Patents Assigned to NEC Electronics
  • Semiconductor device
    Patent number: 7635912
    Abstract: A resin layer covering a semiconductor chip on a wiring board is composed of a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer differ in their plan view pattern, satisfying a relation of a<b, where “a” is difference in length in the direction from the center of the board towards the edges between the first resin layer and the second resin layer, and “b” is difference in length in the direction from the center of the board towards the corners between the first resin layer and the second resin layer.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: December 22, 2009
    Assignee: NEC Electronics Corporation
    Inventor: Daisuke Ejima
  • Driving circuit and display
    Publication number: 20090309869
    Abstract: A liquid crystal display in which it is possible to reduce the EMI noise ascribable to high harmonic contents in a charging/discharging current is disclosed. The liquid crystal display includes a source driver 10. The source driver includes output terminals (OUTn) that drive a liquid crystal panel, amplifiers 15 that amplify a video signal and output switching circuits 17 each connected between an output of the amplifier 15 and the output terminal. The source driver also includes an output switch impedance control circuit 16 that controls the switching operation of the output switching circuits 17. When turned on during the operation of switching the output switching circuit 17, the output switch impedance control circuit 16 exercises control to progressively lower the impedance of the output switching circuit 17.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Kengo Umeda
  • ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
    Publication number: 20090311485
    Abstract: An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.
    Type: Application
    Filed: May 8, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventors: Kenji UCHIDA, Koki HIRASAWA
  • SEMICONDUCTOR DEVICE
    Publication number: 20090309233
    Abstract: The semiconductor device includes an interconnect having a width of 0.1 ?m or less and formed in an insulating layer constituted of a low relative dielectric constant film having a relative dielectric constant of 3.0 or lower, a via having a diameter of 0.1 ?m or less and connected to the interconnect, and a dummy metal provided in the insulating layer. The dummy metal is located close to an end portion of the interconnect along an extension thereof, and the dummy metal and the interconnect are spaced by a distance of 0.3 ?m or less.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Sorporation
    Inventor: Yumi SAITOU
  • Semiconductor device manufacturing method
    Publication number: 20090311868
    Abstract: In a semiconductor device manufacturing method according to this invention, an SiO2 film used as a mask at the time of trench formation is removed by a wet process after hydrophilic treatment is performed on the interior of a hydrophobic trench.
    Type: Application
    Filed: June 12, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventors: Masafumi Hayashi, Eiji Uramoto
  • Circuit apparatus and method of manufacturing the same
    Publication number: 20090309688
    Abstract: A circuit apparatus includes a first insulating layer, a first inductor, a first terminal, a second terminal, a first interconnect, and a wire. The first inductor is located at one surface of the first insulating layer and configured by a spiral conductive pattern. The first terminal and the second terminal are exposed from one surface of the first insulating layer. The first interconnect is formed on one surface of the first insulating layer to connect the first terminal and an external end of the first inductor. The wire is located on a one-surface side of the first insulating layer to connect the second terminal and a central end of the first inductor.
    Type: Application
    Filed: May 13, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Masaya Kawano
  • LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20090309201
    Abstract: A lead frame has a die pad on which a semiconductor chip is mounted, a plurality of leads, a first recess provided so as to sink in from the front surface of the die pad, and second recesses and third recesses (through holes) provided so as to sink in from the front surface and the rear surface of the leads, respectively. The inner wall surfaces of the first recess, the second recesses and the third recesses (through holes) are made uneven, respectively.
    Type: Application
    Filed: June 4, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Tomoki MORITA
  • Power supply circuit and control method of the same
    Publication number: 20090309568
    Abstract: A power supply circuit is provided which includes a first booster to boost a power supply voltage supplied from a battery and generate a first boosted voltage, a second booster to boost the power supply voltage at a higher multiplication factor than the first booster and generate a second boosted voltage, a power supply selection circuit to output the first boosted voltage or the second boosted voltage, a first smoothing capacitor placed at an output end of the power supply selection circuit, and a second smoothing capacitor placed at an output end of the second booster.
