Abstract: Disclosed herein are a number of dielectric pillars, arranged to form a close-packed aperiodic array, such as a Vogel spiral, where the geometries of the aperiodic array produce azimuthally isotropic scattering of luminescence within a restricted angular cone of extraction. The aperiodic array can be formed, attached or placed on a converting material, such as, phosphor, to restrict emission to within the angular cone of extraction. The phosphor could be part of a converting illumination device, such as a phosphor coated light emitting diode, or a laser activated remote phosphor converting device.

Abstract: A phosphor and a method for making the phosphor are disclosed. In an embodiment a phosphor for emission of red light includes Sr(SraCa1-a)Si2Al2N6:Eu, wherein x is 0.8<x?1, wherein between 0.1% and 5% inclusive of the Sr, Ca and/or Sr/Ca lattice sites are replaced by Eu, wherein the parameter value a is between 0.6 and 1.0 inclusive, wherein the phosphor has a structure comprising (Si/Al)N4 tetrahedra arranged in a 3D network, in which layers in an a-c plane are linked in a b-direction, and wherein pure Sr positions and positions having a mixed Sr/Ca population are intercalated between the network, layer by layer.

Abstract: Aspects of the present disclosure include arrays of motion sensors that may be used to monitor a space to determine occupancy characteristics of the space, such as whether or not the space is occupied and the number of people located within the space. The array of motion sensors may be operatively connected to one or more building system components, such as lighting and HVAC equipment and can be used for adjusting an operating condition of the building system component based on whether a space is occupied.

Abstract: A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.

Abstract: A method for producing optoelectronic semiconductor chips and an optoelectronic semiconductor chip are disclosed. In an embodiment a method includes growing a semiconductor layer sequence with an active, attaching a carrier substrate, depositing a sacrificial layer on an outer side of the carrier substrate and/or of the growth substrate, structuring the sacrificial layer so that singulation lanes are formed and dividing the carrier substrate and/or the growth substrate along the singulation lanes by a singulation stream including a laser radiation or a plasma, wherein the sacrificial layer adjacent to the singulation lanes is not transmissive to the singulation stream, and wherein the singulation stream is passed both through the singulation lanes and over the sacrificial layer.

Abstract: A component includes a substrate, a first semiconductor body having a first active layer, a second semiconductor body having a second active layer, and a first transition zone, wherein the first active layer is configured to generate electromagnetic radiation of a first peak wavelength and the second active layer is configured to generate electromagnetic radiation of a second peak wavelength, in the vertical direction, the first transition zone is arranged between the first and second semiconductor bodies and is directly adjacent to the first and second semiconductor bodies, the first transition zone includes a radiation-transmissive, at least for the radiation of the first peak wavelength partially transparent and electrically conductive material so that the first semiconductor body electrically conductively connects to the second semiconductor body via the first transition zone, and the first transition zone includes a structured surface or a first partially transparent and partially wavelength-selectively

Abstract: An illumination dystem, an electronic Device and a method for using an illumination device are disclosed. In an embodiment an illumination device includes at least one semiconductor component configured to generate radiation, an optical element and a control circuit, wherein the optical element is configured to direct the radiation into a field of view to be illuminated, wherein the semiconductor component has a plurality of pixels of a first type, each pixel configured to illuminate the field of view in regions with radiation in a visible spectral range, and at least one infrared pixel configured to illuminate the field of view at least in regions with radiation in an infrared spectral range, wherein the pixels of the first type are arranged in a first matrix arrangement and the infrared pixels are arranged in a second matrix arrangement, and wherein the pixels of the first type and the at least one infrared pixel are operable via the control circuit.

Abstract: A semiconductor chip may have a radiation-permeable support, a semiconductor body, and a transparent current spreading layer. The semiconductor body may have an n-sided semiconductor layer, a p-sided semiconductor layer, and an optically active area therebetween. The semiconductor body may be secured to the support by means of a radiation permeable connection layer. The current spread layer may be based on zinc selenide and may be adjacent to the n-sided semi-conductor layer. A method for producing this type of semiconductor chip is also disclosed.

Abstract: A system and a method may be used for operating and/or calibrating a transmitter device. The system and method may include wirelessly transmitting a radio signal with identification data specific to the transmitter device and reference data. The transmitter device may transmit the radio signal with signal properties at least partially dependent on the reference data. A communication device may receive the radio signal and ascertain a distance between the transmitter device and the communication device using reception-side signal properties and the reference data ascertained from the received radio signal. A distance sensor may detect a distance between the transmitter device and the communication device. An evaluation unit may ascertain the reference data depending on the reception-side signal properties of the radio signal and the detected distance and to provide the ascertained reference data in the transmitter device for calibrating the transmitting device.

