Abstract: A color filter array for use on a color image sensor includes an oxide grid having sidewalls arranged to define openings in the oxide grid. Each one of the openings is to be disposed over a corresponding pixel cell of the color image sensor. Oxide support structures are disposed in an interior region of each opening in the oxide grid over a corresponding pixel cell of the color image sensor. The openings in the oxide grid are filled with color filter material of a corresponding color filter. A surface tension between each oxide support structure and the surrounding color filter material of the color filter is adapted to provide uniform thickness for the color filters within the corresponding openings in the oxide grid.

Abstract: A Mobile Industry Processor Interface (MIPI) physical layer (D-PHY) serial communication link and a method of reducing clock-data skew in a MIPI D-PHY serial communication link include apparatus including a clock transmitting circuit for transmitting a clock signal on a first lane of the MIPI D-PHY serial link, a data transmitting circuit for transmitting a data signal on a second lane of the MIPI D-PHY serial link, a clock receiving circuit for receiving the clock signal on the first lane of the MIPI D-PHY serial link, and a data receiving circuit for receiving the data signal on the second lane of the MIPI D-PHY serial link. The clock transmitting circuit and the data transmitting circuit transmit the clock signal and the data signal in phase during a calibration mode and out of phase during a normal operation mode.

Abstract: An automated cell growth/migration detection system includes: a container for containing a cell growth/migration matrix/medium into which deposited cells form a cell surface; an image sensor for capturing images; an actuator for incrementally varying distance between the image sensor lens and the cell surface such that the images correspond to varying imaging depths; and an image data processor for processing the images to determine cell growth/migration. An automated cell growth/migration detection method includes: capturing a first image series of a cell surface within a first imaging cycle corresponding to a sequence of imaging depths between the cell surface and an image sensor; capturing an additional image series of the cell surface within each of at least one additional imaging cycle and corresponding to the same sequence of imaging depths; processing each image series for each imaging cycle to determine a clearest-looking image; and determining cell growth/migration from the clearest-looking image.

Abstract: A method for manufacturing one or more curved image sensor systems includes (a) at elevated pressure relative to atmospheric pressure, bonding a light-transmitting substrate to an image sensor wafer having at least one pixel array, to form a composite wafer with a respective hermetically sealed cavity between the light-transmitting substrate and each pixel array, and (b) thinning the image sensor wafer of the composite wafer to induce deformation of the image sensor wafer to form a concavely curved pixel array from each pixel array. A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface and a pixel array located along the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

Abstract: A suspended lens system, for imaging a scene, includes (a) a single-piece lens for receiving light from the scene, wherein the single-piece lens includes a concave surface, and (b) a substrate including a side that faces the concave surface, for holding the single-piece lens, wherein the substrate has non-zero optical transmission and contacts only portions of the single-piece lens that are away from the concave surface. A wafer-level method for manufacturing a suspended lens system includes molding a lens array, wherein each lens of the lens array includes a concave surface, and bonding the lens array to a surface of a substrate that has non-zero optical transmission, such that the concave surfaces face the substrate, to form a suspended lens wafer.

Abstract: An integrated circuit system includes a first device and second device wafer. A wafer bonding region is disposed at an interface of a front side of a first dielectric layer of the first device wafer and a front side of a second dielectric layer of the second device wafer such that wafer bonding region bonds the first device wafer to the second device wafer. The wafer bonding region includes dielectric material having a higher silicon concentration than a dielectric material of the first and second dielectric layers of the first and second device wafers. A conductive path couples a first conductor of the first device wafer to a second conductor of the second device wafer. The conductive path is formed in a cavity etched through the wafer bonding region between the first conductor and the second conductor.

Abstract: A pixel cell includes a photodiode disposed within a first semiconductor chip for accumulating an image charge in response to light incident upon the photodiode. A transfer transistor is disposed within the first semiconductor chip and coupled to the photodiode to transfer the image charge from the photodiode. A bias voltage generation circuit disposed within a second semiconductor chip for generating a bias voltage. The bias voltage generation circuit is coupled to the first semiconductor chip to bias the photodiode with the bias voltage. The bias voltage is negative with respect to a ground voltage of the second semiconductor chip. A floating diffusion is disposed within the second semiconductor chip. The transfer transistor is coupled to transfer the image charge from the photodiode on the first semiconductor chip to the floating diffusion on the second semiconductor chip.

Abstract: A single photon avalanche diode (SPAD) includes an n doped epitaxial layer disposed in a first semiconductor layer. A p doped epitaxial layer is above the n doped epitaxial layer on a back side of the first semiconductor layer. A multiplication junction is defined at an interface between the n doped epitaxial layer and the p doped epitaxial layer. A multiplication junction is reversed biased above a breakdown voltage such that a photon received through the back side of the first semiconductor layer triggers an avalanche multiplication process in the multiplication junction. A p? doped guard ring region is implanted in the n doped epitaxial layer surrounding the multiplication junction.

Abstract: A photosensor has a masking layer having an opening over a central photodiode and a first adjacent photodiode, the first adjacent photodiode covered by the masking layer and located sufficiently near the central photodiode that at least some light admitted through the opening over the central photodiode reaches the first adjacent photodiode through the central photodiode. The photosensor also has a second adjacent photodiode; the second adjacent photodiode covered by the masking layer and located sufficiently near the first adjacent photodiode that at least some light admitted through the opening over the central photodiode is capable of reaching the second adjacent photodiode through the first adjacent photodiode. Circuitry is provided for reading the photodiodes and generating a blue, a green, and a red channel signal by processing signals read from the photodiodes.

