Patents Assigned to NGK Insulators
  • Conductive supporting member and method for producing the same
    Patent number: 11608545
    Abstract: A conductive supporting member includes an outer portion that includes a Cu matrix phase and a second phase dispersed in the Cu matrix phase and containing a Cu—Zr compound and that has an alloy composition represented by Cu-xZr (x is atomic % of Zr and 0.5?x?16.7 is satisfied) and an inner portion that is present on an inner side of the outer portion, is formed of a metal containing Cu, and has higher conductivity than the outer portion.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: March 21, 2023
    Assignees: NGK Insulators, Ltd., Tohoku University
    Inventors: Takashi Goto, Hirokazu Katsui, Naokuni Muramatsu, Takanari Nakajima
  • Electrostatic chuck assembly, electrostatic chuck, and focus ring
    Patent number: 11610798
    Abstract: An electrostatic chuck assembly includes a ceramic body having a wafer placement surface that is a circular surface, and an F/R placement surface that is formed around the wafer placement surface and is positioned at a lower level than the wafer placement surface, a wafer attraction electrode embedded inside the ceramic body and positioned in a facing relation to the wafer placement surface, an F/R attraction electrode embedded inside the ceramic body and positioned in a facing relation to the F/R placement surface, a concave-convex region formed in the F/R placement surface to hold gas, a focus ring placed on the F/R placement surface, and a pair of elastic annular sealing members arranged between the F/R placement surface and the focus ring on the inner peripheral side and the outer peripheral side of the F/R placement surface, and surrounding the concave-convex region in a sandwiching relation.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: March 21, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Tatsuya Kuno, Ikuhisa Morioka, Kenichiro Aikawa
  • Method for drying honeycomb formed body and method for manufacturing honeycomb structure
    Patent number: 11607824
    Abstract: A method for drying a honeycomb formed body, the honeycomb formed body being an unfired honeycomb formed body including a raw material composition containing a ceramic raw material and water, the method including: a dielectric drying process of obtaining a primary dried honeycomb formed body from which 30 to 70% of entire moisture contained in the unfired honeycomb formed body before the drying is removed by performing dielectric drying on the unfired honeycomb formed body while maintaining a temperature of a central portion of the unfired honeycomb formed body at 100° C. or less; and a microwave drying process of obtaining a honeycomb dried body from which residual moisture is removed by performing microwave drying on the primary dried honeycomb formed body obtained in the dielectric drying process.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: March 21, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Kensuke Okumura, Norihiro Asakura
  • Heater, method of manufacturing the same, and system
    Patent number: 11612018
    Abstract: A heater may include: a conductive ceramic cylinder tube in which cell-arrays are concentrically arranged, each cell-array including cells which are arranged in a circumferential direction of the ceramic cylinder tube; an inner electrode electrically coupled to an inner wall portion of the ceramic cylinder tube; and an outer electrode electrically coupled to an outer wall portion of the ceramic cylinder tube. Non-linear portions are radially arranged in the ceramic cylinder tube, each non-linear portion extending in a radial direction of the ceramic cylinder tube while having a plurality of bends or curves between the inner wall portion and outer wall portion of the ceramic cylinder tube. The inner and outer electrodes are provided such that current flows radially at least via said non-linear portions between the inner and outer electrodes.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: March 21, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Yukio Miyairi, Masaaki Masuda, Xavier Bartolo
  • HEATER ELEMENT WITH FUNCTIONAL MATERIAL CONTAINING LAYER, HEATER UNIT WITH FUNCTIONAL MATERIAL CONTAINING LAYER, VEHICLE INTERIOR PURIFICATION SYSTEM AND HONEYCOMB STRUCTURE
    Publication number: 20230080619
    Abstract: A heater element with a functional material-containing layer includes: a honeycomb structure including an outer peripheral wall and partition walls disposed on an inner side of the outer peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path, at least the partition walls being made of a material having a PTC property; a pair of electrodes provided on the first end face and the second end face of the honeycomb structure; and a functional material-containing layer provided on a surface of the partition walls.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 16, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Yukio MIYAIRI, Masaaki MASUDA, Koji KUZUTANI, Shuichi ICHIKAWA, Toru HAYASE, Hirofumi YAMAGUCHI, Narimasa SHINODA, Takahiko NAKATANI
  • SEPARATION MEMBRANE COMPLEX, METHOD OF PRODUCING SEPARATION MEMBRANE COMPLEX, AND SEPARATION METHOD
    Publication number: 20230084665
    Abstract: A separation membrane complex includes a porous support and a separation membrane formed on the support. The separation membrane has a small void. A small void index Ik expressed by (?(Sk1.5))/(Sm1.5) and indicating the abundance ratio of small voids is higher than or equal to 10×10?15, and a large void index Ip expressed by (?(Sp2))/(Sm2) and indicating the abundance ratio of large voids is lower than 200×10?22, where Sm is the surface area of the separation membrane, Sk is the area per small void, and Sp is the area per large void. Accordingly, the separation membrane complex can achieve a high separation ratio.