Abstract: In one embodiment, the optoelectronic semiconductor device comprises a carrier having electrical connection surfaces on a carrier upper side. At least four semiconductor chips are configured to emit light of different colors from each other. The semiconductor chips are mounted close to each other on the connection surfaces so that a distance between adjacent semiconductor chips is at most 100 ?m in a top view on the carrier upper side.

Abstract: A semiconductor device with at least one radiation emitting optical semiconductor chip, an integrated circuit, and exactly two connecting contacts. The semiconductor device has a variable radiation characteristic which is controlled as a function of a voltage signal both for data transmission and for supplying the semiconductor device which can be applied to the connecting contacts and varied over time.

Abstract: A method of producing an optoelectronic component includes providing an opto-electronic semiconductor chip including a layer sequence arranged on a substrate, wherein the layer sequence includes a contact side including two electrical contact locations, the contact side facing away from the substrate; arranging the optoelectronic semiconductor chip on an auxiliary carrier such that the contact side faces away from the auxiliary carrier; arranging a molding material above the auxiliary carrier such that a housing is formed that at least partly encloses the optoelectronic semiconductor chip, wherein the contact side is covered by the molding material; and detaching the housing from the auxiliary carrier.

Abstract: An LED arrangement includes two current connection regions arranged on a substrate, a plurality of LED groups including LEDs, each having first and second LED contact regions. The LED arrangement includes a plurality of electrically conductive coating regions spatially separated from one another on the substrate and each subdivided into contact and transition regions, wherein the second current connection region constitutes one of the transition regions, each LED group is arranged on exactly one assigned coating region, one of the current connection regions electrically conductively connects to a second LED contact region of one of the LEDs arranged at the edge region, and, apart from the other current connection region, a relevant transition region electrically conductively connects to a second LED contact region of one of the LEDs of an adjacent LED group arranged at the edge region such that the plurality of LED groups are connected in series.

Abstract: An optoelectronic semiconductor chip may include a semiconductor layer sequence provided for generating and/or receiving radiation. The chip may further include a first trench structure and a second trench structure formed in the semiconductor layer sequence. A first contact finger structure may electrically conductively connect the second trench structure to a first semiconductor layer of the semiconductor layer sequence. The first contact finger structure may adjoin a first side surface and/or a second side surface of the second trench structure at least in places. A second contact finger structure may electrically conductively connect to a second semiconductor layer of the semiconductor layer sequence where the second contact finger may be arranged in the first trench structure.

Abstract: A method for manufacturing light emitting diodes and a light emitting diode are disclosed. In an embodiment a method includes growing an n-conductive n-layer, growing an active zone for generating ultraviolet radiation, growing a p-conductive p-layer, producing a p-type semiconductor contact layer having a varying thickness and having a plurality of thickness maxima directly on the p-type layer and applying an ohmic-conductive electrode layer directly on the semiconductor contact layer, wherein each the n-layer and the active zone is based on AlGaN, the p-layer is based on AlGaN or InGaN and the semiconductor contact layer is a GaN layer, wherein the thickness maxima have an area concentration of at least 104 cm?2 in a top view, and wherein the p-layer is only partially covered by the semiconductor contact layer in the top view.

Abstract: An apparatus for presenting an image for a heads-up display includes three arrays of light-emitting diodes, wherein the light-emitting diodes of an array are arranged and output electromagnetic beams in an emission direction of an emission side of the array, the light-emitting diodes output an electromagnetic beam with a first opening angle in the emission direction, a collimation apparatus provided on the emission side at a specified spacing in front of the array of the light-emitting diodes, wherein the collimation apparatus reduces the first opening angles of the beams of the light-emitting diodes downstream of the collimation apparatus in the emission direction to a second opening angle, the second opening angle is smaller than the first opening angle, and a combination optical unit arranged downstream of the collimation apparatus in the emission direction, the combination optical unit superposes the electromagnetic rays from the three arrays to form an image for the head-up display.

Abstract: In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side faces arranged obliquely or perpendicular to the radiation exit surface. The device further includes a contact track electrically connecting the semiconductor chip to a contact surface configured to externally contact the semiconductor device, a molding and a rear side of the semiconductor chip remote from the radiation exit surface, the rear side being free of a material of the molding, wherein one of the side faces is configured as a mounting side face for fastening of the semiconductor device, and wherein the contact track partially runs on one of the side faces.