Patents Assigned to ROHM
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Patent number: 9070682Abstract: A semiconductor device includes a semiconductor element, a lead, and a wire including a first bonding portion bonded to the semiconductor element and a second bonding portion bonded to the lead. The semiconductor element includes a first bonding surface which faces to a first side in a first direction and to which the first bonding portion is bonded. The lead includes a second bonding surface and a third bonding surface both facing to the first side in the first direction and forming an angle larger than 180° on the first side in the first direction. The semiconductor device further includes a ball bump extending onto both the second bonding surface and the third bonding surface. The second bonding portion is bonded to the lead via the ball bump.Type: GrantFiled: June 4, 2013Date of Patent: June 30, 2015Assignee: ROHM CO., LTD.Inventor: Hiroyuki Kaneda
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Patent number: 9070548Abstract: The invention provides a composition comprising at least the following A and B: A) a polymer comprising, in polymerized from, at least one “monomer that comprises at least one hydroxyl group;” and B) an organometal compound comprising at least one metal selected from Ti, Zr, Hf, Co, Mn, Zn, or combinations thereof, and wherein the organometal compound is present in an amount greater than 5 weight percent, based on the sum weight of A and B.Type: GrantFiled: February 25, 2013Date of Patent: June 30, 2015Assignee: Rohm and Haas Electronic Materials LLCInventors: Deyan Wang, Jibin Sun, Peter Trefonas, Kathleen M. O'connell
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Patent number: 9070892Abstract: An organic electroluminescent device includes at least two light-emissive units provided between a cathode electrode and an anode electrode opposed to the cathode electrode, each of the light-emissive units including at least one light-emissive layer. The light-emissive units are partitioned from each other by at least one charge generation layer, the charge generation layer being an electrically insulating layer having a resistivity of not less than 1.0×102 ?cm.Type: GrantFiled: May 13, 2013Date of Patent: June 30, 2015Assignee: ROHM COMPANY, LTD.Inventor: Junji Kido
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Patent number: 9067909Abstract: A photoacid generator compound has formula (1) wherein n is zero or 1; and R1-R6 are each independently hydrogen, halogen, or unsubstituted or substituted C1-20 linear or branched alkyl, C1-20 cycloalkyl, C6-20 aryl, C3-20 heteroaryl, or an acid-generating group having the structure *L-Z?M+] wherein L is an unsubstituted or substituted C1-50 divalent group; Z? is a monovalent anionic group; and M+ is an iodonium or sulfonium cation. Geminal R groups can combine to form a ring with the carbon to which they are attached, as long as no more than two such rings are formed. At least one of R1-R6 includes the acid-generating group or two germinal R groups combine to form the acid-generating group. Also described are a photoresist composition incorporating the photoacid generator compound, a coated substrate including a layer of the photoresist composition, and a method of forming an electronic device using a layer of the photoresist composition.Type: GrantFiled: August 28, 2013Date of Patent: June 30, 2015Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLCInventors: Irvinder Kaur, Emad Aqad, Cong Liu, Cheng Bai Xu
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Patent number: 9067195Abstract: The present invention further is directed to the process for making a macroporous polymeric media with covalently bonded quaternary ammonium polymer chains. The media can be applied for chromatographic purification, resulting in porous substrates having improved protein binding capacity and resin selectivity, as well as methods relating to making and using the same.Type: GrantFiled: July 26, 2011Date of Patent: June 30, 2015Assignee: Rohm and Haas CompanyInventors: Martin J. Deetz, John J. Maikner
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Patent number: 9070659Abstract: [Object] A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution] A semiconductor device includes: a die pad 11 which has a die pad main surface 111 and a die pad rear surface 112; a semiconductor chip 41 mounted on the die pad main surface 111; a sealing resin portion 7 formed with a recess 75 for exposure of the die pad rear surface 11 and covering the die pad 11 and the semiconductor chip 41; and a heat releasing layer 6 disposed in the recess 75. The recess 75 has a recess groove 753 outside the die pad 11 in a direction in which the die pad rear surface 112 extends, and the recess groove 753 is closer to the die pad main surface 111 than to the die pad rear surface 112. The heat releasing layer 6 has a junction layer which is in contact with the die pad rear surface 112 and having part thereof filling the recess groove 753.Type: GrantFiled: October 16, 2012Date of Patent: June 30, 2015Assignee: ROHM CO., LTD.Inventors: Shoji Yasunaga, Mamoru Yamagami
