Abstract: A lighting assembly includes: a heat sink having a mounting surface for a light source; a light source board having said light source thereon, said light source board being arranged against said mounting surface and having an outer perimeter edge, and a drive board carrying drive circuitry for said light source, said drive board being fixed onto said heat sink with said light source board sandwiched therebetween, said drive board having an aperture with an inner edge complementary to said outer edge of said light source board, whereby said light source is left uncovered by said drive board, and wherein: said inner edge of said drive board has an inwardly protruding frame formation with said outer perimeter edge of said light source board abutting against said frame formation, and said light source board has a thickness whereby said drive board and said mounting surface have a clearance therebetween.

Abstract: A method can be used for producing an optoelectronic device. A first leadframe section with a component is provided. The component is designed to emit electromagnetic radiation on an emission side. The emission side faces away from the carrier. A second leadframe section is provided. In a first method step the component and the two leadframe sections are encapsulated with a first potting material in such a way that the component and the leadframe sections are embedded into a potting body, but wherein at least part of the emission area of the component remains free of the first potting material and a cutout is formed in the potting body at least above the emission area of the component. In a second method step a second potting material is molded into the cutout of the potting body, such that the emission side of the component is covered with the second potting material.

Abstract: In one embodiment the organic light-emitting diode includes a substrate having a substrate upper side, an electrically conductive grid structure for a current distribution and an electrically conductive particle layer, which are located at the substrate upper side. The grid structure may be embedded in the particle layer. An organic layer sequence for generating the radiation is located directly on the particle layer. A covering electrode is attached to the organic layer sequence. The particle layer comprises scattering particles having a first average diameter and electrically conductive particles having a smaller second average diameter. The scattering particles are densely packed together with the conductive particles. The particle layer forms, together with the grid structure, a substrate electrode for the organic layer sequence.

Abstract: A system for providing spatially and temporally smooth occupancy lighting includes a sensor and a controller. The sensor is configured to determine a precise location of the occupant. The controller determines a number of lighting fixtures that are relevant to the location of the occupant. The light output of the lighting fixtures is controlled by the controller using a function that varies the light output depending on the location of the occupant. The function can change the light output based upon a distance between the occupant and the one or more lighting fixtures. For example, the function can increase the light output as the occupant moves closer to a fixture, and likewise decrease the light output as the occupant moves away from a fixture. In another example, the function can maintain a target illuminance at a particular spot within the space or an overall illuminance for all lighting fixtures.

Abstract: An organic light-emitting component includes an organic light-emitting diode which has at least one organic layer arranged to generate light and a printed circuit board with electrical conductor tracks. The printed circuit board is an integral component of the organic light-emitting diode. At least one of the electrical conductor tracks of the printed circuit board is connected in electrically conductive manner to the organic layer of the organic light-emitting diode. The printed circuit board is electrically contactable from the side remote from the organic light-emitting diode.

Abstract: Techniques are disclosed for enhancing indoor navigation using light-based communication (LCom). In some embodiments, an LCom-enabled luminaire configured as described herein may include or have access to a sensor configured to detect a hazardous condition. In response to detection of a hazard, the LCom-enabled luminaire may adjust its light output, transmit an LCom signal, or both, in accordance with some embodiments. A given LCom signal may include data that may be utilized by a recipient computing device, for example, in providing emergency evacuation routing or other indoor navigation with hazard avoidance, emergency assistance, or both. In a network of such luminaires, data distribution via inter-luminaire communication may be provided, in accordance with some embodiments, via an optical interface or other wired or wireless communication means. In some cases, the network may include a luminaire that is not LCom-enabled yet still configured for inter-luminaire communication.

Abstract: An illumination apparatus for a motor vehicle is provided. The illumination device may include at least one semiconductor light source arrangement, and means for regulating or controlling the supply current for the at least one semiconductor light source arrangement, the means having at least one resistance element with a temperature-dependent resistance value.

Abstract: An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed between the luminous surface and a spacer surface of the spacer facing away from the luminous surface, and wherein the light source is potted by a potting compound such that the spacer surface is formed extending flush with a potting compound surface facing away from the surface of the carrier and a surface formed by a spacer surface and the potting compound surface is plane.

Abstract: A light-emitting arrangement includes a radiation-emitting semiconductor chip that, during operation, emits primary radiation at least from a main emission surface, a first conversion element that absorbs part of the primary radiation and emits secondary radiation, and a deflection element that causes a direction change for part of the primary radiation, wherein the first conversion element is arranged in a lateral direction next to the radiation-emitting semiconductor chip, the deflection element guides part of the primary radiation onto the first conversion element, and the light-emitting arrangement, in operation, emits mixed light including the primary radiation and the secondary radiation.

