Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

Abstract: A layout design method in accordance with an exemplary aspect of the present invention is a layout design method for a clock tree circuit, including disposing a first clock distribution circuit in a clock tree circuit, wiring the clock tree circuit in which the first clock distribution circuit is disposed, verifying timing of the wired clock tree circuit, and replacing the first distribution element by a second clock distribution circuit based on a result of the timing verification, the second clock distribution circuit having roughly a same input load capacitance as the first clock distribution circuit and a different delay value from the first clock distribution circuit.

Abstract: A semiconductor memory device comprises a comparing unit that comprises a potential of a memory cell with a reference potential supplied by a reference cell to read data of the memory cell; first and second bit lines connected to inputs of the comparing unit; a first memory cell connected to the first bit line; a second memory cell connected to the second bit line; a first reference cell acting as the reference cell; a second reference cell acting as another reference cell; a potential line that supplies the reference potential to the first and second reference cells; and a dummy cell comprising a coupling capacitor that stabilizes potential of the potential line.

Abstract: A semiconductor device is manufactured by forming a hole as being extended through a first insulating film and an insulating interlayer stacked over a semiconductor substrate, allowing side-etching of the inner wall of the hole to proceed specifically in a portion of the insulating interlayer, to thereby form a structure having the first insulating film projected out from the edge towards the center of the hole; forming a lower electrode film as being extended over the top surface, side face and back surface of the first insulating film, and over the inner wall and bottom surface of the hole; filling a protective film in the hole; removing the lower electrode film specifically in portions fallen on the top surface and side face of the first insulating film; removing the protective film; and forming a cylindrical capacitor in the hole.

Abstract: A semiconductor device includes a first MISFET and a second MISFET which are formed over a semiconductor substrate and have the same conductive type. The first MISFET has a first gate insulating film arranged over the semiconductor substrate, a first gate electrode arranged over the first gate insulating film, and a first source region and a first drain region. The second MISFET has a second gate insulating film arranged over the semiconductor substrate, a second gate electrode arranged over the second gate insulating film, and a second source region and a second drain region. The first and the second gate electrode are electrically coupled, the first and the second source region are electrically coupled, and the first and the second drain region are electrically coupled. Accordingly, the first and the second MISFET are coupled in parallel. In addition, threshold voltages are different between the first and the second MISFET.

Abstract: A nonvolatile semiconductor memory, includes a nonvolatile memory array, a voltage generator circuit that generates a drive voltage which changes depending on a supply voltage and a code, a control circuit that applies the generated drive voltage to the nonvolatile memory array, and a code output circuit that outputs any one of a plurality of codes to the voltage generator circuit, wherein the plurality of codes includes a first code and a second code, wherein the second code is different from the first code, wherein, in a first state, the code output circuit outputs the first code to the voltage generator circuit, and the voltage generator circuit generates the drive voltage according to the first code, and wherein, in a second state, the code output circuit outputs the second code to the voltage generator circuit, and the voltage generator circuit generates the drive voltage according to the second code.

Abstract: A semiconductor device includes a substrate, a first pad, a second pad, and a third pad that are placed along one side of a perimeter of the substrate, a circuit that is formed above the substrate, and that is coupled to the first pad, a first external terminal that is coupled to the second pad, and a second external terminal that is coupled to the third pad, wherein the circuit generates a signal indicative of a connection configuration between the first pad and the first external terminal, wherein the third pad is placed adjacent to one of the first pad and the second pad, wherein, in a direction parallel to the one side of the perimeter of the substrate, the first pad, the second pad and the third pad have a first width, a second width and a third width, respectively, and wherein each of the first width of the first pad and the second width of the second pad is smaller than the third width of the third pad.

Abstract: A high-frequency switch circuit according to the present invention includes at least a first switch connected between a common terminal and a first terminal, and a second switch connected between the common terminal and a second terminal. Each of the first and second switches includes a plurality of field-effect transistors connected in series and each having a body, a source, a drain, and a gate. A compensation capacitance that compensates a parasitic capacitance generated when the first switch is in an off-state is formed between the drain and the body or between the source and the body in the FET of the first switch. A compensation capacitance that compensates a parasitic capacitance generated when the second switch is in an off-state is formed between the drain and the body or between the source and the body in the FET of the second switch.

Abstract: When a metal cap film is provided on an electric fuse, the break-ability of the electric fuse is reduced. A semiconductor device 1 includes interconnects 10, an electric fuse 20 and metal cap films 30. Both of the interconnects 10 and the electric fuse 20 are composed of Cu. The interconnects 10 and the electric fuse 20 are provided in the same layer in the interconnect layer 40. The metal cap films 30 are provided only on the interconnects 10 and not provided on the electric fuse 20.