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Patent number: 9068086Abstract: A composition comprising the following: A) a cure catalyst selected from Formula A: [NR1?R2?R3?R4?]+X???(Formula A), R1?, R2?, R3?, R4? are each independently selected from hydrogen, alkyl, substituted alkyl, aryl, or substituted aryl; X is a monovalent anion, and wherein at least one of R1?, R2?, R3? or R4? is a methyl; and B) a prepolymer formed from a first composition comprising: Ra comprises one or more multiple bonds, provided that, if Ra comprises more than one multiple bond, these multiple bonds are not in a conjugated configuration; R1, R2, R3 are described herein; Rb is selected from H or a saturated group comprising alkyl, alkylene, or alkylidene; R4, R5, R6 are described herein; Rc comprises more than one multiple bond, and these multiple bonds are in a conjugated configuration; R7, R8, R9 are described herein; and R10, R11, R12, R13 described herein.Type: GrantFiled: December 5, 2012Date of Patent: June 30, 2015Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLCInventors: Jessica P. Evans, Christopher P. Sullivan
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Patent number: 9070673Abstract: A semiconductor device suitable for preventing malfunction is provided. The semiconductor device includes a semiconductor chip 1, a first electrode pad 21 laminated on the semiconductor chip 1, an intermediate layer 4 having a rectangular shape defined by first edges 49a and second edges, and a plurality of bumps 5 arranged to sandwich the intermediate layer 4 by cooperating with the semiconductor chip 1. The first edges 49a extend in the direction x, whereas the second edges extend in the direction y. The plurality of bumps 5 include a first bump 51 electrically connected to the first electrode pad 21 and a second bump 52 electrically connected to the first electrode pad 21. The first bump 51 is arranged at one end in the direction x and one end in the direction y.Type: GrantFiled: July 8, 2011Date of Patent: June 30, 2015Assignee: ROHM CO., LTD.Inventor: Hiroshi Okumura
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Patent number: 9069296Abstract: A heater (A1) includes a substrate (1), a heating resistor (2) formed on the substrate (1) and a protective film (3) covering the heating resistor (2). The protective film (3) includes a crystallized glass layer (31) and an amorphous glass layer (33) covering the crystallized glass layer (31). The protective film (3) further includes a semi-crystalline glass layer (32) surrounding an edge (31a) of the crystallized glass layer (32). The semi-crystalline glass layer (32) intervenes between the substrate (1) and a portion of the amorphous glass layer (33) that projects relative to the crystallized glass layer (31).Type: GrantFiled: February 14, 2008Date of Patent: June 30, 2015Assignee: ROHM CO., LTD.Inventors: Yasuyuki Aritaki, Shinobu Obata, Teruhisa Sako
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Patent number: 9071032Abstract: A sub-mount having a photodiode region, includes a photodiode which has a first conductivity-type layer arranged in a surface portion of the sub-mount of the photodiode region to form a light-receiving surface and a second conductivity-type region arranged below the first conductivity-type layer and is configured to receive at the light-receiving surface a light emitted from a light-emitting element and convert the light into a photocurrent. A peak light-receiving wavelength at which the photocurrent of the photodiode becomes its maximum value is more than or equal to a minimum emission wavelength of the light-emitting element and less than or equal to a maximum emission wavelength of the light-emitting element.Type: GrantFiled: September 13, 2012Date of Patent: June 30, 2015Assignee: ROHM CO., LTD.Inventor: Yoshiteru Nagai
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Patent number: 9069145Abstract: An optical communication module according to the present invention includes an optical semiconductor element including an optical function region that performs light-receiving function or light-emitting function, a first resin member which covers the optical semiconductor element and is made of a resin that transmits light emitted from the optical function region or light to be received by the optical function region, and a second resin member which covers the first resin member. A portion of the first resin member is exposed from the second resin member. The optical communication module further includes an attachment hole for attaching an optical fiber. The attachment hole includes an opening that opens at the portion of the first resin member which is exposed from the second resin member.Type: GrantFiled: October 7, 2013Date of Patent: June 30, 2015Assignee: ROHM CO., LTD.Inventor: Akira Obika
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Publication number: 20150179554Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.Type: ApplicationFiled: March 4, 2015Publication date: June 25, 2015Applicant: ROHM CO., LTD.Inventors: Akihiro KOGA, Taro NISHIOKA
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Publication number: 20150179467Abstract: Some embodiments include methods of forming patterns. A first mask is formed over a material. The first mask has features extending therein and defines a first pattern. The first pattern has a first level of uniformity across a distribution of the features. A brush layer is formed across the first mask and within the features to narrow the features and create a second mask from the first mask. The second mask has a second level of uniformity across the narrowed features which is greater than the first level of uniformity. A pattern is transferred from the second mask into the material.Type: ApplicationFiled: December 23, 2013Publication date: June 25, 2015Applicants: Micron Technology, Inc., Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: William R. Brown, Adam Olson, Kaveri Jain, Ho Seop Eom, Xue Gloria Chen, Nik Mirin, Dan Millward, Peter Trefonas, III, Phillip Dene Hustad, Jong Keun Park, Christopher Nam Lee
