Patents Assigned to OSRAM
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Patent number: 9773945Abstract: A method for producing a plurality of semiconductor components and a semiconductor component is disclosed. In some embodiment, the method includes forming a semiconductor layer sequence, structuring the semiconductor layer sequence by forming trenches thereby structuring semiconductor bodies, applying an auxiliary substrate on the semiconductor layer sequence, so that the semiconductor layer sequence is arranged between the auxiliary substrate and the substrate and removing the substrate from the semiconductor layer sequence.Type: GrantFiled: January 28, 2016Date of Patent: September 26, 2017Assignees: OSRAM Opto Semiconductors GmbH, X-Celeprint LimitedInventors: Matthew Meitl, Christopher Bower, Tansen Varghese
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Publication number: 20170271295Abstract: An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.Type: ApplicationFiled: September 17, 2015Publication date: September 21, 2017Applicants: OSRAM Opto Semiconductors GmbH, OSRAM Opto Semiconductors GmbHInventor: Andreas Ploessl
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Patent number: 9768344Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.Type: GrantFiled: April 5, 2016Date of Patent: September 19, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
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Patent number: 9768360Abstract: An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material directly applied by atomic layer deposition, wherein the semiconductor component is applied on a carrier, the carrier includes electrical connection layers, the semiconductor component electrically connects to one of the electrical connection layers via an electrical contact element, and the sealing material completely covers in a hermetically impermeable manner and directly contacts all exposed surfaces including sidewall and bottom surfaces of the semiconductor component and the electrical contact element and all exposed surfaces of the carrier apart from an electrical connection region of the carrier.Type: GrantFiled: September 14, 2016Date of Patent: September 19, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Michael Fehrer, Alfred Lell, Martin Müller, Tilman Schlenker, Sönke Tautz, Uwe Strauβ
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Patent number: 9765945Abstract: A lighting device may include a channel-shaped housing having two ends with a main axis of the housing extending between the ends, a pair of mounting fixtures for a pair of light radiation sources within the housing with the light radiation sources radiating light radiation in opposite directions along the main axis, and a pair of reflectors each facing a respective one of the mounting fixtures to receive light radiation along the main axis and reflect it to the outside of the housing.Type: GrantFiled: March 4, 2013Date of Patent: September 19, 2017Assignee: Osram GmbHInventors: Alessandro Scordino, Alberto Alfier, Dina Pasqualini, Marco Lamonato
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Patent number: 9765952Abstract: A device for mounting lighting sources on a substrate includes a channel-like mounting frame provided with fixing formations for fixing on said substrate, said mounting frame defining a cavity for receiving said lighting source with said lighting source resting on said substrate, a slider member which can be positioned in said cavity of said mounting frame to urge said lighting source toward said substrate; said slider member being slidable with respect to said mounting frame between an insertion position and a locking position, wherein said mounting frame and said slider member bear complementary engagement formations cooperating in a ramp-like manner to force said slider member and the lighting source urged thereby toward said substrate when said slider member is advanced from said insertion position toward said locking position.Type: GrantFiled: October 2, 2012Date of Patent: September 19, 2017Assignee: Osram GmbHInventors: Alberto Zanotto, Simon Bobbo, Alberto Alfier, Franco Zanon, Matteo Toscan, Lorenzo Roberto Trevisanello
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Publication number: 20170261184Abstract: Enclosures with grommetless strain relief are provided, each including a base and a cover. The base has a bottom and four sidewalls arranged to provide an open box-like structure. A first of the sidewalls of the base is configured with a wire routing slot at its perimeter. The cover has a top and four sidewalls arranged to provide an open box-like structure configured to couple with the base, so as to provide a strain relief for an electrical wire passing through the wire routing slot. The wire is pressed against a length of the first sidewall of the base by a first sidewall of the cover. The enclosure may include other features, such as rounded edges in the wire routing path, a wire guide and/or strap to inhibit wire movement between the first sidewalls, and/or one or more locking mechanisms configured to secure the cover to the base.Type: ApplicationFiled: May 30, 2017Publication date: September 14, 2017Applicant: OSRAM SYLVANIA Inc.Inventors: Alex Oksengendler, Glenn Freeman, Andrew Wilson, Robert Wilson
