Abstract: The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.

Abstract: A clocked electronic energy converter may include an electronic switching element, at least two electrical energy storage devices, connections for connecting an electrical energy source and for connecting an electrical energy sink, a clock generator for controlling the electronic switching element and a switch-on time unit for generating a first signal for the clock generator, which switch-on time unit sets the power of the energy converter to be transmitted in a first power range by the first signal. The switch-on time unit generates a first signal representing a switch-on time for the clock generator in a second power range in which the power lower can be set than in the first power range, and the clocked electronic energy converter has a switch-off time unit generating in the second power range a second signal for the clock generator, which signal represents a switch-off time depending upon the power to be transmitted.

Abstract: An optoelectronic semiconductor component and a method for manufacturing an optoelectronic semiconductor component are disclosed. In an embodiment, the component includes a plurality of active regions configured to generate a primary radiation and a plurality of luminescent material particles configured to convert the primary radiation into a secondary radiation, wherein the active regions are arranged spaced apart from each other, wherein each active region has a main extension direction, wherein each active region has a core region comprising a first semiconductor material, wherein each active region has an active layer covering the core region, wherein each active region has a cover layer comprising a second semiconductor material and covering the active layer, wherein at least some of the luminescent material particles are arranged between the active regions, and wherein a diameter of a majority of the luminescent material particles is smaller than a distance between two adjacent active regions.

Abstract: A method for producing a lighting device is provided. According to the method, a plurality of semiconductor emitters arranged alongside one another are embedded in a light-transmissive filling compound apart from a side having their electrical connections, trenches are introduced into the light-transmissive filling compound at the side having the electrical connections between at least two semiconductor emitters, the side of the light-transmissive filling compound having the electrical connections, including the electrical connections, is covered with a dielectric material, electrical lines are led through the dielectric material to the electrical connections, and at least some of the trenches are severed.

Abstract: A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.

Abstract: A phosphorescent metal complex is provided, which comprises a metallic central atom M and at least one ligand coordinated by the metallic central atom M, wherein the one metallic central atom M and the ligand form a six-membered metallacyclic ring. Additionally specified are a radiation-emitting component comprising a metal complex, and a process for preparing the metal complex.

Abstract: An optoelectronic semiconductor component and an adaptive headlight are disclosed. In an embodiment an optoelectronic semiconductor component includes a carrier having a carrier top side and a carrier underside, a plurality of active zones, which are fitted at the carrier top side and which are designed for emitting radiation, electrical contact locations at the carrier underside, which are designed for electrically connecting the semiconductor component and a drive unit for electrically addressing the semiconductor component and for electrically driving the active zones, wherein the active zones are fitted in a regular grid at the carrier top side, wherein the grid has a grid pitch, wherein geometrical midpoints of radiation main sides of the active zones lie on grid points of the grid, and wherein a distance between the geometrical midpoints of marginal active zones and a closest edge of the carrier is at most 50% of the grid pitch.

Abstract: Described is a holographic film (100) whose transmission and/or reflection properties vary periodically along at least one of its directions of principal extent, said film being designed for at least partial transmission (22, 28) of light (20, 26) of at least one first wavelength range that is irradiated from a multiplicity of periodically disposed illuminants (200) and that impinges on the holographic film (100). Also described are a lighting means (300), a backlighting means and a method for producing a holographic film (100).

Abstract: Lighting devices, and methods of manufacturing the same, are provided. A lighting device includes a cover through which emitted light passes and a formed flexible light engine. The formed flexible light engine is placed within a housing, or serves as the housing itself. An interface couples to cover to the housing or the formed flexible light engine. The formed flexible light engine includes a flexible substrate and a plurality of solid state light sources located thereon. The plurality of solid state light sources are configured to emit light through the cover. The formed light engine has a defined shape created during the forming process. This enables placement on the housing within the lighting device, or contributes to the overall shape of the lighting device.

Abstract: An electronic converter may include transformer with a primary winding and a secondary winding, wherein the primary winding is coupled to an input for receiving a power signal, and wherein the secondary winding is coupled to an output including a positive terminal and a negative terminal for providing a power signal. The converter moreover may include an electronic switch arranged between the input and the primary winding, wherein the electronic switch is configured to control the current flow through the primary winding. Specifically, the converter may include a snubber circuit arranged between the secondary winding and the output.

Abstract: Various embodiments may relate to a method for operating an illuminating device with a pump radiation source for emitting pump radiation, and a phosphor wheel, on which a first phosphor for emitting first conversion light and a second phosphor for emitting second conversion light are provided, in which method the phosphor wheel rotates about a rotation axis and in the process is irradiated with the pump radiation in an irradiation region eccentrically with respect to the rotation axis in such a way that a circular track is irradiated owing to the rotation of the phosphor wheel, wherein during a 360° revolution of the phosphor wheel the first phosphor is irradiated with a first pump radiation power and the second phosphor is irradiated with a second pump radiation power, which is different than the first pump radiation power.

