Patents Assigned to ROHM
  • Patent number: 9088444
    Abstract: A signal-transferring device having a first circuit and a second circuit that operate on different ground references, and a third circuit for transferring signals while providing insulation between the first circuit and the second circuit. The second circuit switches a logic level of an output signal in accordance with the logic level of an input signal notified by the first circuit, and notifies the first circuit about the logic level of the output signal. The first circuit notifies the second circuit about the logic level of the input signal not only when the logic level of the input signal has been switched, but also when the logic level of the output signal notified by the second circuit does not match the logic level of the input signal.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: July 21, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Akio Sasabe, Hirotaka Takihara, Makoto Ikenaga, Toshiyuki Ishikawa
  • Publication number: 20150200181
    Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.
    Type: Application
    Filed: March 20, 2015
    Publication date: July 16, 2015
    Applicant: ROHM CO., LTD.
    Inventors: Motoharu HAGA, Shingo YOSHIDA, Yasumasa KASUYA, Toichi NAGAHARA, Akihiro KIMURA, Kenji FUJII
  • Patent number: 9082945
    Abstract: A light emitting element unit according to the present invention includes a semiconductor light emitting element that has a surface, a back surface, and a side surface, where the surface or the back surface is a light extracting surface from which light generated inside is emitted, a submount which has a bottom wall and a side wall, has a recess portion defined by the bottom wall and the side wall, and supports the semiconductor light emitting element by the bottom wall in a position in which the light extracting surface is directed upward at the recess portion, and has an inclined surface on the side wall, inclined at a predetermined angle with respect to the bottom wall so as to face the side surface of the semiconductor light emitting element, and a light reflecting film formed on the inclined surface of the submount.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: July 14, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Takao Fujimori, Yasuo Nakanishi, Nobuaki Matsui, Hirotaka Obuchi
  • Patent number: 9082769
    Abstract: A semiconductor device includes a lower wiring layer made of a conductive material; an upper wiring layer formed in an upper layer than the lower wiring layer; and a fuse film, at least a portion of the fuse film being formed in a plug formation layer in which a plug for connecting the lower wiring layer and the upper wiring layer is formed, and made of a conductive material including a metallic material other than copper.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: July 14, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Satoshi Kageyama, Yuichi Nakao
  • Patent number: 9079180
    Abstract: There are provided a microchip provided with a liquid reagent retaining portion that retains the liquid reagent, and a usage thereof, wherein the liquid reagent is sealed into the liquid reagent retaining portion by a sealant inactive to the liquid reagent, exhibiting flowability at the time of using the microchip, and the microchip further has a separating portion to separate the liquid reagent and the sealant, connected to the liquid reagent retaining portion, and the separating portion is composed of a separation tank for separating the liquid reagent and the sealant, and an accommodation tank for accommodating a separated substance, connected to the separation tank by a first flow path.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: July 14, 2015
    Assignee: Rohm Co., Ltd.
    Inventor: Shun Momose
  • Patent number: 9082654
    Abstract: A semiconductor device of the present invention includes a semiconductor substrate, stripe-shaped trenches for separating the semiconductor substrate into a plurality of active regions, a buried film having a projecting portion that projects from the semiconductor substrate, buried into the trenches, a source region and drain region of a second conductivity type, which are a pair of regions formed in the active region, for providing a channel region of a first conductivity type for a region therebetween, and a floating gate consisting of a single layer striding across the source region and the drain region, projecting beyond the projecting portion in a manner not overlapping the projecting portion, in which an aspect ratio of the buried film is 2.3 to 3.67.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: July 14, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Kunihiko Iwamoto, Bungo Tanaka, Michihiko Mifuji
  • Patent number: 9079359
    Abstract: Provided are a microchip including a fluid circuit consisting of a space formed therein, a light-absorbing first substrate and a light-transmitting second substrate bonded onto the first substrate, and a groove, having a V-shaped section, extending parallelly to the fluid circuit on a surface of the second substrate opposite to the first substrate on a position immediately above at least part of the fluid circuit and a method of manufacturing the same.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 14, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Shun Momose, Hiroki Takeuchi
  • Patent number: 9080068
