Abstract: Methods for manufacturing and using an optical or optoelectronic device are disclosed. The optical or optoelectronic device and related methods may be useful as an optical or optoelectronic transceiver or for the processing of optical signals. The optical or optoelectronic device generally comprises a light-transmitting medium configured to transmit a first light beam; a light-receiving unit configured to receive and process a focused, reflected light beam; a first mirror or beam splitter configured to reflect at least a first portion of the transmitted light beam away from the light-receiving unit; a lens configured to focus the reflected light beam; and a second mirror configured to reflect the focused, reflected light beam towards the light-receiving unit.

Abstract: Methods, circuits, architectures, apparatuses, and algorithms for determining a DC level in an AC or AC-coupled signal. The method generally includes disabling the AC or AC-coupled signal; sampling the disabled AC or AC-coupled signal to obtain sampled DC values of the AC or AC-coupled signal; and calculating the DC level using the sampled DC values of the AC or AC-coupled signal. The present transmitter generally includes an electro-absorption modulated laser (EML); a photodetector; a signal source configured to provide an AC or AC-coupled signal to the EML; and a microcontroller or microprocessor configured to (i) control the signal source, (ii) receive information from the photodetector, and (iii) deactivate the signal source for a predetermined length of time. The circuits, architectures, and apparatuses generally include those that embody one or more of the inventive concepts disclosed herein.

Abstract: A bi-directional fiber optic transceiver includes a laser diode, a photodiode, first and second lenses, all of which share a common linear optical axis, and a housing. The first lens may have transmission increasing film thereon. The second lens may have a reflection increasing film thereon. An optical splitter may be between the first and second lenses. The first and/or second lenses may be spherical, hemispherical or aspheric. The transceiver size is reduced so that a circuit board can accommodate more components or be smaller in size. Utilizing hemispherical lenses can greatly increase the coupling ratio of the optical links between the photodiode, fiber and laser diode. Utilizing aspheric lenses with high coupling can serve high power output requirements. Use of spherical lenses (which extend the focal length) with aspheric lenses enables LD TO assemblies in individual housings to serve in various products.

Abstract: The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly.

Abstract: An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB.

Abstract: A method and apparatus for active voltage regulation in optical modules utilize a voltage regulator to change the supply voltage provided to laser diode driver and receiver electronics to optimize module performance over temperature. The ambient temperature of the module is monitored. The outputs of the voltage regulator are controlled to provide voltages that are optimized with respect to temperature for the integrated circuits in the optical module. This control is implemented via a temperature sensitive feedback or a control input from a microcontroller with a temperature monitor input. The supply voltage is optimized to minimize the voltage required to achieve acceptable performance at a given temperature. Minimizing the supply voltage lengthens the lifetime of the integrated circuit and the optical module. The voltage regulator provides higher than standard supply voltages to a laser diode driver to compensate for higher laser voltage at low temperatures.

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

Abstract: A histamine concentration level of a fish item is determined by illuminating the fish and analyzing the resulting spectral image data. Specifically, an algorithm is applied to the fish image data so that a histamine concentration value is calculated for every pixel of the fish image. A corresponding histamine concentration image of the fish is produced based on the collective histamine concentration values. The fish is accepted or rejected based on the collective histamine concentration values and/or the histamine concentration image. The histamine concentration image may be used to identify specific parts of a fish fillet that exceed (or do not exceed) a predetermined histamine concentration level.

Abstract: A light-emitting device includes a light-emitting component. The light-emitting component includes a circuit board, a light-emitting diode which is mounted on and electrically connected to the circuit board, a wavelength-converting shell which covers the light-emitting diode, and a heat conductive layer which is formed on the wavelength-converting shell and which includes graphene.

Abstract: Optical bench structure provides a platform for integrating optical transmitters, particularly Vertical-Cavity Surface-Emitting Lasers (VCSELs), with monitor photodetectors. A substrate with photodetectors on the front side is aligned with flip-chip bonding bumps so the emission of the transmitters is aligned with the monitor photodetectors and passes through the monitor photodetectors with a portion of the transmitted light absorbed by the monitor photodetectors. The photodetectors have a thin absorption region so the percentage of light absorbed may be relatively small, providing sufficient photocurrent to monitor the transmitted power having a minimal effect on the transmitted power. Microlenses are integrated on the backside of the substrate focus, steer and/or collimate the emitted optical beams from the transmitters. The structure enables photodetectors to be integrated on the optical bench allowing the received optical power to be monitored.

Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract: Methods and apparatuses for reducing the sensitivity of an optical signal to polarization. The method generally includes (i) reflecting the optical signal from a first mirror at a first angle relative to the optical signal to a second mirror at a second angle, and (ii) further reflecting the reflected optical signal from the second mirror to a receiver. The apparatus generally comprises (i) a first mirror at a first angle relative to an incident optical signal and configured to reflect the incident optical signal, (ii) a second mirror at a second angle configured to further reflect the reflected optical signal to a first receiver, and (iii) a lens configured to focus and/or collimate the optical signal or the reflected optical signal. The first angle is configured to reduce polarization of the reflected optical signal, thereby maximizing the intensity or power of the optical signal.

