Patents Assigned to OmniVision Technologies
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Patent number: 9462179Abstract: A method of focusing an image sensor includes scanning a first portion of an image frame from an image sensor a first time at a first rate to produce first focus data. A second portion of the image frame from the image sensor is scanned at a second rate to read image data from the second portion. The first rate is greater than the second rate. The first portion of the image frame is scanned a second time at the first rate to produce second focus data. The first focus data and the second focus data are compared, and the focus of a lens is adjusted in response to the comparison of the first focus data and the second focus data.Type: GrantFiled: August 25, 2015Date of Patent: October 4, 2016Assignee: OmniVision Technologies, Inc.Inventors: Tiejun Dai, Eiichi Funatsu, Donghui Wu, Zheng Yang, Xiao Xie
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Patent number: 9461088Abstract: An image sensor pixel includes a photodiode, a first storage node, a second storage node, a first transfer storage gate, a second transfer storage gate, a floating diffusion, and an output gate. The photodiode is for generating image charge in response to image light. The first storage node, the second storage node, and the photodiode have a first doping polarity. The first transfer storage gate is coupled to transfer the image charge from the photodiode to the first storage node. The first transfer storage gate is disposed over a majority portion of the first storage node. The second transfer storage gate is coupled to transfer the image charge from the first storage node to the second storage node. The second transfer storage gate is disposed over a majority portion of the second storage node. The output gate transfers the image charge from the second storage node to the floating diffusion.Type: GrantFiled: December 1, 2014Date of Patent: October 4, 2016Assignee: OmniVision Technologies, Inc.Inventor: Xianmin Yi
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Patent number: 9455291Abstract: A back side illuminated image sensor includes a semiconductor material having a front side and a back side. The semiconductor material is disposed between image sensor circuitry and a light filter array. The image sensor circuitry is disposed on the front side, and the light filter array is disposed proximate to the back side. The image sensor includes a first pixel with a first doped region that extends from the image sensor circuitry into the semiconductor material a first depth. The first pixel also includes a second doped region that is disposed between the back side of the semiconductor material and the first doped region. The second doped region is electrically isolated from the first doped region. A second pixel with a third doped region is also included in the image sensor. The third doped region extends from the image sensor circuitry into the semiconductor material a second depth.Type: GrantFiled: January 20, 2015Date of Patent: September 27, 2016Assignee: OmniVision Technologies, Inc.Inventors: Gang Chen, Duli Mao, Yuanwei Zheng, Chih-Wei Hsiung, Arvind Kumar, Dyson H. Tai
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Publication number: 20160277680Abstract: A 360 degree camera system includes a support structure, a plurality of image capture devices, a plurality of lens systems, and an image processing system. The image capture devices are positioned such that their height is greater than their width. The image processing system includes a rotation module for remapping the pixel addresses of the image data to join the captured images along their long edges.Type: ApplicationFiled: June 2, 2016Publication date: September 22, 2016Applicant: OmniVision Technologies, Inc.Inventors: Jeff Hsieh, Yuguo Ye, Hui Wang, Wei-Feng Huang
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Patent number: 9448415Abstract: An image projector includes a spatially-interleaved polarization converter having an input and output lenslet array, and may transmit light thereon as converted linearly-polarized light. The image projector also includes a lens unit and a projector assembly having a pixel array and being capable of reflecting the converted light. The output lenslet array, the lens unit, and the projector assembly form an imaging system that images the input lenslet array to a top surface of the pixel array. A method for converting light to an output light beam having a single common polarization state includes transmitting the light as a plurality of beamlets each having an s-polarized component and a p-polarized component, splitting each beamlet into a transmitted p-polarized beamlet and a reflected s-polarized beamlet, converting each p-polarized beamlet to a first s-polarized output beamlet, and spatially interleaving the s-polarized beamlets with the first s-polarized output beamlets.Type: GrantFiled: February 25, 2015Date of Patent: September 20, 2016Assignee: OmniVision Technologies, Inc.Inventor: Yi-Wei Liu
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Patent number: 9450004Abstract: An encapsulated semiconductor device includes a device die with a semiconductor device fabricated thereon. A carrier layer opposite the device die covers the semiconductor device. A dam supports the carrier layer above the device die, the dam being located therebetween. The semiconductor device further includes a first sealant portion for attaching the dam to the device die, and a means for attaching the dam to the carrier layer. The device die, the dam, and the carrier layer form a sealed cavity enclosing the semiconductor device. A method of encapsulating semiconductor devices formed on a device wafer includes forming an assembly including a carrier wafer and a plurality of dams thereon. After the step of forming, the method attaches the plurality of dams to the device wafer to form a respective plurality of encapsulated semiconductor devices.Type: GrantFiled: November 14, 2014Date of Patent: September 20, 2016Assignee: OmniVision Technologies, Inc.Inventors: Chih-Hung Tu, Wei-Feng Lin
