Abstract: Provided is a battery module including: a metal module housing that has a closed interior space; and multiple secondary batteries that have a vertically long shape and are housed vertically in the interior space and juxtaposed parallel to each other. The module housing has an upper excess space above the secondary batteries in the interior space, the upper excess space being capable of mitigating a pressure increase in the module housing due to ignition of gas generated in the event of an abnormality in the secondary batteries.

Abstract: Provided is an EUV transmissive membrane including a main layer having an EUV transmittance of 85% or more at a wavelength of 13.5 nm, wherein the main layer is composed of a monolayer or a composite layer of two or more layers, and a protective layer that covers at least one side of the main layer, wherein the protective layer includes at least one selected from the group consisting of amorphous carbon, Cu, Al, and an organic resist as a main component.

Abstract: A layered double hydroxide contains four elements of Ni, Fe, V, and Co, and further contains Mn as a fifth element.

Abstract: There is provided an EUV transmissive membrane including: a main layer composed of metallic beryllium that has a first surface and a second surface; and a pair of surface layers provided on the first surface and the second surface of the main layer, each containing at least one fluoride selected from beryllium fluoride, beryllium fluoride nitride, beryllium fluoride oxide, and beryllium fluoride nitride oxide.

Abstract: A bonded body has a supporting substrate composed of silicon, piezoelectric material substrate, and a bonding layer provided on a bonding surface of the supporting substrate and composed of a metal oxide. An amount of aluminum atoms on the bonding surface of the supporting substrate is 1.0×1011 to 1.0×1015 atoms/cm2.

Abstract: A layered double hydroxide is represented by the following formula (I): Ni2+1?(x+y+z)Fe3+xV3+yCo3+z(OH)2An?(x+y+z)/n·mH2O . . . (I). In one embodiment, in the formula (I), (x+y+z) is from 0.2 to 0.5, “x” represents more than 0 and 0.3 or less, “y” represents from 0.04 to 0.49, and “z” represents more than 0 and 0.2 or less.

Abstract: A dielectric drying method for ceramic formed bodies includes drying a plurality of ceramic formed bodies placed side by side in an arrangement direction Y perpendicular to a conveying direction X on an upper surface of a drying table by conveying the ceramic formed bodies between electrodes of an upper electrode and a lower electrode, and applying a high frequency between the electrodes. The drying table is conveyed by a conveyor having at least one conveyor belt for supporting a portion of the drying table in the arrangement direction Y. At least one electric field adjusting member is arranged below the drying table that is not supported by the conveyor belt.

Abstract: A heat treatment system may include a heat treatment furnace configured to heat treat a material in a saggar, the saggar including a saggar body and a lid; a lid removing device configured to remove the lid from the saggar; a body conveyor configured to convey the saggar body; a lid conveyor configured to convey the lid; a recovery device configured to recover the material from the saggar body; a supply device configured to supply a non-heat-treated material to the saggar body; and a lid attaching device configured to attach the lid to the saggar body. A conveying time for the lid to be conveyed from an entrance to an exit of a conveying path of the lid conveyor may be shorter than a conveying time for the saggar body to be conveyed from an entrance to an exit of a conveying path of the body conveyor.

Abstract: A heat treatment system may include a heat treatment furnace configured to heat treat a material in a saggar; a conveyor configured to convey the saggar from an exit to an entrance of the heat treatment furnace; a recovery apparatus configured to recover the material heat-treated from the saggar; and a supply device configured to supply a non-heat treated material to the saggar. The conveyor may include a conveyor mechanism and a drive unit configured to drive the conveyor mechanism. The recovery apparatus may comprise a recovery unit disposed at a position where the conveyor mechanism is not disposed and configured to recover the material in the saggar; a transport device configured to transport the saggar between a placement position on the conveyor mechanism and a recovery position above the recovery unit; and an inversion mechanism configured to invert the saggar at the recovery position.

Abstract: A composite sintered body includes a base material that includes ceramic as a main component, and an electrode arranged inside the base material or on a surface of the base material. The electrode contains W and ZrO2.

Abstract: A package has a cavity to be sealed by a lid. The package includes a heat sink having a coefficient of thermal expansion of 9 ppm/° C. or more and 15 ppm/° C. or less from 25° C. to 100° C. and a frame disposed on the heat sink, made of ceramics, and surrounding the cavity in plan view. An outer edge of the frame includes a first linear portion extending along a first direction, a second linear portion extending along a second direction orthogonal to the first direction, and a chamfer connecting the first linear portion and the second linear portion in plan view.