Abstract: A multiple image sensor image acquisition system includes a clock control unit to generate a synchronization clock signal. The synchronization clock signal has a prolonged constant cycle during which the synchronization clock signal is held at a constant level for a period of time corresponding to multiple clock cycles. A first image sensor is coupled with the clock control unit to receive the synchronization clock signal and has a first synchronization unit that is operable to synchronize operation for the first image sensor based on detection of an end of the prolonged constant cycle. A second image sensor is coupled with the clock control unit to receive the synchronization clock signal and has a second synchronization unit that is operable to synchronize operation for the second image sensor based on detection of the end of the prolonged constant cycle. The image sensors are synchronized operationally.

Abstract: An image sensor includes a plurality of photosensitive devices arranged in a semiconductor substrate. A planar layer is disposed over the plurality of photosensitive devices in the semiconductor substrate. A plurality of first microlenses comprised of a lens material is arranged in first lens regions on the planar layer. A plurality of lens barriers comprised of the lens material is arranged on the planar layer to provide boundaries that define second lens regions on the planar layer. A plurality of second microlenses comprised of the lens material is formed within the boundaries provided by the plurality of lens barriers that define the second lens regions on the planar layer. The plurality of lens barriers are integrated with respective second microlenses after a reflow process of the plurality of second microlenses.

Abstract: An image sensor pixel for use in a high dynamic range image sensor includes a first photodiode and a second photodiode. The first photodiode include a first doped region, a first lightly doped region, and a first highly doped region disposed between the first doped region and the first lightly doped region. The second photodiode has a second full well capacity substantially equal to a first full well capacity of the first photodiode. The second photodiode includes a second doped region, a second lightly doped region, and a second highly doped region disposed between the second doped region and the second lightly doped region. The first photodiode can be used to for measuring low light and the second photodiode can be used for measuring bright light.

Abstract: Methods and systems for JPEG encoding and decoding are disclosed. In the encoding method, an image is split into 8×8 pixel blocks and the 8×8 pixel blocks are grouped into a number of minimum coded units (MCU's), such that each MCU consists of a constant number of 8×8 pixel blocks. The MCU's are then scanned to forward discrete cosine transform, quantization, zigzag scanning and entropy encoding processes and are subsequently converted into bitstreams according to entropy encoding coding tables. In the entropy encoding process, AC coefficients are run-length encoded, while DC coefficients are not subjected to differential pulse-code modulation. The bitstreams are byte-aligned by stuffing zeroes and compression data for a special JPEG file are generated from the byte-aligned bitstreams. A position table is established, recording positions of the bitstreams in the compression data. The method enables fast positioning of bitstreams corresponding to an image region of interest.

Abstract: A method of generating a high resolution color image includes focusing a first image onto a monochrome image sensor having a P resolution and focusing a second image onto a color image sensor having a Q resolution, where Q<P, and where the first image is a same image as the second image. P resolution pixel data representative of the first image from the monochrome image sensor is generated. Q resolution pixel data representative of the second image from the color image sensor is generated. The P resolution pixel data representative of the first image from the monochrome image sensor and the Q resolution pixel data representative of the second image from the color image sensor are combined to generate an R resolution color image, where P<R?(P+Q).

Abstract: An image sensor array has a tiling unit comprising a source follower stage coupled to buffer signals from a photodiode when the unit is read onto a sense line, the source follower stage differs from conventional sensor arrays because it uses an N-channel transistor having a P-doped polysilicon gate. In embodiments, other transistors of the array have conventional N-channel transistors with N-doped polysilicon gates.

Abstract: A system for attaching a device to a glasses frame includes a spring clip that applies pressure to two sides of the glasses frame, and a magnet for attaching the device thereto. The device may attach directly to the magnet, or via a slide-on attachment piece. The spring clip may include a spring arm having distal ends that assist the spring clip in applying pressure to the glasses frames.

Abstract: An image sensor system includes an image sensor and a host controller. The image sensor includes a power input terminal, a data terminal, a clock input terminal, and a ground terminal. The host controller is coupled to the power input terminal to provide power to the image sensor, the data terminal to receive analog image data from the image sensor, the clock input terminal to provide a clock signal to the image sensor, and the ground terminal. The ground terminal serves as a common reference between the image sensor and one or more circuits of the host controller. The system also includes logic that is configured to transfer the analog image data from the image sensor to the host controller through the data terminal of the image sensor and to transfer one or more digital control signals between the image sensor and the host controller through the data terminal.

Abstract: A pixel cell includes a latch having an input terminal and an output terminal. The latch is coupled to provide a latched output signal at the output terminal responsive to the input terminal. A first precharge circuit is coupled to precharge the input terminal of the latch to a first level during a reset of the pixel cell. A single photon avalanche photodiode (SPAD) is coupled to provide a SPAD signal to the input terminal of the latch in response to a detection of a photon incident on the SPAD.

Abstract: Capturing a target image includes activating a first image sensor for capturing the target image. A sequence of images is captured with a second image sensor while the first image sensor remains activated. A determination is made as to whether the sequence of images captured by the second image sensor includes a shutter gesture while the first image sensor remains activated. If a shutter gesture is included in the sequence of images captured by the second image sensor, the first image sensor captures the target image in response.

Abstract: A system has in an integrated circuit a seed memory coupled to seed a vector generator that provides a vector to at least one scan chain of a first functional unit. A signature generator is configured to generate a signature from scan chain data, the signature is compared to an expected signature in a signature memory. A state memorizer is provided for saving a state of the functional unit and to restore the state of the functional unit as testing is completed. The system also has apparatus configured to determine an idle condition of the functional unit despite a non-idle state of the system; and a control unit configured to operate a test sequence when the functional unit is idle, the test sequence saving a state of the unit, generating vectors and signatures and verifying the signatures, and restoring the state of the unit.