    Type: Application
    Filed: November 7, 2022
    Publication date: March 16, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Katsuya SHIMIZU, Koh KOBAYASHI, Kenichi NODA, Makiko ICHIKAWA, Naoto KINOSHITA
  • METHOD FOR DRYING SEPARATION MEMBRANE AND METHOD FOR PRODUCING SEPARATION MEMBRANE STRUCTURE
    Publication number: 20230078309
    Abstract: A drying method for a separation membrane includes supplying a gas for drying to the separation membrane so that a value obtained by dividing the difference between a maximum value and a minimum value of a flow rate of the gas for drying on a membrane surface of the separation membrane by the minimum value of the flow rate is less than or equal to 15%. The gas for drying is less than or equal to 40 degree C. and contains a water-soluble gas that has a solubility in 1 cm3 of water of greater than or equal to 0.5 cm3 in conditions of 40 degree C. and 1 atmosphere.
    Type: Application
    Filed: November 18, 2022
    Publication date: March 16, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Kenichi NODA, Takeshi HAGIO
  • BONDED BODY AND A METHOD OF PRODUCING THE SAME
    Publication number: 20230074173
    Abstract: A bonded body has a supporting substrate composed of silicon, a piezoelectric material substrate, and a bonding layer provided on a surface of the supporting substrate and composed of silicon oxide. The bonding layer has a refractive index of 1.468 or higher and 1.474 or lower.
    Type: Application
    Filed: October 24, 2022
    Publication date: March 9, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Takahiro KAWASAKI, Takuya TOMIOKA
  • Electrostatic chuck heater
    Patent number: 11600510
    Abstract: An electrostatic chuck heater includes a ceramic plate, an electrostatic electrode, first and second zone heater electrodes, and first and second zone gas grooves. The ceramic plate includes, on its surface, a wafer placement surface. The electrostatic electrode is embedded in the ceramic plate. The first and second zone heater electrodes are embedded in the ceramic plate, corresponding to respective multiple heater zones into which the wafer placement surface is divided, and allow electric power to be individually supplied to the heater zones. Zone gas grooves are provided corresponding to respective multiple gas supply zones into which the wafer placement surface is divided independently of the heater zones, and allow a gas to be individually supplied to the gas supply zones.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: March 7, 2023
    Assignee: NGK Insulators, Ltd.
    Inventor: Joyo Ito
  • Wafer placement table and method for manufacturing the same
    Patent number: 11602012
    Abstract: A wafer placement table includes: a ceramic member having a wafer placement surface; a mesh electrode buried in the ceramic member; a conductive connection member in contact with the mesh electrode and exposed to outside from a surface of the ceramic member on the opposite side of the wafer placement surface; and an external current-carrying member joined to a surface of the connection member exposed to outside. The mesh electrode has a mesh opening in a region that faces the connection member, and the mesh opening is filled with a sintered conductor being a sintered body of a mixture containing a conductive powder and a ceramic raw material.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: March 7, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Unno, Shuichiro Motoyama
  • COMPOSITE SUBSTRATE FOR PHOTONIC CRYSTAL ELEMENT, AND PHOTONIC CRYSTAL ELEMENT
    Publication number: 20230061055
    Abstract: A composite substrate (100) for a photonic crystal element includes: an electro-optical crystal substrate (10) having an electro-optical effect; an optical loss-suppressing and cavity-processing layer (20) arranged on one surface of the electro-optical crystal substrate (10); and a support substrate (30) integrated with the electro-optical crystal substrate (10) through the optical loss-suppressing and cavity-processing layer (20).
    Type: Application
    Filed: October 19, 2022
    Publication date: March 2, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Jungo KONDO, Keiichiro ASAI, Tomoyoshi TAI
  • Honeycomb filter
    Patent number: 11590444
    Abstract: A honeycomb filter includes a pillar-shaped honeycomb substrate having a porous partition wall and a plugging portion provided so as to plug end at any one of the inflow end face side or the outflow end face side of the cell, wherein in a section orthogonal to the extending direction of the cell, the shape of the cell is hexagonal, the partition wall includes a first partition wall disposed between the inflow cell and the outflow cell and a second partition wall disposed between the inflow cells, and the first partition wall has a porous trapping layer on its surface for trapping particulate matter in exhaust gas, and the second partition wall has no trapping layer on its surface or has a trapping layer thinner than the trapping layer disposed on the surface of the first partition wall.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: February 28, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Takashi Aoki, Yasuyuki Furuta, Takahiro Honda, Koji Kuzutani
  • Heat exchanging member, heat exchanger and heat exchanger with purifier
    Patent number: 11591950
    Abstract: A heat exchanging member including a hollow pillar shaped honeycomb structure having partition walls defining cells, the cells penetrating from a first end face to a second end face to form flow paths for a first fluid, an inner peripheral wall, and an outer peripheral wall; and a covering member being configured to cover the outer peripheral wall of the pillar shaped honeycomb structure. The heat exchanging member is configured to perform heat exchange between the first fluid and a second fluid flowing through an outer side of the covering member. In the heat exchanging member, in a cross section of the pillar shaped honeycomb structure perpendicular to a flow path direction of the first fluid, the cells are radially provided, and each of the inner peripheral wall and the outer peripheral wall has a thickness larger than that of each of the partition walls.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: February 28, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Tatsuo Kawaguchi, Takeshi Sakuma, Daisuke Kimura, Yutaro Fumoto
  • WAFER PLACEMENT TABLE
    Publication number: 20230055928
    Abstract: A wafer placement table includes a ceramic base, a first cooling base, and a second cooling base. The ceramic base has a wafer placement surface and incorporates a wafer attracting electrode and a heater electrode. The first cooling base is bonded via a metal bonding layer to a surface of the ceramic base on a side opposite to the wafer placement surface and has a first refrigerant flow channel capable of switching between supply and stop of supply of first refrigerant. The second cooling base is attached via a space layer, capable of supplying heat-transfer gas, to a surface of the first cooling base on a side opposite to the metal bonding layer and has a second refrigerant flow channel capable of switching between supply and stop of supply of second refrigerant.