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Publication number: 20170263825Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, the method includes arranging an optoelectronic semiconductor chip and a reflector on a top side of a carrier film, arranging a potting material in a region between the optoelectronic semiconductor chip and the reflector and forming a molded body, wherein the optoelectronic semiconductor chip, the reflector and the potting material are embedded into the molded body.Type: ApplicationFiled: August 26, 2015Publication date: September 14, 2017Applicant: OSRAM Opto Semiconductors GmbHInventors: Markus Pindl, Juergen Moosburger
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Patent number: 9763330Abstract: A circuit board for an optoelectronic semiconductor chip includes an electrically conductive first metal foil, a first electrically insulating foil, an electrically conductive second metal foil, wherein the first electrically insulating foil is applied to the first metal foil at a top side of the first metal foil and mechanically connects thereto, the first electrically insulating foil has a recess in which the first metal foil is exposed, the recess electrically conductively fixes the optoelectronic semiconductor chip to the first metal foil within the recess, the second metal foil is applied at a top side of the first electrically insulating foil, the top side facing away from the first metal foil, and mechanically connects to the electrically insulating foil, the first electrically insulating foil is free of the second metal foil at least in the region of the recess, and the second metal foil electrically contacts the optoelectronic semiconductor chip.Type: GrantFiled: January 28, 2014Date of Patent: September 12, 2017Assignee: OSRAM GmbHInventors: Martin Rudolf Behringer, Stefan Groetsch
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Patent number: 9761512Abstract: A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.Type: GrantFiled: March 11, 2015Date of Patent: September 12, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Stephan Preuss, Michael Zitzlsperger
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Patent number: 9761770Abstract: An optoelectronic semiconductor chip includes a semiconductor body with an active region provided for generating electromagnetic radiation, a first mirror layer provided for reflecting the electromagnetic radiation, a first encapsulation layer formed with an electrically insulating material, and a carrier provided for mechanically supporting the first encapsulation layer, the first mirror layer and the semiconductor body. The first mirror layer is arranged between the carrier and the semiconductor body. The first encapsulation layer is arranged between the carrier and the first mirror layer. The first encapsulation layer is an ALD layer.Type: GrantFiled: January 14, 2014Date of Patent: September 12, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Johann Eibl, Sebastian Taeger, Lutz Höppel, Karl Engl, Stefanie Rammelsberger, Markus Maute, Michael Huber, Rainer Hartmann, Georg Hartung
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Patent number: 9761769Abstract: An electromagnetic radiation emitting assembly includes a carrier, an electromagnetic radiation emitting component arranged above the carrier, and a potting material at least partly surrounding the electromagnetic radiation emitting component and into which are embedded phosphor that converts the electromagnetic radiation and heat-conducting particles that conduct heat arising during operation of the electromagnetic radiation emitting assembly, wherein a phosphor concentration in the potting material near the electromagnetic radiation emitting component is greater than a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component, and a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component is greater than in the potting material remote from the electromagnetic radiation emitting component.Type: GrantFiled: March 25, 2014Date of Patent: September 12, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Hailing Cui, Kathy Schmidtke
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Patent number: 9761758Abstract: An optoelectronic semiconductor component includes a layer sequence including a p-doped layer, an n-doped layer and an active zone that generates electromagnetic radiation arranged between the n-doped layer and the p-doped layer, wherein the n-doped layer includes at least GaN, an interlayer is arranged in the n-doped layer, wherein the interlayer includes AlxGa1-xN, wherein 0<x?1, and the interlayer includes magnesium.Type: GrantFiled: April 17, 2014Date of Patent: September 12, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Tobias Meyer, Matthias Peter, Jürgen Off, Alexander Walter, Tobias Gotschke, Christian Leirer
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Patent number: 9761434Abstract: A lamp (10) is formed of a lamp capsule (1) sealed with a press seal (2) penetrated by electrical lead-ins (12), the lamp (1) being received in an insulating base (16) that has external electrical pins (18). Power leads (20) interconnect respective capsule lead-ins (12) and base pins (18). Power leads (20) are formed of stranded wire having a plurality of intertwined strands.Type: GrantFiled: June 21, 2016Date of Patent: September 12, 2017Assignee: OSRAM SYLVANIA Inc.Inventors: Arturo de Santiago Garcia, Miguel Perez, Francisco Rodriguez Salamanca
