Abstract: A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed. The transparent board is then peeled from the semiconductor device through the use of the release material. A chip can thereby be mounted with high precision, there is no need to provide a positioning mark during mounting of the chip on the substrate in the manufacturing process, and the substrate can easily be removed. As a result, a semiconductor device having high density and a thin profile can be manufactured at low cost.

Abstract: A semiconductor device has an electrical fuse formed on a substrate, having a first interconnect, a second interconnect respectively formed in different layers, and a via provided in a layer between the first interconnect and the second interconnect, connected to one end of the second interconnect and connected also to the first interconnect; and a guard interconnect portion formed in the same layer with the second interconnect, so as to surround such one end of the second interconnect, wherein, in a plan view, the second interconnect is formed so as to extend from the other end towards such one end, and the guard interconnect portion is formed so as to surround such one end of the second interconnect in three directions, while placing such one end at the center thereof.

Abstract: An attenuator includes a first terminal, a second terminal, a first circuit coupled between the first and second terminals and including a field effect transistor including a gate terminal coupled to a resistor, a second circuit coupled between the first circuit and the second terminal and coupled to the first circuit via a node, and a third circuit coupled to the node.

Abstract: A method of manufacturing a semiconductor device includes: forming a cap insulating film, including Si and C, on a substrate; forming an organic silica film, having a composition ratio of the number of carbon atoms to the number of silicon atoms higher than that of the cap insulating film, on the cap insulating film; and forming two or more concave portions, having different opening diameters, in the organic silica film, by plasma processing in which mixed gas including inert gas, N-containing gas, fluorocarbon gas and oxidant gas is used.

Abstract: A semiconductor device includes a SOI (silicon on insulator) substrate having a first region and a second region, a multilayer wiring layer formed on the SOI substrate and having an insulating layer and a wiring layer alternately stacked in this order, a first inductor formed over the SOI substrate, and a second inductor formed over the SOI substrate and positioned above the first inductor.

Abstract: Provided is a technology, in a semiconductor device having a power MISFET and a Schottky barrier diode on one semiconductor substrate, capable of suppressing a drastic increase in the on-resistance of the power MISFET while making the avalanche breakdown voltage of the Schottky barrier diode greater than that of the power MISFET. In the present invention, two epitaxial layers, one having a high doping concentration and the other having a low doping concentration, are formed over a semiconductor substrate and the boundary between these two epitaxial layers is located in a region equal in depth to or shallower than the bottom portion of a trench.

Abstract: A semiconductor device is manufactured using a lead frame for a mold array package (MAP) where multiple mount parts are arranged in the shape of an array, each configured to have a semiconductor chip mounted thereon. Multiple leads for coupling to the semiconductor chip are formed in each of the mount parts of the lead frame. The tips of the leads are mutually coupled by tie bars thinner than the leads. A dummy lead having a slot coupling to the tie bar is formed on a portion corresponding to a portion further outside the tie bar and corresponding to a portion where the lead is formed in the mount parts at predetermined locations among the mount parts. Once the resin is supplied, air in a tie bar part is pushed out into the slot of the dummy lead; therefore, generation of void in the tie bar part can be controlled.

Abstract: A method, apparatus, and computer readable medium are provided. According to an embodiment of the invention, a method includes, translating source code written in a first language into source code written in an intermediary language. The method further includes converting the source code written in the intermediary language into source code written in a second language by applying contextual recognition and reconstruction to the source code written in the intermediary language to generate the source code written in the second language. The method further includes prompting a user to customize the conversion of the source code written in the intermediary language into the source code written in the second language.

Abstract: A method of cutting an electrical fuse including a first conductor and a second conductor, the first conductor including a first cutting target region, the second conductor branched from the first conductor and connected to the first conductor and including a second cutting target region, which are formed on a semiconductor substrate, the method includes flowing a current in the first conductor, causing material of the first conductor to flow outward near a coupling portion connecting the first conductor to the second conductor, and cutting the first cutting target region and the second cutting target region.

Abstract: A portion-to-be-melted of a fuse is surrounded by plates, so that heat to be generated in a meltdown portion of the fuse under current supply can be confined or accumulated in the vicinity of the meltdown portion of the fuse. This makes it possible to facilitate meltdown of the fuse. The meltdown portion of the fuse in a folded form, rather than in a single here a fuse composed of a straight-line form, is more successful in readily concentrating the heat generated in the fuse under current supply into the meltdown portion, and in further facilitating the meltdown of the fuse.

