Abstract: A heat exchange member includes: a honeycomb structure including: an outer peripheral wall; an inner peripheral wall; and partition walls arranged between the outer peripheral wall and the inner peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path for a first fluid; and a covering member for covering an outer peripheral surface of the outer peripheral wall. In a cross section of the honeycomb structure orthogonal to a flow path direction for the first fluid, the partition walls extend in a radial direction. Each of the cells is formed from the outer peripheral wall, the inner peripheral wall, and the partition walls.

Abstract: A sensor element includes an element body and a porous protective layer arranged to cover a part of a surface of the element body. The protective layer includes an inlet protective layer arranged to cover a gas inlet formed in the surface of the element body, and at least a part of a face included in the surface of the element body, the face on which the gas inlet is opens, and an arithmetic average roughness Rap of an inner peripheral surface of an internal space of the inlet protective layer satisfies at least one of conditions below: the arithmetic average roughness Rap is 8 ?m or more, and the arithmetic average roughness Rap is higher than an arithmetic average roughness Rac of a bonding surface of the protective layer, the bonding surface at which the protective layer is bonded to the element body.

Abstract: A ceramic heater includes a ceramic plate having a wafer placement surface, a tubular shaft having one end that is bonded to a rear surface of the ceramic plate on an opposite side to the wafer placement surface, a within-shaft region of the rear surface of the ceramic plate, an elongate hole extending from a start point in an outer peripheral portion of the within-shaft region to a terminal end position in the outer peripheral portion of the ceramic plate, and a thermocouple guide that guides a tip end of an outer-peripheral-side thermocouple to come into the start point of the elongate hole. A portion of the thermocouple guide, the portion extending from the other end (lower end) of the tubular shaft to the start point of the elongate hole, is formed in a shape following an inner wall of the tubular shaft.

Abstract: A gas sensor sensing a sensing target gas component contained in a measurement gas and identifying concentration of the sensing target gas component includes: a sensor element having an inlet for the measurement gas on one end portion, and including: an element base made of an oxygen-ion conductive solid electrolyte; a heater buried in the element base; and a porous leading-end protective layer covering a predetermined range of the element base on the one end portion; and a metallic member within which the sensor element is fixedly disposed, wherein a minimum distance between the sensor element and an inner surface of the metallic member is 0.20 mm or more and 0.95 mm or less, and a portion of the inner surface of the metallic member closest to the sensor element has an arithmetic average roughness of 5 ?m or less.

Abstract: An inspection method for determining a presence of a defect on a sides surface of a pillar-shaped honeycomb structure including generating strip-shaped images by repeatedly capturing the side surface part by part with an area camera while relatively moving the area camera with respect to the pillar-shaped honeycomb structure; determining the presence or absence of defects based on the strip-shaped images when a number of the strip-shaped images generated is sufficient to cover the entire side surface; a shutter speed when the area camera captures a part of the side surface for generating a single strip-shaped image is 10 to 1000 ?sec; and each of the strip-shaped images has a length covering the entire height of the pillar-shaped honeycomb structure in a longitudinal direction, and a length of 1 to 10 mm in a width direction.

Abstract: A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135° to 165° on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110° to 145° a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 ?m. The second main surface extends beyond the extended plane of the first portion by a distance of 10 ?m or more.

Abstract: An alloy member includes a base member that includes a recess in a surface of the base member and is constituted by an alloy material containing chromium, an anchor portion is disposed in the recess and contains an oxide containing manganese and a covering layer is connected to the anchor portion and contains a low-equilibrium oxygen pressure element whose equilibrium oxygen pressure is lower than that of chromium.

Abstract: A sensor element includes: an element base including: a ceramic body made of an oxygen-ion conductive solid electrolyte, and having an inlet at one end portion thereof; at least one internal chamber located inside the ceramic body, and communicating with the inlet under predetermined diffusion resistance; an electrochemical pump cell including an electrode located on an outer surface of the ceramic body, an electrode facing the internal chamber, and a solid electrolyte located therebetween; and a heater buried in the ceramic body; and a porous leading-end protective layer surrounding a first range at least including a leading end surface and a region to be coped with water-induced cracking specified in advance. A single heat insulating space is interposed between the leading-end protective layer and a whole side surface of the element base at least in the above region.

Abstract: A method for producing a ceramic honeycomb structure including at least one slit filled with a filling material in a cross section in an axial direction of the honeycomb structure, wherein the honeycomb structure includes: an outer peripheral wall; and a partition wall, the partition wall defining a plurality of cells, wherein the method includes the steps of: preparing a honeycomb structure element comprising at least one slit; masking one end face of the honeycomb structure element except for the slit; and providing the honeycomb structure comprising the at least one slit filled with the filling material by applying a pressure to an axial direction of the honeycomb structure element and feeding the filling material from the one end face to intrude the filling material from the slit on the one end face side to the slit on the other end face side.

Abstract: There is provided a copper alloy consisting of: Ni: 10 to 15% by weight, Sn: 5.0% by weight or more, Mn: 0 to 0.5% by weight, Zr: 0 to 0.5% by weight, at least one selected from the group consisting of Nb, Fe, Al, Ti, B, Zn, Si, Co, P, Mg, and Bi: 0 to 0.2% by weight in total, and the balance being Cu and inevitable impurities. The copper alloy has, in an X-ray diffraction profile, (i) a peak in the vicinity of 2?=46 to 50° having a peak intensity of 30% or more with respect to a peak intensity in the vicinity of 2?=84 to 88° and (ii) a peak in the vicinity of 2?=40 to 42° having a peak intensity of 2.0% or more with respect to a peak intensity in the vicinity of 2?=84 to 88°.