Abstract: The optical disc device has a circuit which forms a focus error signal for focus servo control based on reflection light from an optical disc exposed to laser light. Also, the device has a data processing unit which can control by feedback a position to which an objective lens is moved by a focusing actuator based on a focus error signal. In label printing, the data processing unit controls, by feedforward, a position to which the objective lens is moved by the focusing actuator based on control data for label printing. The operation resolution of the focusing actuator in feedforward control is made higher than that in feedback control. Thus, an intended position control accuracy is achieved in feedforward control. For instance, in feedforward control, the gain of the driver circuit for the focusing actuator is switched to a smaller one in comparison to that in feedback control.

Abstract: A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting at least one of the first metallic bond part and the second metallic bond part.

Abstract: Switching loss is reduced by decreasing the switching frequency of a PFC power supply in light load condition, whereas the switching frequency is maintained high in heavy load operation. Efficiency in light load operation is thus improved without enlarging a boosting inductor and an output smoothing capacitor. A capacitor is provided in a triangular wave generating circuit and the triangular wave generating circuit outputs a triangular wave by charging and discharging this capacitor. Charging and discharging of the capacitor are controlled by an oscillation frequency control circuit output current which is input to a comparator.

Abstract: An object of the invention is to provide a semiconductor device having improved performance, high reliability, and a reduced chip size, in particular, to provide a semiconductor device having an MOSFET over an SOI substrate capable of maintaining its reliability while controlling the potential of a well below a gate electrode and preventing generation of parasitic capacitance. Generation of parasitic capacitance is prevented by controlling the potential of a well below a gate electrode by using a well contact plug passing through a hole portion formed in a gate electrode wiring. Generation of defects in a gate insulating film is prevented by making use of a gettering effect produced by causing an element isolation region to extend along the gate electrode.

Abstract: To provide a clock generator capable of suppressing a peak power, the circuit includes a counter receiving a reference clock signal to generate a timing signal based on the reference clock signal; and a plurality of intermittent clock generating units each coupled to a storage unit thereof storing a bit strings data, each of the intermittent clock generating units receiving the reference clock signal and the timing signal. Each of the intermittent clock generating units masks a clock pulse of the reference clock signal based on the bit string data stored in the storage unit thereof to output an intermittent clock signal in response to the timing signal.

Abstract: A microcomputer includes: a plurality of register lists having a plurality of register patterns, respectively, wherein each of plurality of register patterns designates registers, data of which are to be saved in a data memory; an instruction fetch control circuit configured to fetch instruction code from an instruction memory in response to an interrupt request issued based on occurrence of an interrupt factor; and a register data saving control circuit configured to acquire one register pattern from one of the plurality of register lists in response to the interrupt request, and issue a microinstruction based on the acquired register pattern in response to the interrupt request. An instruction executing section is configured to execute the microinstruction prior to the fetched instruction code, to save the data of registers designated based on the acquired register pattern in the data memory.

Abstract: An electric fuse includes: a first interconnect and a second interconnect, formed on a semiconductor substrate; a fuse link, formed on the semiconductor substrate and provided so that an end thereof is coupled to the first interconnect, the fuse link being capable of electrically cutting the second interconnect from the first interconnect; and an electric current inflow terminal and an electric current drain terminal for cutting the fuse link, formed on the semiconductor substrate and provided in one end and another end of the first interconnect, respectively.

Abstract: An upper module board on which an integrated chip component with a low upper temperature limit is mounted and a lower module board on which a heat-generating semiconductor chip, a single chip component and an integrated chip component are mounted are electrically and mechanically connected via a plurality of conductive connecting members, and these are sealed together with mold resin. In such a circumstance, a shield layer made up of a stacked film of a Cu plating film and a Ni plating film is formed on side surfaces of the upper and lower module boards and surfaces (upper and side surfaces) of the mold resin, thereby realizing the electromagnetic wave shield structure.

Abstract: A reduction is achieved in the primary-side input impedance of a transformer (voltage transformer) as an output matching circuit without involving a reduction in Q-factor. An RF power amplifier includes transistors, and a transformer as the output matching circuit. The transformer has a primary coil and a secondary coil which are magnetically coupled to each other. To the input terminals of the transistors, respective input signals are supplied. The primary coil is coupled to each of the output terminals of the transistors. From the secondary coil, an output signal is generated. The primary coil includes a first coil and a second coil which are coupled in parallel between the respective output terminals of the transistors, and each magnetically coupled to the secondary coil. By the parallel coupling of the first and second coils of the primary coil, the input impedance of the primary coil is reduced.

Abstract: A semiconductor device having an electrical fuse which is cut in a reliable manner and a method for manufacturing it. The electrical fuse is a multilayer structure which includes a polysilicon film and a metal silicide film such as a tungsten silicide film. By applying an electric current with a density of 40 mA/?m3 or more to the electrical fuse with a prescribed length, the fuse is cut by electromigration and a pinch effect in a reliable manner.

Abstract: A semiconductor device has a gate electrode including polysilicon, and a hydrogen occluding layer covering at least a top face of the gate electrode and having a function of occluding hydrogen.