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Patent number: 9063843Abstract: A data maintenance device includes: a first storage including volatile storage media; a second storage including nonvolatile storage media; an electronic circuit unit including at least one volatile register; and a selector configured to select one of the first and the second storage to be accessed by the electronic circuit unit. The selector selects the first storage in a state where data processing performed by the electronic circuit unit is ongoing, and the second storage in a state where the data processing is stopped for a shutdown of electric power of the data processing apparatus. The electronic circuit unit stores register data in the storage selected by the selector, the register data being stored in the register at the time when the data processing is stopped for the shutdown.Type: GrantFiled: June 8, 2012Date of Patent: June 23, 2015Assignee: Rohm Co., Ltd.Inventor: Takaaki Fuchikami
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Patent number: 9060511Abstract: A biocidal composition comprising 2,2-dibromomalonamide and a metal selected from silver, copper, and mixtures thereof, and its use for the control of microorganisms in aqueous and water-containing systems.Type: GrantFiled: August 3, 2011Date of Patent: June 23, 2015Assignees: Rohm and Haas Company, Dow Global Technologies LLCInventors: Freddie L. Singleton, Tirthankar Ghosh, Kimberly S. Cagle
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Patent number: 9066425Abstract: Method of manufacturing patterned conductor is provided, comprising: providing a conductivized substrate, wherein the conductivized substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate.Type: GrantFiled: April 1, 2013Date of Patent: June 23, 2015Assignee: Rohm and Haas Electronic Materials LLCInventors: Jake Joo, Jerome Claracq, Sylvie Vervoort, Mubasher Bashir, Peter Trefonas, Garo Khanarian, Kathleen O'Connell
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Patent number: 9064806Abstract: A chemical mechanical polishing pad is provided having a polishing layer; and a window incorporated into the polishing layer; wherein the polishing layer comprises a reaction product of ingredients, including: a polishing layer prepolymer and a polishing layer curative system; wherein the polishing layer curative system includes a polishing layer amine initiated polyol curative, a polishing layer high molecular weight polyol curative and a polishing layer difunctional curative; and, wherein the window comprises a reaction product of ingredients, including: a window prepolymer and a window curative system; wherein the window curative system includes a window difunctional curative, a window amine initiated polyol curative and a window high molecular weight polyol curative; and, wherein the polishing layer exhibits a density of ?0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr.Type: GrantFiled: March 28, 2014Date of Patent: June 23, 2015Assignees: Rohm and Haas Electronics Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Bainian Qian, Marty W. DeGroot, Michelle Jensen, James Murnane, Jeffrey J. Hendron, John G. Nowland, David B. James, Fengji Yeh
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Patent number: 9063425Abstract: Topcoat compositions are provided that can be used in immersion lithography to form photoresist patterns. The topcoat compositions include a polymer system that includes a matrix polymer and a surface active polymer. The matrix polymer is present in the composition in a larger proportion by weight than the surface active polymer, and the surface active polymer has a lower surface energy than a surface energy of the matrix polymer. A solvent system includes a first organic solvent chosen from gamma-butyrolactone and/or gamma-valerolactone, and a second organic solvent. The first organic solvent has a higher surface energy than a surface energy of the surface active polymer, and a higher boiling point than a boiling point of the second organic solvent.Type: GrantFiled: November 7, 2012Date of Patent: June 23, 2015Assignee: Rohm and Haas Electronic Materials LLC.Inventor: Deyan Wang
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Patent number: 9064593Abstract: A data holding device includes a loop structure unit configured to hold data using a plurality of logic gates connected in a loop shape, a nonvolatile storage unit including a plurality of ferroelectric elements, the nonvolatile storage unit configured to store the data held in the loop structure unit in a nonvolatile manner using hysteresis characteristics of the ferroelectric elements, and a circuit separation unit configured to electrically separate the loop structure unit and the nonvolatile storage unit. The ferroelectric elements of the nonvolatile storage unit are surrounded by a dummy element smaller in width than the ferroelectric elements.Type: GrantFiled: December 18, 2014Date of Patent: June 23, 2015Assignee: Rohm Co., Ltd.Inventors: Yoshikazu Fujimori, Hiromitsu Kimura, Toshiyuki Kanaya, Daisuke Notsu
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Patent number: 9064855Abstract: A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconductor chip, and hanging lead portions supporting the supporting portion. Each of the lead terminal portions adjacent to the hanging lead portion is a chamfered lead terminal portion having, at its head, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.Type: GrantFiled: December 18, 2013Date of Patent: June 23, 2015Assignee: ROHM CO., LTD.Inventor: Kazutaka Shibata