Abstract: A luminaire having an electronically adjustable light beam distribution is disclosed. In some embodiments, the disclosed luminaire includes a plurality of solid-state lamps mounted on one or more surfaces of a housing. The lamps can be electronically controlled individually and/or in conjunction with one another, for example, to provide highly adjustable light emissions from the luminaire (e.g., pixelated control over light distribution). In some cases, a given solid-state lamp may include tunable electro-optic componentry to provide it with its own electronically adjustable light beam. One or more heat sinks optionally may be mounted on the housing to assist with heat dissipation for the solid-state lamps. The luminaire can be configured to be mounted or as a free-standing lighting device, in accordance with some embodiments. In some embodiments, the aperture through which the lamps provide illumination is smaller than the distribution area of the solid-state lamps of the luminaire.

Abstract: The invention relates to a lighting means (1), comprising: an optical element (3), which has a main extension direction (Z), a radiation inlet surface (3a), and a radiation outlet surface (3b); and at least two light-emitting diodes (2), which each comprise at least one light-emitting diode chip (21) and a radiation passage surface (2a), which extends along a main extension plane (XZ); wherein the at least two lighting-emitting diodes (2) are arranged along the main extension direction (Z) of the optical element (3), the radiation inlet surface (3a) of the optical element (3) faces the radiation passage surfaces (2a) of the at least two light-emitting diodes (2), the optical element (3) is formed as a solid body, the radiation inlet surface (3a) of the optical element (3) is flat or convexly curved, and the radiation outlet surface (3b) of the optical element (3) comprises at least one recess (4) in the optical element (3).

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip with a first surface and a second surface. The component also includes a protective chip which has a protective diode, a first surface and a second surface. The semiconductor chip and the protective chip are embedded in a molded body. A first electrical contact and a second electrical contact are arranged on the first surface of the semiconductor chip. A third electrical contact and a fourth electrical contact are arranged on the first surface of the protective chip. The first electrical contact is electrically connected to the third electrical contact. In addition, the second electrical contact is electrically connected to the fourth electrical contact.

Abstract: In various exemplary embodiments, a method for producing an optoelectronic component is provided. In this case, a high temperature solid is provided which is stable at least up to a predefined first temperature. A liquid glass solder having a second temperature, which is lower than the first temperature, is applied to the high temperature solid in a structured fashion. The glass solder is solidified, as a result of which a glass solid is formed. An optoelectronic layer structure is formed above the glass solid. The glass solid and the optoelectronic layer structure form the optoelectronic component. The optoelectronic component is removed from the high temperature solid.

Abstract: An optoelectronic component and a method to operate the optoelectronic component are disclosed. In an embodiment the optoelectronic component includes an organic light-emitting diode configured to emit radiation through a main emission surface and a liquid crystal element configured to adjust a color location of the radiation, wherein the liquid crystal element is switchable into a first state and into a second state, wherein the liquid crystal element in the first state is suitable for selectively reflecting light of a first wavelength range and in the second state is transparent, and wherein the liquid crystal element is arranged on a rear side of the organic light-emitting diode facing the main emission surface so that light of the first wavelength range that is emitted towards the rear side is at least partially reflected in a direction of the main emission surface in the first state of the liquid crystal element.

Abstract: The invention relates to a lighting device (11; 31; 41; 51) which is equipped with a plurality of semiconductor light sources (14, 15) of different colors, downstream of which a common diffusor (17) is arranged, wherein the lighting device (11; 31; 41; 51) has at least one light sensor (21) optically coupled to the diffusor (17).

Abstract: A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.

Abstract: A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.

Abstract: A lighting device may include a semiconductor light source arrangement, a heat sink for cooling the semiconductor light source arrangement, electrical connections for supplying power to the semiconductor light source arrangement, and a holding means. The holding means is in the form of a plastic part, at least the electrical connections and the heat sink each being embedded in the plastic material of said plastic part at least in sections.

Abstract: A method for producing a thin-film semiconductor body is provided. A growth substrate is provided. A semiconductor layer with funnel-shaped and/or inverted pyramid-shaped recesses is epitaxially grown onto the growth substrate. The recesses are filled with a semiconductor material in such a way that pyramid-shaped outcoupling structures arise. A semiconductor layer sequence with an active layer is applied on the outcoupled structures. The active layer is suitable for generating electromagnetic radiation. A carrier is applied onto the semiconductor layer sequence. At least the semiconductor layer with the funnel-shaped and/or inverted pyramid-shaped recesses is detached, such that the pyramid-shaped outcoupling structures are configured as projections on a radiation exit face of the thin-film semiconductor.

Abstract: The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.