    Type: Application
    Filed: May 14, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Haruhiko HISANO
  • Triangle wave generator and switching regulator
    Publication number: 20090309636
    Abstract: A switching regulator maintain an output voltage substantially constant by using a first comparator that compares a power supply voltage with the output voltage of the switching regulator, a triangle wave formation circuit that changes amplitude of a triangle wave according to an output signal of the first comparator, and a triangle wave generated by the triangle wave formation circuit.
    Type: Application
    Filed: May 7, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Yoshitaka Nishigata
  • Optical transmission apparatus to which optical cable is connected
    Publication number: 20090310921
    Abstract: An optical transmission apparatus includes a wiring board, an electronic device mounted on the wiring board, a connection part that mechanically connects the electronic device and the wiring board to each other in such a manner that the electronic device and the wiring board face each other at a certain distance and electrically connects the electronic device and the wiring board to each other, an optical cable connector that is in contact with the electronic device, and an optical cable connected to the optical cable connector. The optical cable connector has a part that is inserted between the electronic device and the wiring board. A signal is transmitted between the part and the electronic device.
    Type: Application
    Filed: August 21, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Yoichiro Kurita
  • Booster circuit
    Publication number: 20090309650
    Abstract: A booster circuit includes a first capacitance device and a switch which makes a first node and a one end of the first capacitance device conductive or non-conductive in response to a first control signal. The booster circuit applies a voltage, which is applied to the first node, to the one end of the first capacitance device and charges the first capacitance device according to the voltage applied to the first node and a potential of the one end of the first capacitance device is boosted in response to a second control signal thereafter, where the second control signal is applied to an other end of the charged first capacitance device.
    Type: Application
    Filed: May 7, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventors: Yuji Fujita, Yuri Honda
  • Defective pixel processing device and defective pixel processing method
    Publication number: 20090310849
    Abstract: In order to determine a defective pixel speedily and accurately, a defective pixel processing device includes: first determination means that determines whether or not each of pixels outputted from an imaging device is a defective pixel candidate by comparing pixel data of the pixel with a threshold value; and second determination means that determines whether or not the defective pixel candidate determined by the first determination means is a defective pixel by comparing the pixel data of the defective pixel candidate with the pixel data of the pixels around the defective pixel candidate.
    Type: Application
    Filed: June 2, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Yusuke Katou
  • Motor driving device, and control method of motor driving device
    Publication number: 20090309523
    Abstract: A motor driving device includes a first power supply terminal, a second power supply terminal, a drive unit that is coupled to the first power supply terminal, the second power supply terminal, and a motor winding, a control unit that controls the drive unit, and a resistive element that is coupled between the drive unit and the first power supply terminal. The control unit makes the motor winding and the resistive element form a loop circuit when a voltage between the first power supply terminal and the second power supply terminal exceeds a predetermined value.
    Type: Application
    Filed: June 3, 2009
    Publication date: December 17, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Satoshi Ikei
  • Field-effect transistor comprising hollow cavity
    Patent number: 7633099
    Abstract: A field-effect transistor has: a substrate having a first cavity; a gate electrode buried in the substrate; and diffusion layers formed in the substrate and being in contact with the first cavity. A channel region is formed substantially perpendicular to a surface of the substrate between the diffusion layers.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: December 15, 2009
    Assignee: NEC Electronics Corporation
    Inventor: Shingo Hashimoto
  • Image processing method, image processing apparatus, and image pickup apparatus having first and second exposure values
    Patent number: 7633532
    Abstract: An image processing method controls white balance of image data obtained by an image pickup apparatus according to image data of the image shot by the image pickup apparatus having pixels of a plurality of colors that includes shooting an image as a first exposure value by the image pickup apparatus, calculating a brightness of the first exposure value for each of divided regions according to image data by the first exposure value, shooting an image as a second exposure value by the image pickup apparatus, calculating a brightness for the second exposure value for each of the divided regions according to image data by the second exposure value, evaluating saturated brightness region among the divided regions according to the brightness for the first exposure value and the brightness for the second exposure value, and controlling white balance according to image data of non-saturated brightness region.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: December 15, 2009
