Abstract: A lighting device comprising a phosphor arrangement (2) having a phosphor region (31-33), a first laser (5) for irradiating a part of the phosphor region (31-33) with a first laser radiation. The phosphor region (31-33) has at least one phosphor which can be irradiated by the first laser radiation and re-emits the first laser radiation at least partly in a manner wavelength-converted into colored light having a first light color. A second laser (6) is configured for emitting a second laser radiation having a second light color. The second light color of the second laser radiation is identical in color to the first light color of the wavelength-converted colored light. The lighting device is configured to simultaneously emit the second laser radiation and the wavelength-converted colored light of identical color emitted by the phosphor.

Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.

Abstract: An optoelectronic component includes a housing having a first cavity open toward an upper side of the housing, and a second cavity open toward the upper side of the housing, wherein the first cavity and the second cavity connect by a connecting channel, an optoelectronic semiconductor chip is arranged in the first cavity, a potting material is arranged in a region of the first cavity enclosing the optoelectronic semiconductor chip, a bond wire is arranged between an electrical contact surface of the optoelectronic semiconductor chip and a bond surface of the housing, and the bond surface is arranged in the connecting channel.

Abstract: A light module includes an excitation radiation source designed to emit an excitation radiation having a polarization, at least one first phosphor, an output, at which an output signal is providable, at least one first polarization beam splitter, a first polarization modulator arranged serially between the radiation source and the first splitter. The first modulator is designed to modify the polarization of the radiation source depending on a control signal. The first splitter is designed to split the radiation incident on it depending on the polarization between a first and a second of two optical partial paths connected in parallel with one another. The first optical partial path includes the at least one first phosphor and ends at the output of the light module. The second optical partial path, whilst bypassing the at least one first phosphor, ends at the output of the light module.

Abstract: An active damping circuit and system including the same are disclosed. The active damping circuit includes a first resistor, a second resistor, a third resistor, a first transistor, a second transistor, a capacitor, and a microcontroller. The first resistor is connected to a base of the first transistor, and to the microcontroller output. The second resistor is connected to a positive voltage, and to a collector of the first transistor and a gate of the second transistor. The third resistor is connected to a logic ground, and to a source of the second transistor. The capacitor is connected to the collector of the first transistor, the second resistor, and the gate of the second transistor. A drain of the second transistor, and the first capacitor, and the second capacitor, and the microcontroller output, are also connected to the logic ground. An emitter of the first transistor is connected to ground.

Abstract: An optoelectronic component includes a carrier strip and an optoelectronic semiconductor chip, a first electrical connection surface formed on a front side of the chip and a second electrical connection surface is formed on a rear side of the chip, first and second electrically conductive contact regions are formed on the strip, the first region is arranged on a folding section of the strip, the rear side of the chip faces toward an upper side of the strip, the upper side faces toward the front side of the chip, the first electrical connection surface electrically conductively connects to the first region, the second electrical connection surface electrically conductively connects to the second region by a second connecting material, the strip has a second through-opening that lies next to the second region, and the second connecting material extends through the second contact opening to a lower side of the strip.

Abstract: A dual mode constant output current LED driver is capable of operating with a very wide range of input direct current (DC) voltage. This provides an effective topology for a wide range of constant output current LED drivers, and allows for changing the number of connected LEDs without negatively impacting the output current. The LED driver includes a converter and a mode selection circuit that control the modes of the circuit based on the voltage. The converter and mode selection circuit operate in a buck-boost mode when the output voltage of the LED driver is less than the DC input voltage plus a first threshold amount, and in a boost mode when the output voltage of the LED driver is greater than the DC input voltage plus a second threshold amount.

Abstract: A coding method for data compression of a power spectra of an optoelectronic component and a decoding method are disclosed. In an embodiment, a coding method includes providing a power spectrum, sampling the power spectrum at particular sampling wavelengths in order to provide a discrete source spectrum, indexing the discrete source spectrum in order to provide a source graph having discrete source values, producing an image graph having discrete image values by transforming the source graph from a source range into an image range with a discrete frequency transform, performing compression of the image graph, and digitizing the compressed image graph in order to produce compressed spectral data.

Abstract: A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact b

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.

