Abstract: Techniques are disclosed for providing spatially-defined and/or distance-defined light-based communications within a vehicle/roadway environment. In some embodiments, the techniques can be used to vary the data content of a given transmitted light-based communications signal based on factors such as position, distance, and/or proximity of the transmitting source and the receiver. In some embodiments, the techniques can be used to vary the processing or other handling of a received light-based communications signal based on one or more of such factors. In some instances, the disclosed techniques can be utilized to tailor light-based vehicle-to-X (V2X) communications for dissemination between and among vehicles and infrastructure in a vehicle/roadway environment. To that end, a node may host a transmitter (e.g., laser, LED, or other solid-state light source) configured to emit such light-based communication signals and/or a receiver (e.g.

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip embodied as a volume emitter, wherein the optoelectronic semiconductor chip is embedded into an optically transparent molded body, a soldering contact is arranged at an underside of the molded body, a bonding wire forms an electrically conductive connection between an electrical contact area of the optoelectronic semiconductor chip and the soldering contact, and the bonding wire is embedded into the molded body.

Abstract: According to at least one embodiment, an organic light-emitting component includes a substrate, a first electrode arranged on the substrate, and a second electrode. An organic light-generating layer stack is arranged between the first and second electrodes and includes a first organic OLED functional material. A first organic coupling-out layer is in optical contact with the organic light-generating layer stack and includes an organic material containing a second organic OLED functional material. One of the first and second electrodes is translucent, and the first organic coupling-out layer is arranged on that side of the electrode that faces away from the organic light-generating layer stack.

Abstract: A tracking system provides light source(s), a mobile communication unit and light sensor(s) with cameras, and a central control unit at least coupled to the sensor(s). The communication unit receives with its camera an identification information item broadcast by the light source(s) and broadcasts an activation signal, including data correlated with the received item, to the control unit. The control unit determines, based on the signal, at which position the communication unit is arranged and which sensor(s) is arranged relative to the position of the communication unit so that the communication unit can be detected by the camera of the sensor; activates the camera of the detected sensor(s) for providing image information by its camera to the control unit, to determine and identify a carrier of the communication unit at the determined position; and activates sensor(s) coupled to the control unit for tracking the identified carrier of the communication unit.

Abstract: The invention relates to an optoelectronic component array (100) with a plurality of adjacent optoelectronic semiconductor components (60) and a covering body (81). According to the invention—each of the optoelectronic semiconductor components (60) has a ceramic support element (19) and a semiconductor chip (50) which is arranged on an upper face of the ceramic support element and which comprises a semiconductor element (54) designed to generate and/or receive radiation—the covering body (81) surrounds each of the ceramic support elements (19) of the optoelectronic semiconductor components in some regions at least in a lateral direction and connects adjacent ceramic support elements (19) together, and—the lower face of each of the ceramic support elements (19) is electrically insulated from the semiconductor chip (50).

Abstract: A bi- or polynuclear metal complex of a metal of groups Vb/VIb/VIIb (IUPAC groups 5-7), has a ligand of the structure (a), wherein R1 and R2, independently of each other, can be oxygen, sulfur, selenium, NH, or NR4, wherein R4 is selected from alkyls and aryls and can be bonded to R3; and R3 is selected from alkyls, long-chain alkyls, alkoxys, long-chain alkoxys, cycloalkyls, haloalkyls, aryls, arylenes, haloaryls, heteroaryls, heteroarylenes, heterocycloalkylenes, heterocycloalkyls, haloheteroaryls, alkenyls, haloalkenyls, alkynyls, haloalkynyls, ketoaryls, haloketoaryls, ketoheteroaryls, ketoalkyls, haloketoalkyls, ketoalkenyls, haloketoalkenyls, where one or more non-adjacent CH2 groups can be replaced, independently, with (1) —O—, —S—, —NH—, —NR?—, —SiR?R??—, —CO—, —COO—, —OCO—, —OCO—O—, —SO2-, —S—CO—, —CO—S—, —CY1=CY2, or —C?O— in such a way that O and/or S atoms are not bonded directly to each other, or (2) aryls or heteroaryls containing 1 to 30 C atoms, as a p-type doping agent for matrix materials of

Abstract: Methods and systems are described for sampling an LCOM message and accurately reconstructing the entire LCOM message using a light receiver (e.g., digital camera) of a typical mobile computing device, such as a smartphone, tablet, or other mobile computing device. These including receiving segments of an LCOM signal from at least two repetitions of the LCOM signal. The location of each segment within the LCOM signal is identified and each segment is stored in a corresponding location in a buffer configured to have a length equal to the LCOM signal. The buffer is a ring buffer, in some embodiments.

