Abstract: A method and system for providing a magnetic memory are described. The method and system include providing a plurality of magnetic storage cells. Each of the magnetic storage cells includes at least one magnetic element. The magnetic element(s) includes a pinned layer, a barrier layer that is a crystalline insulator and has a first crystalline orientation, and a free layer. The free layer includes a first ferromagnetic layer, a second ferromagnetic layer, and an intermediate layer between the first and second ferromagnetic layer. The barrier layer resides between the pinned and free layers. The first ferromagnetic layer resides between the barrier layer and the intermediate layer and is ferromagnetically coupled with the second ferromagnetic layer. The intermediate layer is configured such that the first ferromagnetic layer has the first crystalline orientation and the second ferromagnetic layer has a second crystalline orientation different from the first ferromagnetic layer.

Abstract: According to the present invention, an oxide film with the film quality almost equivalent to that of the thermal oxide can be formed by the low-temperature treatment. After removing an insulator on the active region of the substrate which constitutes a semiconductor wafer, an insulator made of, for example, silicon oxide is deposited on the main surface of the semiconductor wafer by the low pressure CVD method. This insulator is a film to form a gate insulator of MISFET in a later step. Subsequently, a plasma treatment is performed in an atmosphere containing oxygen (oxygen plasma treatment) to the insulator in the manner as schematically shown by the arrows. By so doing, the film quality of the insulator formed by the CVD method can be improved to the extent almost equivalent to that of the insulator formed of the thermal oxide.

Abstract: Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.

Abstract: An opening/closing of a plurality of valves are controlled so that a plurality of gases flow into a chamber in an operation of a semiconductor manufacturing apparatus, and the opening/closing of the plurality of valves are controlled so that a gas A flows into mass flowmeters in an inspection of a mass flow controller MFC 2?. Therefore, the inspection can be achieved while maintaining the connection of mass flow controller MFC 2? to the semiconductor manufacturing apparatus.

Abstract: The technology of preventing lowering of the element breakdown voltage of a trench gate control type semiconductor element is offered. n? type epitaxial layer (drift region) formed in the main surface side of the substrate, p type semiconductor layer (channel region) formed in n? type epitaxial layer, and p? type well (electric field relaxation layer) which was formed in n? type epitaxial layer in contact with the p type semiconductor layer and whose depth is deeper than the p type semiconductor layer are included. The trench whose depth is deeper than p? type well is patterned in the substrate, and the second gate electrode is formed in the inside of the trench via the insulation film. Among the trenches in the cell area in which power MISFET is formed, one end of p? type well is formed between a plurality of cell trenches in which a second gate electrode is formed, and the other end of p? type well is formed in the peripheral region contiguous to the cell area.

Abstract: In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

Abstract: A power MISFET, which has a desired gate breakdown voltage, can be manufactured will controlling an increase in parasitic capacitance. After depositing a polycrystalline silicon film on a substrate and embedding groove portions in the polycrystalline silicon film by patterning the polycrystalline silicon film in an active cell area, a gate electrode is formed within the groove portion, and the inside of the groove portion is embedded in a gate wiring area. Extending to the outside of the groove portion continuously out of the groove portion, there is a gate drawing electrode electrically connected to the gate electrode. Slits extending from the end portion of the gate drawing electrode are formed in the gate drawing electrode outside of the groove portion. Then, a silicon oxide film and a BPSG film are deposited on the substrate.

Abstract: A semiconductor device of the present invention includes a chip which has a pad; a bump electrode formed on the pad; and a wire whose stitch bonding is made on the bump electrode. The wire satisfies a condition: (modulus-of-elasticity/breaking strength per unit area)?400.

Abstract: A plurality of content-addressable-memory sub-arrays simultaneously performs a parallel comparison between data sequences arranged in a row direction of memory cells and a search data sequence input from outside, and outputs a result of the comparison for each data sequence. A first input pin receives an input of the search data sequence. A second input pin receives an input of a search data sequence arbitrarily designating a content-addressable-memory sub-array. Each of the content-addressable-memory sub-arrays includes an activation control unit that controls activation of the content-addressable-memory sub-arrays based on the search data sequence.

Abstract: Disclosed is a semiconductor device which makes it easy to design a wiring pattern for a wiring substrate on which the semiconductor device is to be mounted. In manufacturing plural semiconductor devices for providing different amounts of output current, arrangements and numbers of leads to which semiconductor chips for power transistors of the semiconductor devices are to be electrically connected are changed according to output current requirements for the semiconductor devices, whereas arrangements and numbers of leads to which semiconductor chips for control circuits of the semiconductor devices are to be electrically connected are fixed to be common to the semiconductor devices. In this way, the probability of malfunction of control circuits (PWM circuits) of the semiconductor devices can be reduced, so that a semiconductor device which makes it easy to design a wiring pattern for a wiring substrate on which the semiconductor device is to be mounted can be provided.