Abstract: The present invention provides a technique capable of suppressing variations in the height of each solder ball where an NSMD is used as a structure for each land. Vias that extend through a wiring board are provided. Lands are formed at the back surface of the wiring board so as to be coupled directly to the vias respectively. The lands are respectively formed so as to be internally included in openings defined in a solder resist. Half balls are mounted over the lands respectively. Namely, the present invention has a feature in that the configuration of coupling between each of the lands and its corresponding via both formed at the back surface of the wiring board is taken as a land on via structure and a configuration form of each land is taken as an NSMD.

Abstract: A semiconductor device of the present invention has a first-conductivity-type substrate having second-conductivity-type base regions exposed to a first surface thereof; trench gates provided to a first surface of the substrate; first-conductivity-type source regions formed shallower than the base regions; a plurality of second-conductivity-type column regions located between two adjacent trench gates in a plan view, while being spaced from each other in a second direction normal to the first direction; the center of each column region and the center of each base contact region fall on the center line between two trench gates; and has no column region formed below the trench gates.

Abstract: A semiconductor chip 100 includes a logic unit and an analog unit 153. Furthermore, the semiconductor chip 100 includes a silicon substrate 101; a first insulating film 123 to a sixth insulating film 143 formed on the silicon substrate 101; and an annular seal ring 105 consisting of a first conductive ring 125 to a sixth conductive ring 145 buried in the first insulating film 123 to the sixth insulating film 143, which surrounds the periphery of the logic unit and the analog unit 153. In the seal ring region 106, there is formed a pn junction acting as a nonconducting part 104, which blocks conduction in a path from the logic unit, through the seal ring 105 to the analog unit 153.

Abstract: A layout design method of a semiconductor integrated circuit includes providing a cell layout including a cell that includes a gate or a plurality of gates extending in a first direction, a plurality of diffusion layers, a first boundary of the cell in parallel with the gate or the plurality of gates, a second boundary of the cell being in an opposite side of the first boundary of the cell, a first distance, a second distance, A third distance, and a fourth distance, regenerating the cell layout to set the first distance and the second distance to a first value, or to set the third distance and the fourth distance to a second value, and generating a library data of the cell for a placement and routing tool, based on the cell layout.

Abstract: Provided are a self-diagnosis system and a test circuit determination method that are capable of determining normality of a test circuit which diagnoses a test target circuit. A self-diagnosis system according to an aspect of the present invention includes a test circuit including first and second diagnosis controllers which determine normality of a test target circuit by using an execution result of a test pattern in the test target circuit; and a test circuit determination unit which determines normality of the test circuit by comparing a normality determination result of the test target circuit output from the first diagnosis controller with a normal determination result of the test target circuit output from the second diagnosis controller.

Abstract: There is provided a bias circuit that can operate even at low voltage and control a current reflecting a change in drain voltage. A first current mirror circuit for feeding back a drain terminal current of an FET which receives an output of an operational amplifier at a gate terminal to an input terminal of the operational amplifier and a second current mirror circuit are coupled in parallel. A variable voltage is coupled to the first current mirror circuit, and a fixed voltage is coupled to the second current mirror circuit. Even if the variable voltage becomes lower than the threshold voltage of FETs configuring the first current mirror circuit, the second current mirror circuit feeds back the current to the input terminal of the operational amplifier with reliability.

Abstract: A semiconductor laser includes a semiconductor substrate and a resonator formed over the semiconductor substrate and containing a nitride semiconductor layer. A strain exerting on a region near the facet of the resonator is smaller than a strain exerting on the region between the regions near the facet.

Abstract: A semiconductor device 100 includes a first gate 210, which is formed using a gate last process. The first gate 210 includes a gate insulating film formed in a bottom surface in a first concave portion formed in the insulating film; a gate electrode formed over the gate insulating film in the first concave portion; and a protective insulating film 140 formed on the gate electrode in the first concave portion. In addition, the semiconductor device 100 includes a contact 134, which is coupled to the N-type impurity-diffused region 116a in the both sides of the first gate 210 and is buried in the second concave portion having a diameter that is large than the first concave portion.

Abstract: An interface apparatus is configured to output an operation signal to a target apparatus operated in accordance with a gesture command. In the interface apparatus, a reference object detection unit detects a reference object having a feature similar to a predetermined reference feature value from an image captured by an image capture unit and generates reference information identifying the reference object. Based on the reference information, an operating object identifying unit identifies as the operating object a feature object included in the image and satisfying a predetermined identification condition in terms of a relative relationship with the reference object and extracts operating object information identifying the operating object. An operation signal generation unit starts detecting the gesture command according to a change in position of the identified operating object and generates the operation signal corresponding to the gesture command.

Abstract: Multiple transmission inductors are formed over a substrate. A signal input channel is coupled to the multiple transmission inductors and a same transmission signal is inputted to the multiple transmission inductors. A phase difference control section is provided in the signal input channel and controls a phase difference of the signal between the transmission inductors by a unit smaller than 180°.