Patents Assigned to Micronas GmbH
  • Current sensor and method for detecting a currentless state
    Patent number: 8841906
    Abstract: A current sensor having a magnetic field sensor, and a variable current source connected to the magnetic field sensor, and a first differential amplifier, connected to the magnetic field sensor, for amplifying a first sensor voltage. A second differential amplifier is provided and the second differential amplifier is connected to the first differential amplifier and to the current source. In the case of the first sensor voltage, a first operating current is present at the magnetic field sensor and in the case of a second sensor voltage, a second operating current is present, whereby the second Hall voltage is smaller than the first sensor voltage and the second operating current is greater than the first operating current.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: September 23, 2014
    Assignee: Micronas GmbH
    Inventors: Klaus Heberle, Joerg Franke
  • Integrated passive component
    Patent number: 8836063
    Abstract: An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, a passivation layer formed on the surface, an integrated circuit formed near the surface of the semiconductor body, whereby the integrated circuit is connected to metal surfaces via traces formed below the passivation layer, a part of the metal surfaces is connected to pins via bonding wires, and a first coil formed above the passivation layer, whereby the first coil with a plurality of turns has a longitudinal axis formed substantially parallel to the surface of the semiconductor body, and in a lower part of the first coil, said part which is formed substantially parallel to the longitudinal axis of the coil on the surface of the semiconductor body, parts of a plurality of turns are formed as sections of traces.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: September 16, 2014
    Assignee: Micronas GmbH
    Inventor: Joerg Franke
  • Integrated passive component
    Patent number: 8836062
    Abstract: An integrated passive component having a semiconductor body, arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, and an integrated circuit formed on the surface of the semiconductor body, whereby the integrated circuit is connected by traces to the metal surfaces, and having a dielectric passivation layer formed on the surface, and the metal surfaces are connected to pins by bonding wires, and a first coil former, formed above the dielectric layer, with a winding, whereby the winding has a first connector and a second connector, and whereby the winding is formed as a wire or litz wire and the first connector of the winding is connected to a first metal surface and the second connector to a second metal surface.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: September 16, 2014
    Assignee: Micronas GmbH
    Inventor: Joerg Franke
  • Semiconductor housing and method for the production of a semiconductor housing
    Patent number: 8822253
    Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: September 2, 2014
    Assignee: Micronas GmbH
    Inventors: Tobias Kolleth, Pascal Stumpf, Christian Joos
  • FUEL CELL AND PROCES FOR MANUFACTURING A FUEL CELL
    Publication number: 20140205927
    Abstract: The present invention pertains to a fuel cell with a storage unit (4) for storing hydrogen (Hx), with a proton conductive layer, which covers a surface of the storage unit (4), and with a cathode (7) on a side of the proton conductive layer, which side is located opposite, wherein the storage unit (4) is directly coupled with an anode and/or the storage unit (4) is incorporated in a substrate (1) of a semiconductor. The storage unit (4) is preferably connected to the substrate (1) at least via a stress compensation layer (3).
    Type: Application
    Filed: March 21, 2014
    Publication date: July 24, 2014
    Applicant: Micronas GmbH
    Inventors: Mirko LEHMANN, Claas MUELLER, Holger REINECKE, Mirko FRANK, Gilbert ERDLER
  • MEASURING SYSTEM
    Publication number: 20140197820
    Abstract: A measuring system having a first magnetic field sensor, an encoder, and an evaluation circuit. The first magnetic field sensor and the second magnetic field sensor and the third magnetic field sensor are connected to the encoder. The evaluation circuit has a logic, which is set up to determine the position of the encoder based on a first measurement signal of a first magnetic field sensor and a second measurement signal of a second magnetic field sensor and a third measurement signal of a third magnetic field sensor.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 17, 2014
    Applicant: Micronas GmbH
    Inventors: Joachim RITTER, Joerg FRANKE
  • CIRCUIT AND MEASURING SYSTEM
    Publication number: 20140197822
    Abstract: A measuring system having a first magnetic field sensor, a second magnetic field sensor, an encoder, and an evaluation circuit to which the first magnetic field sensor and the second magnetic field sensor are connected. The evaluation circuit generates a first signal and a second measurement signal. The encoder generates a second magnetic field change with a second periodicity. The evaluation circuit generates a second signal with the second periodicity from the first measurement signal of the first magnetic field sensor and the second measurement signal of the second magnetic field sensor according to an absolute value function.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 17, 2014