    Abstract: A method for depositing a Group 1b/gallium/(optional indium)/Group 6a material using a gallium formulated ink, comprising, as initial components: (a) a Group 1b/gallium/(optional indium)/Group 6a system which comprises a combination of, as initial components: a gallium component; a selenium component; an organic chalcogenide component; a Group 1b component comprising, as an initial component, at least one of CuCl2 and Cu2O; optionally, a bidentate thiol component; optionally, an indium component; and, (b) a liquid carrier component; depositing the gallium formulated ink on the substrate; heating the deposited gallium formulated ink to eliminate the gallium carrier, the first liquid carrier, the second liquid carrier and the, optional, third liquid carrier leaving a Group 1b/gallium/(optional indium)/Group 6a material on the substrate; and, optionally, annealing the Group 1b/gallium/(optional indium)/Group 6a material.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: July 14, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: David Mosley, David Thorsen
  • Patent number: 9079987
    Abstract: The instant invention provides crosslinkable compositions, and method of producing the same. The non-aqueous single phase crosslinkable composition comprises: (a) a polyol having an average of 2 or more hydroxyl functional groups; (b) polyaldehyde, or acetal or hemiacetal thereof; and (c) an acid catalyst having pK of less than 6; and (d) optionally one or more organic solvents.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: July 14, 2015
    Assignees: Dow Global Technologies LLC, Rohm and Haas Company
    Inventors: John N. Argyropoulos, Paul Foley, Eric Greyson, Jeff R. Anderson, Gary E. Spilman, Caroline Slone, Nahrain E. Kamber
  • Patent number: 9080758
    Abstract: An LED lamp (1) is employed in a state mounted on a lighting fixture. The LED lamp (1) includes an LED source portion (2) including a plurality of LED chips, an illuminance sensor module (12) detecting ambient illuminance, and a controller controlling the LED source portion (2) in response to illuminance of ambient light other than light emitted by the LED source portion (2) on the basis of an output signal received from the illuminance sensor module (12) when the LED source portion (2) is in a lighting-up state. When the LED source portion (2) is in the lighting-up state, there is a possibility that the illuminance sensor module (12) detects not only the ambient light illuminance but also spontaneous light illuminance. The controller eliminates influence by the spontaneous light illuminance, and controls the LED source portion (2) in response to the illuminance of the ambient light.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: July 14, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Masaru Igaki, Masahide Tanaka
  • Publication number: 20150194492
    Abstract: The semiconductor device according to the present invention includes: a semiconductor layer of a first conductivity type made of SiC having an Si surface; a gate trench dug down from the surface of the semiconductor layer; a gate insulating film formed on a bottom surface and a side surface of the gate trench so that the ratio of the thickness of a portion located on the bottom surface to the thickness of a portion located on the side surface is 0.3 to 1.0; and a gate electrode embedded in the gate trench through the gate insulating film.
    Type: Application
    Filed: September 23, 2014
    Publication date: July 9, 2015
    Applicant: ROHM CO., LTD.
    Inventors: Yuki NAKANO, Ryota NAKAMURA
  • Patent number: 9076885
    Abstract: Provided is a semiconductor device that can be manufactured at low cost and that can reduce a reverse leak current, and a manufacturing method thereof. A semiconductor device has: a source region and a drain region having a body region therebetween; a source trench that reaches the body region, penetrating the source region; a body contact region formed at the bottom of the source trench; a source electrode embedded in the source trench; and a gate electrode that faces the body region. The semiconductor device also has: an n-type region for a diode; a diode trench formed reaching the n-type region for a diode; a p+ region for a diode that forms a pn junction with the n-type region for a diode at the bottom of the diode trench; and a schottky electrode that forms a schottky junction with the n-type region for a diode at side walls of the diode trench.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: July 7, 2015
    Assignee: ROHM CO., LTD.
    Inventor: Kenichi Yoshimochi
  • Patent number: 9076938
    Abstract: A semiconductor light-emitting device includes a substrate, an LED chip mounted on the substrate, and a resin package covering the LED chip. The substrate includes a base and a wiring pattern formed on the base. The resin package includes a lens. The base includes an upper surface, a lower surface and a side surface extending between the upper surface and the lower surface. The LED chip is mounted on the upper surface of the base. The side surface of the base is oriented in a lateral direction. The wiring pattern includes a pair of first mount portions and a pair of second mount portions. The paired first mount portions are formed on the lower surface of the base. The paired second mount portions are oriented in the lateral direction and offset from the side surface of the base in the lateral direction.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: July 7, 2015
    Assignee: ROHM CO., LTD.
    Inventor: Kentaro Mineshita
  • Patent number: 9076719
    Abstract: Disclosed herein is a method for doping a substrate, comprising disposing a coating of a composition comprising a dopant-containing polymer and a non-polar solvent on a substrate; and annealing the substrate at a temperature of 750 to 1300° C. for 1 second to 24 hours to diffuse the dopant into the substrate; wherein the dopant-containing polymer is a polymer having a covalently bound dopant atom; wherein the dopant-containing polymer is free of nitrogen and silicon; and wherein the method is free of a step of forming an oxide capping layer over the coating prior to the annealing step.