Abstract: Performing electrolysis plating to a wiring is made possible, aiming at the increasing of pin count of a semiconductor device. Package substrate 3 by which ring shape common wiring 3p for electric supply was formed in the inner area of bonding lead 3j in device region 3v of main surface 3a is used. Since a plurality of first plating lines 3r and fourth plating lines 3u for electric supply connected to common wiring 3p can be arranged by this, the feeder for electrolysis plating can be arranged to all the land parts on the back. Hereby, it becomes possible to perform electrolysis plating to the wiring of main surface 3a of package substrate 3, and the back surface. Even if the land part of plural lines is formed covering the perimeter of the back surface, electrolysis plating can be performed to the all land parts. As a result, electrolysis plating can be performed to a wiring, aiming at the increasing of pin count of a semiconductor device.

Abstract: An external clock round-trips a round-trip delay block configured by a selector and a short delay array, and is made capable of corresponding to a wide frequency by generating a long delay time required for synchronization at the time of a low frequency operation. Further, when a plurality of phase comparators are disposed, in both cases where comparing phases all at once and comparing phases one after another, it is possible to complete the phase synchronization within a short time by making a delay amount variable.

Abstract: This invention provides a semiconductor memory device with enhanced speed performance or enabling timing adjustment reflected in characteristic variation of memory cells, adapted to suppress an increase in the number of circuit elements. A write dummy bit section comprises a first dummy line and a second dummy line corresponding to complementary bit lines and a plurality of first dummy cells formed to be similar in shape to static memory cells, wherein a write current path is coupled between the first dummy line and the second dummy line. In the write dummy bit section, one voltage level is input to the first dummy line through driver MOSFETs in relation to write signal inputs to the static memory cells and a signal change in the second dummy line precharged at the other voltage level is sensed and output. A timing control circuit deselects a word line selected by an output signal from the write dummy bit section.

Abstract: A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

Abstract: Heating elements different in heat generating timing are laminated in a stacked state, and the heating element close to a wiring substrate is allowed to function as a heat diffusion plate for another heating element.

Abstract: When a first signal is switched from an L level to an H level and a second signal is switched from an H level to an L level, and a first constant current source cannot follow the switching immediately thereafter and has not yet been switched, a first node remains at an H level, so an output node remains at an L level. In such state, a second node having been connected to a third node of an H level before the switching becomes connected to the first node of an H level by the switching. At the same time, the output part of an inverter is switched from an H level to an L level, causing the second node to be switched from an H level to an L level as well via a capacitor. At this time, the potential of the first node is reduced to become equal to the second node, to make a transition to an L level.

Abstract: A manufacturing method of a semiconductor device employing a semiconductor inspection apparatus to accurately inspect semiconductor elements while still in the wafer state, the semiconductor inspection apparatus including: a probe sheet 31 having contact terminals 7 which contact electrodes 3 of a wafer 1 and contact bumps 20b electrically connected to respective contact terminals 7; and a probe sheet 34 which is backed by a metal film 30b and having contact electrodes 34a which contact the contact bumps 20b of the probe sheet 31 and peripheral electrodes 27b electrically connected to the respective contact electrodes 34a, the wafer 1 is interposed between the probe sheet 34 and the supporting member 33 via the probe sheet 31 by reducing pressure through vacuuming, and the contact terminals 7 which have a pyramidal or truncated shape are contacted to the electrodes 3 of the wafer 1 at a desired atmospheric pressure, thereby performing the inspection.

Abstract: The present invention provides a multi chip module which realizes high functions or high performances thereof. A multi chip module is constituted by stacking a first semiconductor chip on which a digital signal processing circuit is mounted, a second semiconductor chip which constitutes a dynamic random access memory, a third semiconductor chip which constitutes a non-volatile memory, and a mounting substrate thus forming the stacked structure. The first semiconductor chip is arranged on an uppermost layer with a spacer interposed on a back surface side thereof. The second semiconductor chip is arranged on the mounting substrate.

Abstract: In a process of forming MISFETs that have gate insulating films that are mutually different in thickness on the same substrate, the formation of an undesirable natural oxide film at the interface between the semiconductor substrate and the gate insulating film is suppressed. A gate insulating film of MISFETs constituting an internal circuit is comprised of a silicon oxynitride film. Another gate insulating film of MISFETs constituting an I/O circuit is comprised of a laminated silicon oxynitride film and a high dielectric film. A process of forming the two types of gate insulating films on the substrate is continuously carried out in a treatment apparatus of a multi-chamber system. Accordingly, the substrate will not be exposed to air. Therefore, it is possible to suppress the inclusion of undesirable foreign matter and the formation of a natural oxide film at the interface between the substrate and the gate insulating films.

Abstract: A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.