    Assignee: NEC Electronics Corporation
    Inventor: Hiroyuki Kobayashi
  • Semiconductor integrated circuit capable of autonomously adjusting output impedance
    Patent number: 7633310
    Abstract: A semiconductor integrated circuit includes an output driver, a replica driver, a replica resistor, and an impedance adjustment circuit. The output driver is configured to be capable of changing current driving capability. The replica driver is configured to be capable of changing current driving capability. The replica resistor is connected to an output of the replica driver. The impedance adjustment circuit is configured to adjust the current driving capability of the output driver and the replica driver, based on an output voltage of the replica driver. In addition, the output driver, the replica driver, the replica resistor, and the impedance adjustment circuit are mounted in an integrated circuit package.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: December 15, 2009
    Assignee: NEC Electronics Corporation
    Inventor: Tetsuo Fukushi
  • Distributed feedback laser diode
    Patent number: 7633986
    Abstract: A distributed feedback laser diode comprises a phase-shifting portion in diffraction gratings. The magnitude of a phase shift in the phase-shifting portion is 8?/40 to 9?/40, ? representing twice the distance between the diffraction gratings. A main mode stands on a lower wavelength side than the center of a stop band when an injected current is of a level of a threshold current, whereas the main mode is shifted to the center of the stop band and a sub mode is suppressed from growing when the injected current is of a level of an operating current.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: December 15, 2009
    Assignee: NEC Electronics Corporation
    Inventors: Shotaro Kitamura, Yasutaka Sakata
  • Semiconductor device and method for manufacturing same
    Patent number: 7633167
    Abstract: A falling off of a through electrode is inhibited without decreasing a reliability of a semiconductor device including a through electrode. A semiconductor device 100 includes: a silicon substrate 101; a through electrode 129 extending through the silicon substrate 101; and a first insulating ring 130 provided in a circumference of a side surface of the through electrode 129 and extending through the semiconductor substrate 101. In addition, the semiconductor device 100 also includes a protruding portion 146, being provided at least in the vicinity of a back surface of a device-forming surface of the semiconductor substrate 101 so as to contact with the through electrode 129, and protruding in a direction along the surface of the semiconductor substrate 101 toward an interior of the through electrode 129.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: December 15, 2009
    Assignee: NEC Electronics Corporation
    Inventors: Masaya Kawano, Koji Soejima, Nobuaki Takahashi
  • Semiconductor device and method of manufacturing the same
    Patent number: 7633138
    Abstract: The semiconductor device 1 includes an insulating interlayer 10, interconnects 12a to 12c, an insulating interlayer 20, and a capacitor element 30. On the insulating interlayer 10 and the interconnects 12a to 12d, the insulating interlayer 20 is provided via a diffusion barrier 40. On the insulating interlayer 20, the capacitor element 30 is provided. The capacitor element 30 is a MIM type capacitor element, and includes a lower electrode 32 provided on the insulating interlayer 20, a capacitor insulating layer 34 provided on the lower electrode 32, and an upper electrode 36 provided on the capacitor insulating layer 34. The interface S1 between the insulating interlayer 20 and the capacitor element 30 is generally flat. The lower face S2 of the insulating interlayer 20 includes an uneven portion at a position corresponding to the capacitor insulating layer 34.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: December 15, 2009
    Assignee: NEC Electronics Corporation
    Inventors: Toshiyuki Takewaki, Takeshi Toda
  • Current source circuit and method of outputting current
    Patent number: 7633335
    Abstract: A current source circuit includes a voltage output section which outputs a voltage signal; a current source section and a conversion section. The current source section has at least one current source block comprising a plurality of current sources, each of which outputs an output current. The conversion section is provided between the voltage output section and the current source section and outputs a reference current to the plurality of current sources of the at least one current source block based on the voltage signal such that the output current from each of the plurality of current sources is set based on the reference current.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: December 15, 2009
    Assignees: NEC Electronics Corporation, NEC Corporation
    Inventors: Katsuyuki Fujikura, Katsumi Abe, Masamichi Shimoda