Abstract: Apparatus enabling modular implementation of active optical cable (AOC) with multiple integrated functions including: integration of different types of data on the AOC via media conversion; distribution of electrical power over the AOC; electrical multiplexing data channels for optical fibers; integration of voltage regulators enabling AOC operation at different supply voltages; integration of voltage regulators to provide stable, low noise power source; ruggedized, blind-mateable electrical connectors; integration of electronics and optoelectronics inside a connector backshell; implementation of health monitoring and test channel enabling monitoring, test, and control of both ends of the AOC and monitoring and control of upstream systems and components; and enabling a form, fit, function replacement of existing electrical cables to improve SWaP, electromagnetic interference resiliency, length-bandwidth product, electromagnetic pulse resistance, signal integrity, system reliability, testability and maintenanc

Abstract: A system and method for powering an ultraviolet (UV) water purification system utilizing a dynamo. A dynamo, operably attached to the UV water purification system, generates power from a rotatable crank which is actuated by a user around an axis of the rotatable crank. When the crank is rotated, the dynamo produces an electrical current that activates and powers the UV lamp, which in turn, produces UV light to purify the water. To ensure that the water has been purified appropriately, a microcontroller, employed within the UV water purification system, tracks both the “on” time and the intensity of the UV lamp as the dynamo is cranked. Once the lamp has been “on” at a sufficient intensity and for an appropriate period of time to administer a required dose of UV light, the microcontroller disables the lamp and provides the user with notification that the process has completed.

Abstract: A method of forming light emitting diode dies includes: forming an epitaxial layered structure that defines light emitting units on a front surface of a substrate wafer; forming a photoresist layer over a back surface of the substrate wafer; aligning the substrate wafer and patterning the photoresist layer so as to form openings in the photoresist layer, each of the openings having an area less than a projected area of the respective light emitting unit; forming a solder layer on the photoresist layer such that the solder layer fills the openings in the photoresist layer; removing the photoresist layer and a portion of the solder layer that covers the photoresist layer from the substrate wafer; and dicing the substrate wafer.

Abstract: Novel structures of photovoltaic cells (also called as solar cells) are provided. The cells are based on nanoparticles or nanometer-scaled wires, tubes, and/or rods, which are made of electrical materials covering semiconductors, insulators, and also metallic in structure. These photovoltaic cells have large power generation capability per unit physical area over the conventional cells. These cells will have enormous applications such as in space, commercial, residential and industrial applications.

Abstract: The invention concerns an optical system. The optical system comprises an input for receiving an optical signal, a predetermined output plane, and a diffraction grating for separating the optical signal received at the input into spectral elements thereof. The grating has a diffraction surface, which is formed by a photolithography process. The diffraction surface has a first predetermined profile. The first profile is formed by a plurality of points each conducted by different equations. Consequently, each spectral component is focused on the predetermined output plane.

Abstract: A nitride semiconductor structure and a semiconductor light emitting device are revealed. The semiconductor light emitting device includes a substrate disposed with a first type doped semiconductor layer and a second type doped semiconductor layer. A light emitting layer is disposed between the first type doped semiconductor layer and the second type doped semiconductor layer. The second type doped semiconductor layer is doped with a second type dopant at a concentration larger than 5×1019 cm?3 while a thickness of the second type doped semiconductor layer is smaller than 30 nm. Thereby the semiconductor light emitting device provides a better light emitting efficiency.

Abstract: An analog signal processing device for equalizing a low pass filter to create a Nyquist filter in accordance with the present invention includes a low pass filter for passing a predetermined bandwidth, and a tapped delay filter connected with the low pass filter to create the Nyquist filter. In more detail, the tapped delay filter is used to sample an input analog signal having a predetermined symbol rate. The samples from the input signal are then respectively weighted to establish a system transfer function for the Nyquist filter. The purpose here is to minimize both inter-symbol interference and transmission bandwidth. A decision circuit can be provided to convert the input signal into a desired data format for creation of an output signal to be transmitted by the data transmission system. Also, the Nyquist filter can be selectively evaluated as an “eye diagram” and the system transfer function appropriately adjusted accordingly.

Abstract: An optical mechanism for a miniaturized spectrometer comprises an input unit, an upper waveguide plate, a lower waveguide plate, and a miniature diffraction grating. The input unit is used to receive an optical signal and direct the optical signal to the interior of the optical mechanism. The upper waveguide plate has a first reflective surface. The lower waveguide plate having a second reflective surface aligned substantially parallel to the upper waveguide plate. The first reflective surface is located opposite to the second reflective surface. An optical channel is formed between the first reflective surface and the second reflective surface, so that optical signal from the input unit can travel in the optical channel. The miniature diffraction grating separates the optical signal transmitted in the optical channel into a plurality of spectral components and directs the spectral components to an image capture module at an end of the miniaturized spectrometer.