of the negative voltage feedback circuit are coupled to form the sum variable.

Abstract: A measuring system is provided that includes a magnetic field sensor array, an evaluation circuit for evaluating measurement signals of the magnetic field sensor array, and a rotatable encoder that has a mass element to change a magnetic field vector in the magnetic field sensor array. The encoder has a spring element in which the mass element is attached to the spring element. The encoder has a linear guide, and the mass element is guided in a radial direction in the linear guide such that during a rotation of the encoder the mass element can be moved by centrifugal force and the centrifugal force works against the spring force of the spring element. The magnetic field sensor array is arranged toward the encoder to measure a change, caused by the movement of the mass element, in the magnetic field vector.

Abstract: A method for testing a signal path of a first IC formed as a monolithically integrated circuit on a semiconductor body together with a magnetic field sensor and has a signal output and a power supply connection and a test mode state and a normal operating state. A power supply of the first IC is switched off, and a signal output is connected with a reference potential, and the power supply of the first IC is switched on and the signal output is disconnected from the reference potential. Subsequently in a test mode state, a self-test is performed in the first IC and a test pattern is configured at the signal output or at the power supply connection and the test pattern is evaluated by the control unit for testing of the signal path.

Abstract: A method for a deterministic selection of a sensor from a plurality of sensors, having a control unit and multiple sensors connected to the control unit by means of a three-wire bus, wherein the sensors are connected to the three-wire bus through at least two lines in parallel to one another, and a protocol frame in conformity with the SENT specification is used between the control unit and the sensors for a data exchange, and a particular sensor is selected within the protocol frame by the control unit through the predefined duration of a selection signal, wherein the duration of the selection signal is determined by the interval between a first falling signal edge and a second falling signal edge.

Abstract: A device for evaluating a magnetic field with an integrated circuit with a magnetic field sensor is provided, which has a first connection, a second connection, and a third connection led out from the housing. A signal conditioning circuit is connected to the magnetic field sensor. A control circuit generates a control signal for controlling the signal conditioning circuit based on a detected transmission signal with a detection circuit for detecting the transmission signal. The signal conditioning circuit generates an analog signal based on a sensor signal and based on the control signal. An evaluation circuit evaluates the analog signal and compares the analog signal to a default value to adjust the signal conditioning circuit via the digital transmission signal such that the analog signal corresponds to the default value.

Abstract: A measuring system having a first magnetic field sensor, a second magnetic field sensor, an encoder, and an evaluation circuit to which the first magnetic field sensor and the second magnetic field sensor are connected. The evaluation circuit generates a first signal and a second measurement signal. The encoder generates a second magnetic field change with a second periodicity. The evaluation circuit generates a second signal with the second periodicity from the first measurement signal of the first magnetic field sensor and the second measurement signal of the second magnetic field sensor according to an absolute value function.

Abstract: An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.

Abstract: A method for increasing a reliability of a transducer is provided. The transducer has a first and a second IC, wherein the two ICs each have substantially the same monolithically integrated circuit components with one sensor apiece, and a signal contact for bidirectional data transmission. A reference contact on each of the two ICs is connected to or disconnected from the signal contact by a controllable switch, and a signal generated as a function of the physical quantity sensed by the relevant sensor is applied to the signal contact. The two ICs are integrated into a common IC package, and a supply voltage contact of the first IC is connected to a first package contact, and the first package contact is connected to a first terminal of a control unit, and the supply voltage contact of the second IC is connected to a second package contact.

Abstract: A magnetic field measuring device includes a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having two magnetic field sensors, spaced a distance apart on the surface, and the magnetic field sensors each measuring one z component of a magnetic field. A first magnet has a planar main extension surface formed in a second x-y plane, the direction of magnetization changing from a north pole to a south pole along the main extension surface on a symmetry surface of the magnet. One of the two magnetic field sensors being disposed in the vicinity of the north pole and the other of the two magnetic field sensors being situated in the vicinity of the south pole, so that signals having opposite polarities with respect to each other are formed in a z component of the magnetic field.

Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.

Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.

Abstract: A measuring system and drive system with a measuring system, a magnet, a transmitter, and a magnetic field sensor. The magnetic field sensor is arranged between the magnet and the transmitter. The transmitter has a number of segments made of a magnetically conductive material, each segment having a wing shape with a web edge that is radially directed outwards, each web edge being diagonally designed towards the rotational direction, and that each web edge is distanced from the magnetic field sensor by an air gap.

Abstract: A Hall effect sensor with multiple Hall effect elements, each of the Hall effect elements having a first contact terminal, a second contact terminal, and a third contact terminal arranged along a straight line. The multiple Hall effect elements are electrically connected in series in a closed circuit. The second contact terminals of the Hall effect elements are supply voltage connections or Hall voltage pickoffs, and the applicable second contact terminal of the Hall effect element is a center contact of the Hall effect element. The Hall effect elements form two pairs, and the Hall effect elements of one pair each measure the same component of a magnetic field and an operating current is impressed on the series circuit in the two Hall effect elements of this one pair, and a supply voltage is applied to the Hall effect elements of the other pair.

Abstract: An arrangement for testing integrated circuits includes an integrated test circuit and a cluster which has at least one integrated circuit and a second integrated circuit. The first integrated circuit is provided in a first component region of a wafer, and the second integrated circuit in a second component region. The first component region and the second component region are spaced a distance apart by a scribe line of the wafer. The integrated test circuit is connected to the first integrated circuit via a first test line section, and the second integrated circuit is connected to the first test line section via a first connecting line that has a first well in the semiconductor material, the first well extending continuously in the wafer from the first component region over the scribe line to the second component region, the first well being electrically insulated from a substrate of the wafer.

Abstract: A magnetic field measuring device having a semiconductor body with a surface parallel to an x-y plane and having a magnet with a flat main extension surface parallel to the x-y plane, the direction of magnetization changes along the main extension surface due to at least two adjacent magnetic poles, the magnet being rotatable relative to the IC package about an axis of rotation extending in a z direction and the z direction being orthogonal to the x-y plane. An imaginary extension of the axis of rotation passes through the magnet. The semiconductor body has three magnetic field sensors spaced apart from one another on the surface, and each of the magnetic field sensors measures the same component of the magnetic field. All magnetic field sensors are located along the imaginary extension of the axis of rotation within the projection of the main extension surface.

Abstract: A Hall sensor including multiple Hall elements which have a first terminal contact and a second terminal contact and a third terminal contact, the multiple Hall elements being electrically connected in series. The first terminal contacts and the third terminal contacts of the individual Hall elements are connected to each other, and the second terminal contacts of the Hall elements are supply voltage terminals or as Hall voltage taps. A beginning of a first branch being electrically connected in series to an end of a second branch, in such a way that the direction of the current flow through the Hall elements of the first branch is counter to the direction of the current flow through the Hall elements of the second branch.

Abstract: A magnetic field sensor device having a semiconductor body, whereby the semiconductor body has a top side and a bottom side, and whereby the semiconductor body has a substrate layer and a passivation layer formed above the substrate on the top side of the semiconductor body, and one or more integrated electronic components are formed in the substrate layer of the semiconductor body, and a Hall plate is provided on the top side of the semiconductor body above the passivation layer, and the Hall plate is formed of a graphene compound.