    Type: Grant
    Filed: August 21, 2013
    Date of Patent: July 7, 2015
    Assignees: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, ROHM AND HAAS ELECTRONICS MATERIALS LLC
    Inventors: Rachel A. Segalman, Megan L. Hoarfrost, Ali Javey, Kuniharu Takei, Peter Trefonas, III
  • Patent number: 9077984
    Abstract: Technology for controlling image display according to the state of a viewer wearing eyeglasses to view 3D images is provided. When an inclined angle of eyeglasses is in a predetermined range, an image display device alternately displays a left-eye image and a right-eye image. When the inclined angle of the eyeglasses exceeds the predetermined range, the image display device does not switch the left-eye image with the right-eye image. For example, the image display device displays 2D images. Optical shutters of the eyeglasses are synchronized with the left-eye image and the right-eye image. When the image display device does not switch the left-eye image with the right-eye image, the optical shutters are both open.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: July 7, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Takeshi Yoshida, Yoichi Hasegawa, Takashi Naiki
  • Patent number: 9076657
    Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.
    Type: Grant
    Filed: June 22, 2013
    Date of Patent: July 7, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, Jason A. Reese, George R. Allardyce
  • Patent number: 9074067
    Abstract: A process is provided for making a calcium carbonate slurry comprising the steps of (a) forming a mixture comprising water, an acidic dispersant system, and calcium carbonate, (b) grinding said mixture to form a preliminary slurry of particles of said calcium carbonate, wherein 50% or more by weight of said calcium carbonate in said preliminary slurry, based on the total weight of said calcium carbonate in said preliminary slurry, is in the form of particles having diameter of 2 micrometers or less, and wherein the pH of said preliminary slurry is 9.0 or below, and (c) after step (b), adding one or more organic neutralizing agent to bring the pH of said preliminary slurry to 9.4 or above.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: July 7, 2015
    Assignee: Rohm and Haas Company
    Inventor: Alain Dufour
  • Patent number: 9073172
    Abstract: The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The polishing pad includes a polymeric matrix, the polymeric matrix having a polishing surface. In addition, polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. The polymeric microelements have an outer surface and being fluid-filled for creating texture at the polishing surface. And alkaline-earth metal oxide-containing regions are distributed within each of the polymeric microelements and spaced to coat less than 50 percent of the outer surface of the polymeric microelements.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: July 7, 2015
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: David B. James, Donna M. Alden, Andrew R. Wank
  • Publication number: 20150187906
    Abstract: A semiconductor device includes a first-conductivity-type semiconductor layer including an active region in which a transistor having impurity regions is formed and a marginal region surrounding the active region, a second-conductivity-type channel layer formed between the active region and the marginal region and forming a front surface of the semiconductor layer, at least one gate trench formed in the active region to extend from the front surface of the semiconductor layer through the channel layer, a gate insulation film formed on an inner surface of the gate trench, a gate electrode formed inside the gate insulation film in the gate trench, and at least one isolation trench arranged between the active region and the marginal region to surround the active region and extending from the front surface of the semiconductor layer through the channel layer, the isolation trench having a depth equal to that of the gate trench.
    Type: Application
    Filed: March 17, 2015
    Publication date: July 2, 2015
    Applicant: ROHM CO., LTD.
    Inventor: Kenichi YOSHIMOCHI
  • Publication number: 20150183944
    Abstract: A multi-stage polymer composition comprising a crosslinked core having a Tg of from ?85 to ?10° C.; an intermediate region which comprises one or more intermediate layers, wherein each of the intermediate layers comprises from 88.5 to 99.9 weight percent of units derived from a one or more monomers selected from the group consisting of alkyl(meth)acrylate monomers, from 0 to 5 weight percent of units derived from a cross-linking monomer, a graft-linking monomer, or a combination of two or more thereof, optionally from 0 to 2 weight percent units derived from one or more chain transfer agents; wherein there is a compositional gradient between the intermediate layers such that the Tg transitions from ?30° C. to 70° C. over the width of the intermediate region, and an outermost layer which has a Tg of from 40° C. to 110° C. is provided.
    Type: Application
    Filed: August 5, 2013
    Publication date: July 2, 2015
    Applicant: Rohm and Haas Company
    Inventors: Hailan Guo, Steven J. Broadwater, Veera D. Nelliappan