    Applicant: Micronas GmbH
    Inventors: Joachim RITTER, Joerg FRANKE
  • MEASURING SYSTEM
    Publication number: 20140197821
    Abstract: A measuring system having a first magnetic field sensor, a second magnetic field sensor, a third magnetic field sensor, an encoder, and an evaluation circuit to which the first magnetic field sensor, the second magnetic field sensor, and the third magnetic field sensor are connected. The evaluation circuit is configured to determine the position of the encoder based on a first measurement signal of the first magnetic field sensor and a second measurement signal of the second magnetic field sensor and a third measurement signal of the third magnetic field sensor.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 17, 2014
    Applicant: Micronas GmbH
    Inventors: Joachim RITTER, Joerg FRANKE
  • MEASURING SYSTEM
    Publication number: 20140191749
    Abstract: A measuring system is provided that includes a magnetic field sensor array, an evaluation circuit for evaluating measurement signals of the magnetic field sensor array, and a rotatable encoder that has a mass element to change a magnetic field vector in the magnetic field sensor array. The encoder has a spring element in which the mass element is attached to the spring element. The encoder has a linear guide, and the mass element is guided in a radial direction in the linear guide such that during a rotation of the encoder the mass element can be moved by centrifugal force and the centrifugal force works against the spring force of the spring element. The magnetic field sensor array is arranged toward the encoder to measure a change, caused by the movement of the mass element, in the magnetic field vector.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 10, 2014
    Applicant: Micronas GmbH
    Inventor: Yan BONDAR
  • Method for the production of a fixed connection between two layers of a multilayer system, and multilayer system
    Patent number: 8759981
    Abstract: A multilayer system includes first and second functional layers, for example, semiconductor layers. A third or intermediate layer is disposed between the first and second functional layers and adheres relatively well to the first and second layers yet has relatively little or no detrimental effect on the functionality of the first and second layers. The third layer is applied to the first layer. Anchoring elements are provided which are partly embedded in the third layer, and the second layer is secured to the third layer by the anchoring elements. This structure yields good adhesion between the three layers, because the third layer adheres relatively well to the first layer and the third layer and the second layer are mechanically bonded together relatively strongly by the anchoring elements.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: June 24, 2014
    Assignee: Micronas GmbH
    Inventors: Heinz Peter Frerichs, Herbert Verhoeven
  • MAGNETIC FIELD SENSOR
    Publication number: 20140159178
    Abstract: A magnetic field sensor having a support with a top side and a bottom side, whereby a Hall plate is provided on the top side of the support and the Hall plate comprises a carbon-containing layer.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 12, 2014
    Applicant: Micronas GMBH
    Inventor: Joerg FRANKE
  • BRIDGE CIRCUIT WITH IMPROVED FAIL-SAFETY
    Publication number: 20140139044
    Abstract: A bridge circuit with improved fail-safety, having a first electrical load with a first contact terminal and a second contact terminal, and a first series circuit connected to a first node and to a second node. A second series circuit is connected to a third node and to a fourth node. A third series circuit is connected to the second node and to a fifth node. A fourth series circuit is connected to the fourth node and to a sixth node. The first node and the third node are connected to a supply voltage, and the fifth node and the sixth node are connected to a reference voltage, and the first contact terminal is connected to the second node and the second contact terminal is connected to the fourth node.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 22, 2014
    Applicant: Micronas GmbH
    Inventor: Stefan ALBRECHT
  • Fuel cell and process for manufacturing a fuel cell
    Patent number: 8715884
    Abstract: The present invention pertains to a fuel cell with a storage unit (4) for storing hydrogen (Hx), with a proton conductive layer, which covers a surface of the storage unit (4), and with a cathode (7) on a side of the proton conductive layer, which side is located opposite, wherein the storage unit (4) is directly coupled with an anode and/or the storage unit (4) is incorporated in a substrate (1) of a semiconductor. The storage unit (4) is preferably connected to the substrate (1) at least via a stress compensation layer (3).