Abstract: A wafer placement table includes an upper substrate; a lower substrate; a through hole extending through the lower substrate in an up-down direction; a plurality of projections provided in a dot pattern, for example, at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate; a heat dissipation sheet having a projection insertion hole and being disposed between the upper substrate and the lower substrate; a screw hole provided, in the lower surface of the upper substrate, at a position facing the through hole; a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole.

Abstract: A wafer placement table includes an upper substrate; a lower substrate; a through hole extending through the lower substrate in an up-down direction; a plurality of projections provided in a dot pattern, for example, at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate; a heat dissipation sheet having a projection insertion hole and being disposed between the upper substrate and the lower substrate; a screw hole provided, in the lower surface of the upper substrate, at a position facing the through hole; a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole; and a thermally conductive paste interposed, for example, between side surfaces of the projections and an inner peripheral surface of the projection insertion hole of the heat dissipation sheet.

Abstract: A ceramic heater includes a ceramic plate having a wafer placement surface, a tubular shaft having one end that is bonded to a rear surface of the ceramic plate on an opposite side to the wafer placement surface, a within-shaft region of the rear surface of the ceramic plate, an elongate hole extending from a start point in an outer peripheral portion of the within-shaft region to a terminal end position in the outer peripheral portion of the ceramic plate, and a thermocouple guide that guides a tip end of an outer-peripheral-side thermocouple to come into the start point of the elongate hole. A portion of the thermocouple guide, the portion extending from the other end (lower end) of the tubular shaft to the start point of the elongate hole, is formed in a shape following an inner wall of the tubular shaft.

Abstract: A method for processing a ceramic honeycomb structure, the method comprising subjecting an outer peripheral surface of the ceramic honeycomb structure to centerless grinding in an in-feed mode by bringing a rotationally driving grinding wheel into contact with the outer peripheral surface of the ceramic honeycomb structure rotationally supported by an adjusting wheel, a blade, and a press roller.

Abstract: A regenerative burner including: a combustion chamber; a heat exchange chamber; and a communication passage therebetween, the combustion chamber includes a tip of a fuel nozzle and a flame ejection port, and is configured such that fuel introduced from the fuel nozzle into the combustion chamber can be burned in the combustion chamber using combustion air introduced into the combustion chamber through the communication passage to eject flame from the flame ejection port; the fuel nozzle is configured such that fuel burned in the regenerative burner is introduced into the combustion chamber; and the heat exchange chamber comprises a heat accumulator interposed between the communication passage and an air port, and is configured such that combustion air can pass through the heat accumulator and then be introduced into the combustion chamber such that an exhaust gas passes through the heat accumulator and is discharged from the air port.

Abstract: A heat exchange member includes: a honeycomb structure including: an outer peripheral wall; an inner peripheral wall; and partition walls arranged between the outer peripheral wall and the inner peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path for a first fluid; and a covering member for covering an outer peripheral surface of the outer peripheral wall. In a cross section of the honeycomb structure orthogonal to a flow path direction for the first fluid, the partition walls extend in a radial direction. Each of the cells is formed from the outer peripheral wall, the inner peripheral wall, and the partition walls.

Abstract: A sensor element includes an element body and a porous protective layer arranged to cover a part of a surface of the element body. The protective layer includes an inlet protective layer arranged to cover a gas inlet formed in the surface of the element body, and at least a part of a face included in the surface of the element body, the face on which the gas inlet is opens, and an arithmetic average roughness Rap of an inner peripheral surface of an internal space of the inlet protective layer satisfies at least one of conditions below: the arithmetic average roughness Rap is 8 ?m or more, and the arithmetic average roughness Rap is higher than an arithmetic average roughness Rac of a bonding surface of the protective layer, the bonding surface at which the protective layer is bonded to the element body.

Abstract: A gas sensor sensing a sensing target gas component contained in a measurement gas and identifying concentration of the sensing target gas component includes: a sensor element having an inlet for the measurement gas on one end portion, and including: an element base made of an oxygen-ion conductive solid electrolyte; a heater buried in the element base; and a porous leading-end protective layer covering a predetermined range of the element base on the one end portion; and a metallic member within which the sensor element is fixedly disposed, wherein a minimum distance between the sensor element and an inner surface of the metallic member is 0.20 mm or more and 0.95 mm or less, and a portion of the inner surface of the metallic member closest to the sensor element has an arithmetic average roughness of 5 ?m or less.

Abstract: An alloy member includes a base member that includes a recess in a surface of the base member and is constituted by an alloy material containing chromium, an anchor portion is disposed in the recess and contains an oxide containing manganese and a covering layer is connected to the anchor portion and contains a low-equilibrium oxygen pressure element whose equilibrium oxygen pressure is lower than that of chromium.