Abstract: A lighting device may include a substrate having a carrier, a first electrical busbar, a second electrical busbar, and an optically functional structure on or above the carrier, wherein the optically functional structure is formed laterally between the first and the second electrical busbar, and a first electrode electrically coupled to the first electrical busbar and/or the second electrical busbar, on or above the carrier, and an organic functional layer structure on or above the first electrode, wherein the organic functional layer structure is formed for converting an electric current into an electromagnetic radiation, and a second electrode on or above the organic functional layer structure. The optically functional structure is formed in such a way that the beam path of the electromagnetic radiation which passes through the substrate and/or the spectrum of the electromagnetic radiation passing through the substrate are/is variable by means of the optically functional structure.

Abstract: In various embodiments, a lighting device is provided. The lighting device includes a phosphor volume for at least partial wavelength conversion of primary light into secondary light, a primary light semiconductor light source for irradiating the phosphor volume with primary light, a measurement light generating arrangement for generating measurement light having a spectral composition outside the primary light and the secondary light, a measurement light detector sensitive to the measurement light, and a measurement light filter, which is fixedly connected to the phosphor volume and is optically arranged between the measurement light generating arrangement and the measurement light detector.

Abstract: An optoelectronic assembly may include a substrate, which has a first contact region at a first side thereof, an optoelectronic component arranged on the first side of the substrate, which has a first contact coupled to the first contact region, a printed circuit board with conductor tracks, which is coupled to the first side of the substrate at a first side of the printed circuit board and which has a central cutout, in which the optoelectronic component is exposed, and which has a first contact cutout, which overlaps the first contact region, at least one electronic component arranged on a second side of the printed circuit board, which is coupled to the conductor tracks, and a connection element, which is arranged in the first contact cutout and electrically couples the first contact region to the conductor tracks, wherein the connection element fixes the substrate to the printed circuit board.

Abstract: A method of producing an optoelectronic device includes A) providing a substrate, B) applying a first electrode to the substrate, C) applying a first organic layer stack to the first electrode, D) producing a charge-generating layer stack on the first organic layer stack, E) applying a second organic layer stack to the charge-generating layer stack, and F) applying a second electrode to the second organic layer stack, wherein step D) includes D1) applying a solution of a first metal oxide precursor to the first organic layer stack, D2) generating a first charge-generating layer comprising a first metal oxide, D3) applying a solution of a second metal oxide precursor to the first charge-generating layer, and D4) generating a second charge-generating layer comprising a second metal oxide.

Abstract: A wireless mounted control module includes an antenna portion, which encloses at least in part an antenna, and a holder portion. The holder portion allows the movement of the antenna portion from an installed position, where the top of the antenna portion is flush and/or substantially flush with the exterior surface of a device or location in which the module is installed, to an extended position, where an upper section of the antenna portion (including the top of the antenna portion) extends beyond the exterior surface.

Abstract: A method for mirror-coating lateral surfaces of optical components, a mirror-coated optical component and an optoelectronic semiconductor body mountable on surface are disclosed. In an embodiment, an optoelectronic semiconductor body includes a semiconductor chip having a radiation side and a contact side different from the radiation side, wherein contact elements for electrically contacting the semiconductor body are attached to the contact side, and wherein the contact elements are freely accessible. The body further includes a metal mirror layer disposed on the semiconductor chip, wherein the metal mirror layer has a reflectivity of at least 80% to radiation emitted by the semiconductor chip during operation, wherein the mirror layer is a continuous and contiguous mirror layer, which covers all sides of the semiconductor chip that are not the contact side and the radiation side by at least 95%, and wherein the mirror layer is arranged at the semiconductor chip in a form-fit manner.

Abstract: A conversion element for the wavelength conversion of electromagnetic radiation from a first wavelength range to electromagnetic radiation from a second wavelength range, which includes longer wavelengths than the first wavelength range, the conversion element includes: a matrix material, the optical refractive index of which is temperature-dependent, and at least two different types of luminophore particles wherein a multiplicity of luminophore particles of each of the types are distributed in the matrix material, luminophore particles of different types differ from one another in terms of average particle size and/or material, the conversion element, upon excitation by electromagnetic radiation from the first wavelength range emits mixed radiation including electromagnetic radiation from the first and the second wavelength range, and the correlated color temperature and/or the color locus of the mixed radiation remain(s) substantially the same when the matrix material is at a temperature of between 25° C.

Abstract: A method of operating an optoelectronic proximity sensor including a radiation-emitting component, a radiation-detecting component and a control unit includes: operating the radiation-emitting component with a pulsed current, wherein the pulsed current of the radiation-emitting component has an on time and an off time during a measurement period, and causing the control unit to evaluate a detector signal of the radiation-detecting component during the on time and ending the on time if the detector signal exceeds a threshold value, wherein the ratio of the on time to the measurement period is less than 1/10.