Abstract: The invention refers to a light emitting device including a semiconductor chip having a main radiation surface, which emits UV light in operation, a phosphor, which is arranged in the radiation beam of the UV light, absorbs partially the UV light, wherein the phosphor converts the UV light into visible light so that the device emits mixed light comprising the UV light as well as visible light.

Abstract: A phosphor may have the empirical formula: (AB)1+x+2yAl11?x?y(AC)xLiyO17:E, where 0<x+y<11; x>0; AC=B, Ga, In, or combinations thereof; AB=Na, K, Rb, Cs, or combinations thereof; and E=Eu, Ce, Yb, Mn, or combinations thereof. The phosphor may be used in conversion LED components.

Abstract: A method for producing a semiconductor device may include applying one or more semiconductor components onto a device body where the device body has a substrate and an integrated circuit. The semiconductor component(s) may include an active zone configured to receive radiation. The method may further include transferring a multitude of semiconductor components from a sacrificial wafer to a target wafer with the device bodies still coupled by using a stamp to place them onto said device bodies. The stamp may be pressed onto the semiconductor components to adhere to the semiconductor components to the stamp and transfer them. As soon as the stamp moves in the opposite direction, the semiconductor component(s) may be separated from holding structures by breaking away webs or their projections on the second semiconductor body and leaving a breaking point directly on an outside of the semiconductor component.

Abstract: A lighting assembly is provided with a housing defining a cavity with a rearward opening and a forward opening formed opposite the rearward opening along a longitudinal axis. A plurality of light sources is supported by the housing and disposed within the rearward opening. A first lens is supported by the housing with a plurality of optics each aligned with one of the plurality of light sources to receive light and collimate the received light within the housing, wherein the first lens is formed of glass. A second lens is disposed within the forward opening of the housing to receive the collimated light and generate an illumination pattern.

Abstract: An optoelectronic component comprising a laser diode is disclosed.

Abstract: A multi-COB-LED lighting module includes a submount; and a plurality of clusters of LED-chips that emit light radiation in respective emission bands, wherein each LED-chip cluster includes a plurality of LED-chips arranged on the submount by chip on board technology and emit light radiation in a respective emission band, and at least two LED-chips of at least a first LED-chip cluster each borders with a plurality of LED-chips belonging to one or more clusters of LED-chips different from the first LED-chip cluster and connect one to the other by at least a wire bond that extends above one or more of the adjoining LED-chips.

Abstract: In an embodiment a light-emitting component includes a housing and an edge emitting semiconductor laser arranged in the housing, wherein the semiconductor laser is configured to emit light at a side face in an angle range, wherein the housing includes an emission opening for emitting the light, wherein the semiconductor laser is arranged in a first layer having a first material, wherein a second layer is arranged on the first layer, the second layer having a second material, wherein the first layer and the second layer are transmissive to the light, wherein the second layer is arranged between the first layer and the emission opening, wherein the emission opening lies at least partly outside the angle range of the semiconductor laser, and wherein a part of the light is directed directly onto an interface between the first and second layers.

Abstract: An optoelectronic module comprising at least one semiconductor laser and a photonic chip is described herein. The semiconductor laser emits a primary electromagnetic radiation which is coupled into the photonic chip. The photonic chip comprises at least one first waveguide and at least one optical Bragg reflector having a reflectivity which is modulated by an electrical modulation signal. A secondary electromagnetic radiation is coupled out of the photonic chip by means of at least one second waveguide, wherein the secondary electromagnetic radiation has a dominant wavelength which is modulated in dependence of the electrical modulation signal. Further, a method for operating an optoelectronic module and a Head-Mounted Display comprising an optoelectronic module are provided.

Abstract: In an embodiment a conversion element includes a grid having a plurality of openings, a plurality of conversion segments configured to convert a part of a primary radiation into a secondary radiation, wherein the conversion segments are arranged in the openings, wherein the conversion segments include a matrix material into which fluorescent particles are incorporated, wherein the fluorescent particles are sedimented in a sedimented layer and a semiconductor material, a plastic or a metal, wherein the grid terminates flush with the conversion segments.

Abstract: An optoelectronic device comprises a phosphor plate, an optoelectronic chip comprising a layer stack of a first optoelectronic semiconductor layer and a second optoelectronic semiconductor layer, a first electrode, and a second electrode. The optoelectronic chip is attached to the phosphor plate, so that the second optoelectronic semiconductor layer is arranged between the phosphor plate and the first optoelectronic semiconductor layer. The first electrode and the second electrode are arranged on a first main surface of the first optoelectronic semiconductor layer on a side remote from the phosphor plate. The second electrode directly contacts the first optoelectronic semiconductor layer.

Abstract: A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.