Abstract: Techniques and corresponding circuitry are disclosed for providing active current sharing in lighting applications. In some embodiments, an active current sharing circuit is provided that includes a series-pass sub-circuit, such as a transistor or transistor circuit (or other active series-pass circuit), for each LED string. In addition, each string has a current sense sub-circuit for sensing current of that string. A monitor and control sub-circuit operates in conjunction with the series-pass sub-circuit to maintain the sensed current equal to a common reference level. In some embodiments, the common reference level is controlled to maintain the lowest series-pass element voltage close to or equal to zero volts (?0.25 VDC to +0.25 VDC).

Abstract: An optoelectronic semiconductor component has at least one semiconductor chip for emitting electromagnetic radiation. The semiconductor chip has at least one side surface and wherein a part of the electromagnetic radiation exits through the side surface during operation of the semiconductor chip. The semiconductor component additionally has at least one deflecting element that is formed to be transmissive to radiation. The deflecting element and the semiconductor chip are arranged one alongside another. The deflecting element is arranged at the side surface of the semiconductor chip. The deflecting element has a material, the index of refraction of which is greater than an average index of refraction of a semiconductor material of the semiconductor chip.

Abstract: Optical components for lighting devices and lighting devices including such components are described. In some embodiments the optical components are in the form of a lens that alter the distribution of light produced by a lighting fixture. In some embodiments, the lenses are in the form of a downlight to wallwash lens which, when placed in a downlight fixture, convert the light distribution to that of a wallwash fixture, e.g., causing the downlight to produce an off-axis light distribution, without changing the fixture. The lens includes a body with a light source facing side and an opposite room facing side having two optically active regions, each including structures that redirect a portion of light received through the light source facing side and incident thereon. The first region includes structures that redirect, via refraction, and the second region includes structures that redirect, in part via total internal reflection.

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.

Abstract: Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.

Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a metal substrate having a surface, an electrically conductive planarization layer on the surface of the metal substrate, wherein the planarization layer comprises a surface, an organically functional layer structure on or above the surface of the planarization layer, and an electrode layer formed in a transparent fashion on or above the organically functional layer structure. The roughness of the surface of the planarization layer is lower than the roughness of the surface of the metal substrate. The surface of at least one of the metal substrate or the planarization layer is formed in a light-scattering fashion.

Abstract: Systems and methods for controlling, filtering, and monitoring mobile device access to the internet are disclosed. According to an embodiment a server is responsible for controlling, filtering and monitoring internet activity. For every request, the server interacts with back-end databases that categorize requests, and based on user/carrier/corporate settings, allow or disallow access to particular content.

Abstract: A lighting device including one or more solid state light sources having an electronically adjustable light beam distribution is disclosed. The lighting device may be a lamp configured to include one or more light source modules, each including one or more solid-state emitters populated over a printed circuit board (PCB). The lamp further may include one or more optics configured to modify the output of its one or more light source modules. For a given module, the one or more emitters thereof may be arranged, for example, in a matrix, cellular array, concentric array, or other arrangement, as desired for a given target application or end-use. A given emitter may be addressable individually, in one or more groupings, or both. In some cases, a lamp provided as described herein may be configured for retrofitting existing lighting structures.

Abstract: A display device includes at least one semiconductor body, which has a semiconductor layer sequence, which has an active region provided for producing radiation and forms a plurality of pixels. The device also includes a driver circuit that has a plurality of switches, which are each provided for controlling at least one pixel. A first metallization layer and/or the second metallization layer are electroconductively connected to at least one of the pixels. The first metallization layer and the second metallization layer are arranged overlapping one another in such a manner that, in a plan view onto the display device, the driver circuit is covered with at least one of the metallization layers at every point which overlaps with one of the pixels or is arranged between two adjacent pixels.

Abstract: A method for supplying a process with an enriched carrier gas. A first apparatus and a second apparatus are provided. The first apparatus has a precursor and is configured to bring a carrier gas into contact with the precursor and to enrich the carrier gas with the precursor. The second apparatus has a precursor and is configured to bring a carrier gas into contact with the precursor and to enrich the carrier gas with the precursor. The first apparatus supplies the second apparatus with an enriched carrier gas. The second apparatus supplies the enriched carrier gas for the process. A temperature of the first apparatus is controlled as a function of a quantity of precursor in the second apparatus.

Abstract: An electrical contact structure (10) for a semiconductor component (100) is specified, comprising a transparent electrically conductive contact layer (1), on which a first metallic contact layer (2) is applied, a second metallic contact layer (3), which completely covers the first metallic contact layer (2), and a separating layer (4), which is arranged between the transparent electrically conductive contact layer (1) and the second metallic contact layer (3) and which separates the second metallic contact layer (3) from the transparent electrically conductive contact layer (1). Furthermore, a semiconductor component (100) comprising a contact structure (10) is specified.