    Type: Application
    Filed: July 18, 2022
    Publication date: February 23, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Hiroshi TAKEBAYASHI, Tatsuya KUNO, Seiya INOUE
  • AlN JOINED BODY
    Publication number: 20230057187
    Abstract: An AlN joined body includes a first AlN member and a second AlN member that are joined together. The content of yttria in the first AlN member is equal to or below the detection limit. The second AlN member contains yttria.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 23, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Keita YAMANA, Kazuhiro NOBORI, Genichi YOKOTA, Tetsuhisa ABE
  • WAFER PLACEMENT TABLE
    Publication number: 20230057107
    Abstract: A wafer placement table includes a ceramic base, a cooling base, and a bonding layer. The ceramic base includes an outer peripheral part having an annular focus ring placement surface on an outer peripheral side of a central part having a circular wafer placement surface. The cooling base contains metal. The bonding layer bonds the ceramic base with the cooling base. The outer peripheral part of the ceramic base has a thickness of less than or equal to 1 mm and does not incorporate an electrode.
    Type: Application
    Filed: June 3, 2022
    Publication date: February 23, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Hiroshi TAKEBAYASHI, Tatsuya KUNO, Seiya INOUE
  • WAFER SUPPORT TABLE AND RF ROD
    Publication number: 20230058637
    Abstract: A wafer support table includes a ceramic base having a wafer placement surface and including an RF electrode and a heater electrode embedded, the RF electrode being closer to the wafer placement surface; a hole extending from a surface of the ceramic base opposite the wafer placement surface toward the RF electrode; and an RF rod through having a top end joined to the RF electrode or joined to a conductive member connected to the RF electrode, wherein the RF rod is a hybrid rod including a first rod member that is made of Ni and constitutes a portion of the RF rod from the top end to a predetermined position and a second rod member that is joined to the first rod member and constitutes a portion of the RF rod from the predetermined position to the base end and is made of a non-magnetic material.
    Type: Application
    Filed: October 19, 2022
    Publication date: February 23, 2023
    Applicant: NGK Insulators, Ltd.
    Inventors: Yutaka UNNO, Tomohiro HARA
  • Porous composite
    Patent number: 11578629
    Abstract: A porous composite includes a porous base material, and a porous collection layer. The collection layer is provided on the base material. The collection layer contains praseodymium oxide.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: February 14, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Shogo Takeno, Kousuke Ujihara, Kenji Morimoto
  • Coating material, outer periphery-coated silicon carbide-based honeycomb structure, and method for coating outer periphery of silicon carbide-based honeycomb structure
    Patent number: 11578001
    Abstract: A coating material for a silicon carbide-based honeycomb structure, the coating material including from 20 to 75% by mass of ceramic powder (A), the ceramic powder (A) including from 55 to 95% by mass of silicon carbide and from 5 to 30% by mass of silicon dioxide as chemical components.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: February 14, 2023
    Assignee: NGK Insulators, Ltd.
    Inventor: Suguru Kodama
  • Manufacturing method of ceramic formed body
    Patent number: 11578006
    Abstract: A manufacturing method of a ceramic formed body, including: a mixing step in which a raw material for forming a ceramic formed body is dryly mixed, and then, a liquid is added to the obtained dry mixture to wetly mix the mixture; a kneading step in which a mixture obtained in the mixing step is kneaded; an injection step in which supercritical carbon dioxide in the state of supercritical fluid is injected into a kneaded product obtained in the kneading step; and a forming step in which a forming raw material containing the supercritical carbon dioxide obtained in the kneading step and the injection step is extruded to form the ceramic formed body.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: February 14, 2023
    Assignee: NGK Insulators, Ltd.
    Inventors: Yuichi Tajima, Ryuji Yamaguti