Abstract: An optoelectronic device and a method of producing an optoelectronic device are disclosed. In an embodiment an optoelectronic device includes components including an active layer stack, a housing and electrical contacts and at least one protective layer on a surface of at least one of the components, wherein the at least one protective layer includes a cross-linked material with a three-dimensional polysiloxane-based network.

Abstract: A method for controlling at least two light-emitting diodes connected in series of a circuit assembly of a lighting device may include supplying the light-emitting diodes with a specifiable current by means of a controllable current source unit. The method may include connecting a bypass element in parallel with at least one of the light emitting diodes. The method may include detecting an electric supply voltage to the series circuit of the light-emitting diodes and the current source circuit, and controlling an electric conductivity of the bypass element based on the detected electric supply voltage and/or the light-emitting diode current.

Abstract: An optical-effect light may include a LIDAR system for detecting objects. The optical-effect light may be controlled based on one or more parameters of the detected object. The optical-effect light may include at least one radiation source configured to emit light and at least one acquisition unit configured to acquire data pertaining to the object(s). The light may be controlled based on the acquired data.

Abstract: A presence or an absence of an occupant is detected, and an occupancy sensor signal is generated representative of an active state in which the presence of the occupant is detected, and an inactive state in which the absence of the occupant is detected. An ambient light sensor detects the ambient light level and generates an ambient light sensor signal representative of the ambient light level. Dimmable illumination is generated at a first dimming level, based on the ambient light level, corresponding to the active state and a second dimming level corresponding to the inactive state. A transition delay time between an onset of the inactive state and a transition between the first dimming level and the second dimming level may be controlled. The first dimming level, the second dimming level, and/or the transition delay time may be variably set or controlled locally or via a remote device.

Abstract: An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment an optoelectronic semiconductor component includes a semiconductor layer sequence having a first region of a first conductivity type, a reflection layer, a passivation layer arranged between the semiconductor layer sequence and the reflection layer, a first barrier layer arranged between the first region of the semiconductor layer sequence and the passivation layer and a second barrier layer arranged between the passivation layer and the reflection layer, wherein the first barrier layer is configured to reduce or prevent diffusion of contaminants from the passivation layer into the semiconductor layer sequence, and wherein the second barrier layer is configured to reduce or prevent diffusion of contaminants from the passivation layer into the reflection layer.

Abstract: An installation such as, for example, a box or cabinet for horticultural applications includes a lighting space between a lighted plane and a lighting plane parallel to the lighted plane, with side walls that are at least partly light-reflective. The illuminated plane may be defined by the upper surface of a plant culture medium. A set of light radiation sources, e.g. LEDs, arranged centrally relative to the lighting plane projects light radiation towards the lighted plane in the direction of a radiation emission axis. The set of light radiation sources emits light radiation with a distribution of illuminance projected towards the lighted plane, wherein the lighted plane is non-uniform and gradually decreases as a function of the angle relative to the aforesaid radiation emission axis, wherein the reflection of the radiation on the side walls facilitates uniform illuminance at the lighted plane.

Abstract: A method for controlling at least one wireless network access point in a building may include detecting whether a wireless communication device is connected to at least one wireless network access point and/or whether a person is present using a group of presence detectors. An illumination system may include at least one wireless network point and/or the group of presence detectors. An activated network access point may remain activated when the wireless network access point is connected to a wireless communication device and/or when a person is present. A network access point may be automatically deactivated when the wireless network access point is not connected to a wireless communication device and/or when a person is not present. A deactivated network access point may be automatically reactivated when the wireless network access point is connected to a wireless communication device and/or when a person is present. Combinations thereof are also possible.

Abstract: A semiconductor laser diode is specified, the semiconductor laser diode includes a semiconductor layer sequence having an active layer which has a main extension plane and which, in operation, is adapted to generate light in an active region and to emit light via a light-outcoupling surface, the active region extending from a rear surface opposite the light-outcoupling surface to the light-outcoupling surface along a longitudinal direction in the main extension plane, the semiconductor layer sequence having a surface region on which a first cladding layer is applied in direct contact, the first cladding layer having a transparent material from a material system different from the semiconductor layer sequence, and the first cladding layer being structured and having a first structure.

Abstract: A light-emitting component is disclosed. In an embodiment a light-emitting component includes at least four light sources configured to emit light of different wavelength ranges in pairs and a control device configured to operate the light sources independently of one another in such a way that light from at least two of the light sources is mixed to form a mixed light and adjust an mv,mel,D65 value of the mixed light, wherein the at least four light sources include a first light source configured to emit electromagnetic radiation with a dominant wavelength of at most 450 nm, a second light source configured to emit electromagnetic radiation with a dominant wavelength of at least 480 nm and at most 520 nm or a dominant wavelength of at least 455 nm and at most 470 nm, a third light source configured to emit electromagnetic radiation in a spectral range of green light, and a fourth light source configured to emit electromagnetic radiation in a spectral range of yellow and/or amber light.