Abstract: A technique capable of maintaining the filter characteristics of a transmitting filter and a receiving filter by reducing the influences of heat from the power amplifier given to the transmitting filter and the receiving filter as small as possible in the case where the transmitting filter and the receiving filter are formed on the same semiconductor substrate together with the power amplifier in a mobile communication equipment typified by a mobile phone is provided. A high heat conductivity film HCF is provided on a passivation film PAS over the entire area of a semiconductor substrate 1S including an area AR1 on which an LDMOSFET is formed and an area AR2 on which a thin-film piezoelectric bulk wave resonator BAW is formed. The heat mainly generated in the LDMOSFET is efficiently dissipated in all directions by the high heat conductivity film HCF formed on the surface of the semiconductor substrate 1S.

Abstract: An N type well (NW) is formed over a prescribed depth from a main surface of a semiconductor substrate (SUB), and a P type well (PW) and an N type drain region (ND) are formed in the N type well (NW). An N type source region (NS), an N+ type source region (NNS), and a P+ type impurity region (BCR) are formed in the P type well (PW). The N type source region (NS) is formed on a region situated directly below the N+ type source region (NNS), and not on a region situated directly below the type impurity region (BCR), and the P+ type impurity region (BCR) is in direct contact with the P type well (PW).

Abstract: A method, apparatus and computer program product are provided to facilitate synchronization of one or more stations with an access point when the stations have awakened from a sleep period. In the context of a method, a channel switch announcement is caused to be provided on a first channel that indicates that an access point is to switch to a second channel. The method also provides for the access point to switch to the second channel and, following switching of the access point to the second channel, the method causes a post-announcement to be provided on the first channel indicating that the access point previously switched to the second channel.

Abstract: A voltage generating circuit, in which the influence of offset of an amplifier on an output voltage is reduced, has first and second bipolar transistors (Q1, Q2) having emitter terminals at the same electric potential. A base terminal of Q1 is disposed on a collector side of Q2. A first resistance element connects the collector side of Q2 with the base side of Q2; and a second resistance element (R1) connects a collector side of Q1 to R2. A third resistance element (R3) connects a base terminal of Q2 with the electric potential of the emitter terminals. An amplifier (A1) outputs a voltage based on a voltage difference between the collector sides of Q1 and Q2; and a voltage-current converting section (MP1, MP2) converts amplifier output into a current supplied to the connection node of R1 and R2. A voltage is then output on the basis of the generated current.

Abstract: A method for providing uplink feedback optimization may include determining a set of candidate uplink subframes and corresponding component carriers to transmit uplink feedback, and determining a selected uplink subframe and corresponding component carrier from among the set of candidate uplink subframes based on a feedback delay associated with the set of candidate uplink subframes. A corresponding apparatus and computer program product are also provided.

Abstract: A CAN communication system of the present invention includes: a transmission apparatus that transmits transmission data instead of the bit data protocol, the transmission data being data in which a stuff bit having an inverted value of the same logical value has been inserted next to the predetermined number of continuous bits having the same logical value in the bit data; a reception apparatus that synchronizes transmission and reception of the transmission data to and from the transmission apparatus according to detection of an edge from the second logical value to the first logical value in the transmission data transmitted from the transmission apparatus. The transmission apparatus has a transmission control unit that rewrites to the first logical value any of the predetermined number ?1 of bits continuing from the predetermined number of continuous bits having the first logical value in the bit data.

Abstract: A method, apparatus and computer program product provide improved detection of overlapping wireless networks. In this regard, the method, apparatus and computer program product may utilize a processor, such as a processor on a wireless access point, to determine one or more parameters for a scan of a wireless network to identify overlapping networks. Wireless stations may utilize the parameters to determine the content of a scan report generated from a scan of the wireless network. The wireless stations may further utilize the parameters to determine which values should be monitored and/or recorded during the scan of the network. The wireless stations may respond to the access point with results corresponding to the parameters requested by the access point, and the access point may use the results to determine channel access parameters for other devices on the network, such as the wireless stations.

Abstract: A PWM signal generation circuit according to the present invention includes a duty setting unit (10) configured to generate a duty control signal designating a duty ratio corresponding to each period of a PWM signal on the basis of an initial duty setting signal, a target duty setting signal, a slope setting signal, and a clock signal, a period setting unit (20) configured to output a period setting value, and an output control unit (30) configured to generate the PWM signal having a period corresponding to the period setting value and having a duty ratio corresponding to a value of the duty control signal. The duty setting unit (10) increases the value of the initial duty ratio to the value of the target duty ratio each time the number of a clock pulse of the clock signal reaches the period setting value reaches the slope setting value.

Abstract: A magnetic memory includes: a base layer; a magnetization free layer; a barrier layer; and a magnetization reference layer. The magnetization free layer, with which the base layer is covered, has invertible magnetization and is magnetized approximately uniformly. The barrier layer, with which the magnetization free layer is covered, is composed of material different from material of the base layer. The magnetization reference layer is arranged on the barrier layer and has a fixed magnetization. When the magnetization of the magnetization free layer is inverted, a first writing current is made to flow from one end to the other end of the magnetization free layer in an in-plane direction without through the magnetization reference layer.

Abstract: Methods, apparatus and computer program products are provided for rebalancing the sizes of downlink (DL) association sets for component carriers having different time division duplex subframe configurations. A method is provided that includes determining DL subframes that are included in a DL association set for each of a plurality of component carriers. In an instance in which the number of acknowledgement (ACK)/negative acknowledgement (NACK) bits corresponding to the DL subframes included in the DL association sets for respective component carriers differ by at least a predetermined amount, the method modifies the number of ACK/NACK bits corresponding to the DL subframes that are included in the DL association sets for each of the respective component carriers. The method may also cause transmission of the ACK/NACK bits in accordance with the DL association sets, as modified, via the respective component carriers. Corresponding apparatus and computer program products are also provided.