Abstract: A method for producing a honeycomb structure for fine particle collection filters, the honeycomb structure including a plurality of porous honeycomb structure segments. The method includes joining each of the porous honeycomb segments via a joining material layers by applying a joining material between joining surfaces of each of the porous honeycomb structure segments, through a nozzle portion of a joining material applicator. The nozzle portion of the joining material applicator includes: a joining material introduction port; a joining material discharge space; and a joining material flow path having a bent portion, through which the joining material passes from the joining material introduction port to the joining material discharge space. The joining material flow path of the nozzle portion includes a buffer space configured such that a flow path cross section gradually expands toward the joining material discharge space on a downstream side of the bent portion.

Abstract: A silicon carbide porous body contains ?-SiC particles, Si particles, and metal silicide particles. The maximum particle diameter of the ?-SIC particles is not smaller than 15 ?m. The content of the Si particles is not lower than 10 mass %. The maximum particle diameter of the Si particles is not larger than 40 ?m. Further, an oxide coating film having a thickness not smaller than 0.01 ?m and not larger than 5 ?m is provided on surfaces of the Si particles.

Abstract: A receiving table 100 for supporting a side surface of a honeycomb formed body, the side surface being parallel to a cell extending direction. The receiving table 100 comprises: a body portion 10 having a groove 11 extending in one direction; a support portion 20 comprising: a flexible sheet substrate 21 in contact with a surface of the groove 11 of the body portion 10; and a foam layer 22 attached to the flexible sheet substrate 21, the foam layer 22 being brought into contact with the side surface of the honeycomb formed body; and fixing members 30 for fixing the support portion 20 to the body portion 10. The support portion 20 is provided in a non-adhesive state to the body portion 10.

Abstract: A composite oxide catalyst includes Ce that is a first metal, La that is a second metal, and a third metal as contained metals. The third metal is a transition metal, or a rare-earth metal other than Ce and La. A Ce content in the contained metals is higher than or equal to 5 mol % and lower than or equal to 95 mol %. An La content in the contained metals is higher than or equal to 2 mol % and lower than or equal to 93 mol %. A content of the third metal in the contained metals is higher than or equal to 2 mol % and lower than or equal to 93 mol %.

Abstract: A wafer placement table includes a ceramic base having a wafer placement surface; resistance heating elements buried in the ceramic base; jumper layers having a planar shape and provided in a different layer from the resistance heating elements; an inner via connecting the jumper layer and an end of the resistance heating element; and a feed via connected to the jumper layer, wherein each of the resistance heating elements is provided for each of zones of a surface parallel to the wafer placement surface, each of the jumper layers is provided for each of the resistance heating elements, and a center-to-center distance between the inner via and the feed via in each of the jumper layers is greater than or equal to 50 mm.

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate incorporating an electrode; a ceramic plate through hole extending through the ceramic plate in an up-and-down direction; a base plate having electrical conductivity and located adjacent to a lower surface of the ceramic plate; a base plate through hole extending through the base plate in the up-and-down direction; an insulating sleeve inserted into the base plate through hole and having an outer circumferential surface adhered to an inner circumferential surface of the base plate through hole with an adhesive layer therebetween; and a sleeve through hole extending through the insulating sleeve in the up-and-down direction and communicating with the ceramic plate through hole, wherein the insulating sleeve has at least one ring-shaped or spiral outer circumferential groove on the outer circumferential surface of the insulating sleeve except for an upper end portion of the insulating sleeve.

Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.

Abstract: In a method for manufacturing a gas sensor, a casing for holding a sensor element and a protective cover are connected to each other so that a distal end portion of the sensor element is covered with the protective cover. A first gas chamber, a sensor element chamber, and a second gas chamber into which gas is introduced from the outside are formed between the protective cover and the casing. In the gas introduction portion including the first gas chamber, the sensor element chamber, and the second gas chamber, there is no joint portion formed by welding.

Abstract: In a ceramic sintered body, the Zr content is 17.5 mass %-23.5 mass % in terms of ZrO2, the Hf content is 0.3 mass %-0.5 mass % in terms of HfO2, the Al content is 74.3 mass %-80.9 mass % in terms of Al2O3, the Y content is 0.8 mass %-1.9 mass % in terms of Y2O3, the Mg content is 0.1 mass %-0.8 mass % in terms of MgO, the Si content is 0.1 mass %- and 1.5 mass % in terms of SiO2, and the Ca content is 0.03 mass %-0.35 mass % in terms of CaO. The total content of Na and K is 0.01 mass %-0.10 mass %, when the K content is converted to K2O and the Na content is converted to Na2O. The balance content is 0.05 mass % or less in terms of oxide.

Abstract: A limiting-current type gas sensor including a sensor element including a base part made of an oxygen-ion conductive solid electrolyte and measuring concentration of NOx in a measurement gas includes: a pump cell including a first electrode disposed to be capable of being in contact with a gas introduced into the element and a second electrode disposed so that a part made of the solid electrolyte is located between the first electrode and the second electrode; and a pumping diagnostic part to determine whether an inter-electrode electric field produced in the part made of the solid electrolyte through application of a predetermined pump voltage between the electrodes exceeds a first threshold, and, when the inter-electrode electric field exceeds the first threshold, the predetermined pump voltage is reduced so that the inter-electrode electric field falls below the first threshold.