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Patent number: 9451137Abstract: A PCB-mountable lens adapter includes an adapter lens for being a component of an imaging system that has a second field of view different from the first field of view, the imaging system comprising the adapter lens and the camera lens; and an adapter housing for holding the adapter lens and for attaching to a PCB. A method for modifying the field of view of an camera module includes attaching a PCB-mountable lens adapter to a PCB, the PCB-mountable lens adapter including an adapter lens mounted in an adapter housing, the PCB being configured for surface-mounting of the camera module thereto.Type: GrantFiled: August 21, 2014Date of Patent: September 20, 2016Assignee: OmniVision Technologies, Inc.Inventors: Wei-Ping Chen, Tsung-Wei Wan
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Patent number: 9443899Abstract: An improved back side illuminated (BSI) complementary metal oxide semiconductor (CMOS) image sensor, and associated methods, improve phase detecting capability. The BSI CMOS image sensor has an array of pixels that include a phase detecting pixel (PDP), a composite grid formed of a buried color filter array and composite metal/oxide grid, and a photodiode implant corresponding to the PDP. A PDP mask is fabricated with a deep trench isolation (DTI) structure proximate the PDP and positioned to mask at least part of the photodiode implant such that the PDP mask is positioned between the composite grid and the photodiode implant.Type: GrantFiled: November 4, 2015Date of Patent: September 13, 2016Assignee: OmniVision Technologies, Inc.Inventors: Chia-Ying Liu, Chin-Poh Pang, Chih-Wei Hsiung, Vincent Venezia
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Patent number: 9444999Abstract: A feature detection process includes identifying an approximate location of a feature in a preliminary image. A gradient phase map of image pixel intensities within the approximate location is computed. A projection result is determined by applying a projection function to the gradient phase map. The projection result is analyzed to determine a state of the feature.Type: GrantFiled: August 5, 2014Date of Patent: September 13, 2016Assignee: OmniVision Technologies, Inc.Inventor: Ming-Kai Hsu
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Patent number: 9443894Abstract: An imaging package includes an image sensor package formed with a semiconductor substrate. A removable transparent cover is bonded over the image sensor package to cover a first side the image sensor package. A lateral dimension of the removable transparent cover along a first direction is larger than a lateral dimension of the image sensor package along the first direction. An overhang portion of the removable transparent cover is defined by an exposed portion of the removable transparent cover that extends beyond a lateral side of the image sensor package along the first direction.Type: GrantFiled: March 9, 2015Date of Patent: September 13, 2016Assignee: OmniVision Technologies, Inc.Inventors: Wei-Feng Lin, Chi-Kuei Lee
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Patent number: 9438866Abstract: Embodiments of an apparatus including a pixel array including a plurality of individual pixels grouped into pixel kernels having two or more individual pixels, wherein each pixel kernel includes a floating diffusion electrically coupled to all individual pixels in the kernel. A color filter array (CFA) is positioned over and optically coupled to the pixel array, the CFA comprising a plurality of tiled minimal repeating units, each including a plurality of scaled filters having a photoresponse selected from among two or more different photoresponses. Individual pixels within each pixel kernel are optically coupled to a scaled filter.Type: GrantFiled: April 23, 2014Date of Patent: September 6, 2016Assignee: OmniVision Technologies, Inc.Inventors: Johannes Solhusvik, Per Olaf Pahr
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Patent number: 9438779Abstract: A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.Type: GrantFiled: February 9, 2015Date of Patent: September 6, 2016Assignee: OmniVision Technologies, Inc.Inventors: Chuen-Yi Yin, Jau-Jan Deng
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Patent number: 9438794Abstract: A method for coordinated adjustment of a first image captured by a first camera and a second image captured by a second camera includes determining a first set of image processing parameters from the first image and a second set of image processing parameters from the second image, transmitting the first set of image processing parameters to a master, the master not being the first camera; combining at least the first and second sets of processing parameters into a combined or composite set of parameters; transmitting the composite parameters from the master to the first camera; and using a processor of the first camera to apply the composite parameters to the first image, and a processor of the second camera to apply composite parameters to the second image. An apparatus has at least two cameras configured to implement the method.Type: GrantFiled: June 25, 2013Date of Patent: September 6, 2016Assignee: Omnivision Technologies, Inc.Inventor: Gabor Mikes
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Patent number: 9432589Abstract: A method determines a pixel value in a high dynamic range image from two images of different brightness by obtaining corresponding input pixel intensities from the two images, determining combination weights, and calculating the pixel value in the high dynamic range image as a weighted average of the input pixel intensities. Another method determines a pixel value in a high dynamic range image from more than two images by forming pairs of corresponding input pixel intensities, determining relative combination weights for the input pixels intensities for each pair, applying a normalization condition to determine absolute combination weights, and calculating the pixel value in the high dynamic range image as a weighted average of the input pixel intensities. Systems for generating high dynamic range image generation from two or more input images include a processor, a memory, a combination weight module, and a pixel value calculation module.Type: GrantFiled: August 15, 2013Date of Patent: August 30, 2016Assignee: OmniVision Technologies, Inc.Inventors: Jiangtao Kuang, Donghui Wu, Jizhang Shan