Abstract: A method is provided for configuration of a special subframe pattern configuration. The method may include determining a configuration of a primary special subframe pattern configuration. The first special subframe configuration may have a corresponding secondary special subframe pattern configuration for multiplexing with the primary special subframe pattern configuration. The method may further include, responsive to a downlink assignment following the configuration of the primary special subframe pattern configuration, using the secondary special subframe pattern configuration instead of the primary special subframe pattern configuration. A corresponding apparatus and computer program product are also provided.

Abstract: A wireless device has at least a first modem and a second modern and at least a first SIM and a second SIM. The first modem supports a different level of service than the second modem. A processing system of the wireless device selectively reconfigures the connection of the first modem and the second modem to the SIMs. In a first mapping configuration, the first SIM is connected to the first modem and the second SIM is connected to the second modem. In a second mapping configuration, the second SIM is disconnected from the second modem, and the first SIM is disconnected from the first modem and is connected to the second modem thereby to obtain a different level of service for the first SIM than in the first mapping configuration.

Abstract: A method, an apparatus and a computer-readable storage medium for accessing a wireless sensor network with a multimode user equipment. The method includes a user equipment receiving broadcasted wireless sensor network information; requesting access information for the wireless sensor network from a base station of a mobile data network; receiving the access information from the base station; and accessing the wireless sensor network using said access information.

Abstract: A semiconductor device includes a semiconductor substrate on which a semiconductor device is formed; first and second pads; a first insulating film which is formed above the semiconductor substrate; a plurality of wiring lines which are embedded in ditches provided in the first insulating film; a second insulating film provided to cover the first insulating film and the plurality of wiring lines; a semiconductor layer formed on the second insulating film; a source electrode connected with the semiconductor layer; and a drain electrode connected with the semiconductor layer. The plurality of wiring lines includes a gate electrode provided in a position which is opposite to the semiconductor layer. The semiconductor layer, the source electrode, the drain electrode and the gate electrode configure an ESD protection device to discharge a current by ESD surge from the first pad to the second pad.

Abstract: In an internal register, a value for controlling operation of a flash memory is stored. A power shutoff detection register holds a value which changes when power shutoff occurs, and data stored in a specific memory cell is written in the power shutoff detection register. An EX-OR circuit compares the data stored in the specific memory cell with the value of the power shutoff detection register to thereby detect power shutoff. When power shutoff is detected, the value of the internal register is re-set. Thus, when power shutoff occurs, the flash memory can be prevented from malfunctioning.

Abstract: A semiconductor device simplifies the manufacturing process. The device includes a protective chip which has a surface Zener diode to protect a light emitting chip with an LED formed therein from surge voltage. The protective chip is mounted over a wiring electrically coupled through a metal wire to an anode electrode coupled to a p-type semiconductor region whose conductivity type is the same as that of the semiconductor substrate of the chip. The anode electrode of the protective chip is electrically coupled to the back surface of the chip without PN junction, so even if the back surface is in contact with the wiring, no problem occurs with the electrical characteristics of the Zener diode. This eliminates the need to form an insulating film on the back surface of the chip to prevent contact between the back surface and the wiring, thus simplifying the manufacturing process.

Abstract: A method and apparatus which allows dynamic TDD UL/DL configuration that is able to adapt to an instantaneous traffic situation. The values of at least one uplink/downlink configuration indication bit in a predetermined region in a received downlink time division duplex subframe of wireless data transmission are examined. A time division duplex uplink/downlink configuration for a predetermined configuration period is determined based on the examined values.

Abstract: The semiconductor device includes a power transistor that is disposed between a first signal line, which is coupled to a first external terminal, and a second signal line, which is coupled to a second external terminal. A gate electrode of the power transistor is coupled to a third signal line. The semiconductor device further includes a clamp circuit that clamps a voltage between the first signal line and the third signal line, a first resistive element that is disposed between the third signal line and the second signal line, and a monitoring section that monitors a voltage between the third signal line and the second signal line. The clamp circuit is configured so that a clamp voltage can be changed. The monitoring section exercises control to decrease the clamp voltage when the voltage between the third signal line and the second signal line exceeds a predefined threshold value.

Abstract: A first control unit, which controls the timing when a first image pickup unit starts exposure, obtains a second difference by subtracting a first difference from an exposure-output time of the first image pickup unit, and outputs a first control signal for delaying the timing when the first image pickup unit starts exposure, by the second difference. The exposure-output time is a time lag between when the image pickup unit starts exposure and when output of an image signal obtained by the exposure is started. The first difference is a difference between a timing at which the first image pickup unit started outputting a predetermined image signal and a timing at which a second image pickup unit started an exposure for obtaining an image signal that the second image pickup unit outputted immediately after the first image pickup unit started outputting the predetermined image signal.

Abstract: While an adhesive layer is provided over the rear surface of a semiconductor chip in die bonding, a lamination processing (main pressure bonding) is necessary for securing the adhesive state of the adhesive layer after the die bonding process (temporary pressure bonding). Typically the adhesive is hardened by applying heat while pressing down the rear surface of the chip from above with a pressurization member. The lamination processing by such a mechanical pressurization method leads to problems as the chip becomes thinner. The problems include chip damage at a part in an overhang state, a chip position shift caused by bending and non-uniform pressurization, and the like. An aspect of the present technique is to perform the lamination processing by static gas pressure after laminating and temporarily pressure-bonding a plurality of semiconductor chips over a circuit substrate in the die bonding process.