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: May 6, 2014
    Assignee: Micronas GmbH
    Inventors: Mirko Lehmann, Claas Muller, Holger Reinecke, Mirko Frank, Gilbert Erdler
  • Semiconductor chip and method for generating pulse edges, assigned synchronously to the movement of a mechanical part
    Patent number: 8680847
    Abstract: In a method for generating pulse edges, assigned synchronously to the movement of a mechanical part, a magnetic field is generated. At least two measuring signals phase-shifted to one another for the magnetic field are detected. The magnetic field is changed as a function of the movement of the mechanical part in such a way that the measuring signals are modulated. A first measuring signal is compared with at least one first reference value. A second measuring signal is compared with at least one second reference value and/or the value of the first measuring signal is compared with the value of the second measuring signal. When at least one of these comparisons produces an agreement or the result of the relevant comparison changes its sign, a pulse edge is generated.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: March 25, 2014
    Assignee: Micronas GmbH
    Inventors: Joerg Franke, Klaus Heberle
  • Lead frame magazine cover
    Patent number: 8678191
    Abstract: The invention relates to a lead frame magazine cover for closing of an opening of a lead frame magazine by insertion of a magazine cover into the lead frame magazine in a closing direction. The lead frame magazine cover includes a recess. The recess is constructed in the region of a front edge of the magazine cover in the closing direction of the magazine cover.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: March 25, 2014
    Assignee: Micronas GmbH
    Inventors: Juergen Guentert, Bernard Schuhler
  • Fastening device
    Patent number: 8669662
    Abstract: A fastening device is provided that includes a semiconductor body with an integrated circuit, and a dielectric passivation layer formed on the surface of the semiconductor body, and a trace formed underneath the passivation layer, and an oxide layer formed beneath the trace, and a connecting component that forms a frictional connection between a component formed above the passivation layer and the semiconductor body, wherein a formation passing through the passivation layer and the oxide layer and having a bottom surface is formed, and a conductive layer is formed on the bottom surface and the connecting component forms an electrical connection between the conductive layer and the component.
    Type: Grant
    Filed: December 2, 2012
    Date of Patent: March 11, 2014
    Assignee: Micronas GmbH
    Inventors: Christoph Wilbertz, Heinz-Peter Frerichs, Tobias Kolleth
  • Magnetic pressure sensor
    Patent number: 8664732
    Abstract: A magnetic pressure sensor is provided that includes a semiconductor body with a top side and a back side, a Hall sensor formed on the top side of the semiconductor body, a spacer connected to the semiconductor body, whereby the spacer has a recess in the center, and a membrane covering the recess, whereby the membrane has a first material and has a ferromagnetic substance. The ferromagnetic substance concentrates a magnetic flux density of a source formed outside the ferromagnetic material, and the spacer is formed as a circumferential wall and has a second material and the second material is different from the first material in at least one element.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: March 4, 2014
    Assignee: Micronas GmbH
    Inventor: Gibert Erdler
  • SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUCTOR HOUSING
    Publication number: 20140057395
    Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.
    Type: Application
    Filed: November 1, 2013
    Publication date: February 27, 2014
    Applicant: Micronas GmbH
    Inventors: Tobias KOLLETH, Pascal STUMPF, Christian JOOS
  • METHOD FOR DETERMINING AN ANGLE OF ROTATION
    Publication number: 20140046625
    Abstract: A method for determining an angle of rotation between a sensor array and a magnetic field of a magnet, whereby the magnetic field is formed substantially parallel and perpendicular to the rotation axis, and the magnet is arranged rotationally symmetric relative to the rotation axis. A first measurement signal and a second measurement signal are generated by the two subsensors of the first magnetic field sensor unit, and the first measurement signal is assigned a first relation and the second measurement signal is assigned a second relation. A third measurement signal and a fourth measurement signal are generated by the two subsensors of the second magnetic field sensor unit, whereby the third measurement signal is assigned a third relation and the fourth measurement signal is assigned a fourth relation. The angle of rotation is then determined.
    Type: Application
    Filed: August 7, 2013
    Publication date: February 13, 2014
    Applicant: Micronas GmbH
    Inventor: Dieter BAECHER
  • Humidity sensor
    Patent number: 8621923
    Abstract: A humidity sensor has, on a substrate, at least one voltage sensor with a sensor region and at least one control electrode. The control electrode is connected to a signal source which is designed such that a variable control voltage can be applied to the control electrode. A moisture-permeable sensor layer whose dielectric constant depends on humidity is located on the sensor region. The control electrode is adjacent to the sensor layer in such a manner that the measured voltage signal of the voltage sensor depends on the control voltage and the humidity. The voltage sensor is connected to an analysis unit for ascertaining the humidity on the basis of the measured voltage signal. In the vertical projection onto the plane in which the substrate extends, the control electrode is located laterally next to the sensor region.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: January 7, 2014
    Assignee: Micronas GmbH
    Inventor: Heinz-Peter Frerichs