Abstract: The lighting system includes a voltage source for generating a constant direct current adapted to supply lighting modules, a number n of electronic switches, a current sensor connected in series with the voltage source to detect a measurement signal indicative of the current provided by the voltage source, and a control unit. The control unit generates the drive signals for the electronic switches. It varies the drive signals, such that: in a first instant, all lighting modules are connected to the voltage source; and during a sequence of instants, each time a different set of lighting modules is connected to the voltage source. It then determines the current flowing through all lighting modules as a function of the measurement signal detected in the first instant, and determines the currents which flow through the various lighting modules as a function of the measurement signals detected during the sequence of instants.

Abstract: A component with a semiconductor body, and first and second metal layer is disclosed. The first metal layer is arranged between the semiconductor body and the second metal layer, the semiconductor body has a first semiconductor layer on a side which is averted from the first metal layer, a second semiconductor layer on a side facing towards the first metal layer, and an active layer arranged between the first semiconductor layer and the second semiconductor layer, the component has a through-connection, which extends through the second semiconductor layer and the active layer for the electrical bonding of the first semiconductor layer. The second metal layer has a first subregion electrically connected to the through-connection by the first metal layer, and a second subregion spaced apart laterally from the first subregion by an intermediate space. In an overhead view, the first metal layer laterally completely covers the intermediate space.

Abstract: The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape. The invention also concerns a method of separating a composite into a plurality of semiconductor chips (100) along a separation pattern (15) with the steps enabling a plurality of semiconductor chips according to the invention to be produced.

Abstract: An optoelectronic component includes a housing including a base section and a cover section that delimit an interior of the housing, wherein an optoelectronic semiconductor chip is arranged on the base section, the cover section is formed by an optical element, and a reflective element including openings is arranged between the optoelectronic semiconductor chip and an outer side of the optical element.

Abstract: An optoelectronic arrangement includes an optoelectronic semiconductor chip, a wavelength-converting element and a detector component, wherein the optoelectronic arrangement is configured to emit light with a first peak wavelength and to emit light with a second peak wavelength, the first peak wavelength is in the visible spectral range and the second peak wavelength is in the non-visible spectral range or the first peak wavelength is in the non-visible spectral range and the second peak wavelength is in the visible spectral range, and the optoelectronic arrangement emits the light whose peak wavelength is in the non-visible spectral range into a target area, and the detector component is configured to detect light backscattered from the target area and the peak wavelength of which is in the non-visible spectral range.

Abstract: A lighting device includes an elongated profiled body with a web wall having first and second opposing faces, and two side walls to the side of the web wall, the latter having longitudinal slots extending therealong. In the profiled body, there may be provided an elongated light radiation source module including a support board with electrically conductive formations facing said longitudinal slots and at least one electrically-powered light radiation source which is in electrical contact with said electrically conductive formations. The light radiation source module is locatable in elongated profiled body extending between both side walls, with support board facing towards the first face of web wall. An electrical contact slider member slidable along the second face of web wall is provided with electrical contact pins adapted to extend into said longitudinal slots. Slider member is displaceable towards support board with pins contacting said electrically conductive formations of support board.

Abstract: A housing of an electronic module may include: a mounting surface located at one side of the housing, wherein the mounting surface includes at least three sub-mounting surfaces, lines connecting the centers of respective sub-mounting surfaces form a polygon, and a mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon.

Abstract: A method for producing an optoelectronic semiconductor chip is disclosed. A semiconductor body has a pixel area, which has at least two different subpixel areas. An electrically conductive layer is applied to the radiation outlet surface of at least one subpixel area. The electrically conductive layer is designed to at least partially salify with a protic reaction partner. A conversion layer is deposited onto the electrically conductive layer by means of a electrophoresis process.

Abstract: Lamp module cooling system 10 contains vehicle solid-state light source 12 coupled to an extruded first heat sink 2 and an extruded second heat sink 20 in thermal communication with one another and with fluid flow directed from fan air outlet 42 of fan 40 over respective heat dissipation first and second ribs 8, 28 to direct warmed air through existing apertures 115 in headlamp bezel 110 aligned with headlamp optics 130 to defog or de-ice headlamp cover 100. Housing cover 30 and cover 32 define air flow path 50, 52, 54 improving warm air guidance and efficient spatial packaging of lightweight lamp module cooling system 10.