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Patent number: 9761767Abstract: A light source includes a primary radiation source, which emits radiation in the shortwave range of the optical spectral range, wherein this radiation is converted at least by means of a first luminescent substance entirely or partially into secondary longer-wave radiation in the visible spectral range, wherein the first luminescent substance originates from the class of nitridic modified orthosilicates (NOS), wherein the luminescent substance has as a component M predominantly the group EA=Sr, Ba, Ca, or Mg alone or in combination, wherein the activating dopant D is composed at least of Eu and replaces a proportion of M, and wherein a proportion of SiO2 is introduced in deficiency, so that a modified sub-stoichiometric orthosilicate is provided, wherein the orthosilicate is an orthosilicate stabilized with RE and N, where RE=rare earth metal.Type: GrantFiled: September 5, 2012Date of Patent: September 12, 2017Assignees: OSRAM OPTO SEMICONDUCTORS GMBH, OSRAM GMBHInventors: Barbara Huckenbeck, Hailing Cui, Frank Jermann
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Patent number: 9759852Abstract: Techniques are disclosed for obtaining a desired luminance and/or intensity distribution from any lighting fixture that is illuminated by a lightguide. The techniques can be used, for instance, to design a non-uniform surface texture (e.g., of light extraction features) for a lightguide, wherein the surface texture achieves a desired uniform or an intentionally non-uniform luminance distribution for a given lightguide shape/geometry, dimensions, and/or composition. In some embodiments, an iteration algorithm with illuminance distribution feedback is utilized to design a non-uniform surface texture (e.g., geometry, dimensions, quantity and/or spatial distribution of light extraction features) to achieve the target luminance distribution for a given lighting application.Type: GrantFiled: May 19, 2015Date of Patent: September 12, 2017Assignee: OSRAM SYLVANIA INC.Inventors: Qiong Huang, Ming Li, Yi Yang, Joseph A. Olsen
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Patent number: 9761772Abstract: A method for producing an optoelectronic semiconductor chip is disclosed. In some embodiment the method includes arranging a metallic mirror layer on a top side of a semiconductor layer sequence, arranging a mirror protection layer at least on exposed lateral surfaces of the mirror layer in a self-aligning manner, wherein the mirror layer has openings toward the semiconductor layer sequence, and wherein the openings are framed in lateral directions by the mirror protection layer and partially removing the semiconductor layer sequence in a region of the openings of the mirror layer.Type: GrantFiled: August 22, 2013Date of Patent: September 12, 2017Assignee: OSRAM Opto Semiconductors GmbHInventor: Alexander Pfeuffer
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Patent number: 9762320Abstract: Techniques are disclosed for coding light-based communication (LCom) data in a manner that allows for detection thereof, for example, via a standard low-speed (e.g., 30 frames per second) smartphone camera. In accordance with some embodiments, the disclosed techniques can be used, for example, in encoding and decoding LCom data in a manner that: (1) prevents or otherwise minimizes perceivable flicker of the light output by a transmitting LCom-enabled luminaire; and/or (2) avoids or otherwise reduces a need for additional, specialized receiver hardware at the receiver computing device including the camera. In some cases, the disclosed techniques can be used, for example, to enhance the baud rate between a transmitting LCom-enabled luminaire and a receiver device.Type: GrantFiled: December 18, 2014Date of Patent: September 12, 2017Assignee: OSRAM SYLVANIA Inc.Inventors: Christian Breuer, Anant Aggarwal, Bernhard Siessegger
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Patent number: 9761840Abstract: An organic light-emitting diode includes a carrier substrate, a scattering layer, a first electrode, an organic layer sequence with at least one active layer, and a second electrode wherein all the components are arranged in the stated sequence, the scattering layer has a higher average refractive index than the organic layer sequence, the first electrode has at least n or at least n+1 non-metal layers and n metal layers, n is a natural number greater than or equal to 1 or greater than or equal to 2, and the non-metal layers and the metal layers succeed one another alternately.Type: GrantFiled: June 17, 2013Date of Patent: September 12, 2017Assignee: OSRAM OLED GmbHInventors: Daniel Steffen Setz, Erwin Lang, Marc Philippens
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Patent number: 9761576Abstract: An optoelectronic semiconductor chip has a first semiconductor layer sequence which comprises a multiplicity of microdiodes, and a second semiconductor layer sequence which comprises an active region. The first semiconductor layer sequence and the second semiconductor layer sequence are based on a nitride compound semiconductor material, the first semiconductor layer sequence is before the first semiconductor layer sequence in the direction of growth, and the microdiodes form an ESD protection for the active region.Type: GrantFiled: April 14, 2015Date of Patent: September 12, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Rainer Butendeich, Alexander Walter, Matthias Peter, Tobias Meyer, Tetsuya Taki, Hubert Maiwald