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Patent number: 9431452Abstract: An image sensor includes a photodiode proximate to a front side of semiconductor material to accumulate image charge. A metal layer reflector structure is disposed in a dielectric layer proximate to the front side of the semiconductor material. A contact reflecting ring structure is disposed in the dielectric layer between the metal layer reflector structure and a contact etch stop layer disposed over the front side of the semiconductor material. The contact reflecting ring structure defines a portion of a light guide in the dielectric layer such that light that is directed through a back side of the semiconductor material, through the photodiode, and reflected from the metal layer reflector structure back through the photodiode is confined to remain within an interior of the contact reflecting ring structure when passing through the dielectric layer between the photodiode and the metal layer reflector structure.Type: GrantFiled: May 13, 2015Date of Patent: August 30, 2016Assignee: OmniVision Technologies, Inc.Inventors: Chia-Ying Liu, Chih-Wei Hsiung
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Patent number: 9432642Abstract: An imaging system and method having a selected depth of field include an imaging lens for forming images of an object, the imaging lens having chromatic aberration and a color image sensor for receiving the images of the object. The color image sensor has a selected spectral response, the selected spectral response of the color image sensor defining a selected first center wavelength, a selected second center wavelength and a selected third center wavelength, wherein the selected first center wavelength is larger than the selected second center wavelength and the selected second center wavelength is larger than the selected third center wavelength. The selected spectral response defines the depth of field of the imaging system. A difference between the selected first center wavelength and the selected third center wavelength is greater than 150 nm.Type: GrantFiled: December 12, 2011Date of Patent: August 30, 2016Assignee: OmniVision Technologies, Inc.Inventors: Lu Gao, Jizhang Shan, Guansong Liu, Hongjun Li
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Patent number: 9431456Abstract: An image sensor is fabricated by forming transfer gates over a substrate layer. A transfer gate is disposed between a respective shared charge-to-voltage conversion region and a photodetector associated with the shared charge-to-voltage conversion region. The transfer gates of each shared charge-to-voltage conversion region are spaced apart to form a conversion region gap. A masking conformal dielectric layer is deposited over the image sensor, covers the transfer gates, fills each conversion region gap, and is etched to form sidewall spacers along an outside edge of each transfer gate with a portion remaining in each conversion region gap and disposed over the substrate layer in each conversion region gap. Source/drain regions are implanted in the substrate layer where an implant region is formed in the transfer gates. The masking conformal dielectric layer in each conversion gap masks the source/drain implant Each charge-to-voltage conversion region is substantially devoid of the implant region.Type: GrantFiled: February 10, 2015Date of Patent: August 30, 2016Assignee: OmniVision Technologies, Inc.Inventors: Hung Q. Doan, Eric G. Stevens
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Patent number: 9420176Abstract: A 360 degree camera system includes a support structure, a plurality of image capture devices, a plurality of lens systems, and an image processing system. The image capture devices are positioned such that their height is greater than their width. The image processing system includes a rotation module for remapping the pixel addresses of the image data to join the captured images along their long edges.Type: GrantFiled: June 19, 2014Date of Patent: August 16, 2016Assignee: OmniVision Technologies, Inc.Inventors: Jeff Hsieh, Yuguo Ye, Hui Wang, Wei-Feng Huang
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Patent number: 9418193Abstract: Arrayed imaging systems include an array of detectors formed with a common base and a first array of layered optical elements, each one of the layered optical elements being optically connected with a detector in the array of detectors.Type: GrantFiled: December 2, 2013Date of Patent: August 16, 2016Assignee: OmniVision Technologies, Inc.Inventors: Edward R. Dowski, Jr., Paulo E. X. Silvieri, George C. Barnes, IV, Vladislav V. Chumachenko, Dennis W. Dobbs, Regis S. Fan, Gregory E. Johnson, Miodrag Scepanovic, Satoru Tachihara, Christopher J. Linnen, Inga Tamayo, Donald Combs, Howard E. Rhodes, James He, John J. Mader, Kenneth Kubala, Mark Meloni, Brian Schwartz, Robert Cormack, Michael Hepp, Gary L. Duerksen
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Patent number: 9419035Abstract: An example image sensor includes first, second, and third micro-lenses. The first micro-lens is in a first color pixel and has a first curvature and a first height. The second micro-lens is in a second color pixel and has a second curvature and a second height. The third micro-lens is in a third color pixel and has a third curvature and a third height. The first curvature is the same as both the second curvature and the third curvature and the first height is greater than the second height and the second height is greater than the third height, such that light absorption depths for the first, second, and third color pixels are the same.Type: GrantFiled: January 5, 2012Date of Patent: August 16, 2016Assignee: OmniVision Technologies, Inc.Inventors: Fei Wu, Hongjun Li, Yin Qian, Hsin-Chih Tai, Howard E. Rhodes, Jizhang Shan