Abstract: The semiconductor device of the present invention includes an insulating layer, a copper wiring for wire connection formed on the insulating layer, a shock absorbing layer formed on an upper surface of the copper wiring, the shock absorbing layer being made of a metallic material with a hardness higher than copper, a bonding layer formed on the shock absorbing layer, the bonding layer having a connection surface for a wire, and a side protecting layer covering a side surface of the copper wiring, wherein the side protecting layer has a thickness thinner than a distance from the upper surface of the copper wiring to the connection surface of the bonding layer.

Abstract: A motor drive device has a motor driver adapted to receive a first power supply voltage to drive a motor; an internal regulator adapted to generate from an input voltage an internal power supply voltage; and a power supply switcher adapted to receive both the first power supply voltage and a second power supply voltage lower than the first power supply voltage to output, as the input voltage, the second power supply voltage when the second power supply voltage is normal and to output, as the input voltage, the first power supply voltage when the second power supply voltage is abnormal.

Abstract: A motor drive device has a spindle motor driver adapted to drive a spindle motor. the spindle motor driver includes lower side NMOSFETs, one for each phase, which connect and disconnect terminals, one for each phase, of the spindle motor to and from a ground terminal; a controller adapted to generate a switch control signal and a brake control signal; lower side pre-drivers, one for each phase, connected between an application terminal of an internal power supply voltage and the ground terminal and adapted to generate lower side gate signals, one for each phase, in accordance with the switch control signal to output the lower side gate signals to the lower side NMOSFETs, one for each phase; and a brake unit adapted to pull up to the internal power supply voltage all the lower side gate signals, one for each phase, in accordance with the brake control signal.

Abstract: The present invention provides novel polymerizable monomers having chelating functionality and processes to make them. In particular, the novel monomers are ethylenically unsaturated aminocarboxylates and are prepared by reacting ethylenediamine triacetic acid or its salt with an ethylenically unsaturated monomer. The ethyleneically unsaturated monomer may be a polymerizable vinyl monomer selected from (o-, p-, m-)DVBMO, allyl glycidyl ether, and glycidyl (meth)acrylate.

Abstract: A suction-holding apparatus includes a suction plate made of an air-permeable material, a holding member formed with a through-hole in which the suction plate is placed, and a base to which the holding member is attached. The suction plate includes a jutting-out portion so that the outer edge of the rear face is disposed outwardly from the outer edge of the front face. The through-hole includes a first edge and a second edge spaced apart from each other in the thickness direction. The first edge is adjacent to the base. The holding member includes an eaved portion so that the second edge of the through-hole is disposed inwardly from the outer edge of the rear face.

Abstract: The present invention provides novel polymers having chelating functionality and comprising units derived from an ethylenically unsaturated aminocarboxylate monomer which comprises units derived from ethylenediamine triacetic acid or its salt and a polymerizable vinyl monomer. The polymerizable vinyl monomer may be selected from (0-, m-, p-)DVBMO, allyl glycidyl ether, and glycidyl (meth)acrylate. The polymer may also comprise units derived from one or more ethylenically unsaturated monomers.

Abstract: A switch state detection circuit according to the present invention comprises: a plurality of switch connection portions to each of which a switch is connected, a connection line to which any one of the switch connection portions is connected in a switchable manner, a detection portion that detects a state of the switch connected to the connection line based on a state of the connection line, and a connection control portion that switches successively each of the switch connection portions and connects it to the connection line, wherein the state of each switch is detected.

Abstract: A vehicle-mounted camera includes a camera module mounted on a vehicle such as an automobile, and further includes a mirror occupying at least a part of an imaging range of the camera module. The camera module may be arranged to face a forward vehicle traveling direction. The mirror may occupy a lower part of the vertical direction in the imaging range. The camera module and the mirror may both be disposed in the vehicle.

Abstract: An electronic device includes a power supply system and a load circuit connected to the power supply system. The load circuit mutually switches between the first mode and the second mode. In the first mode, the load circuit operates with electric power supplied from the power supply system. On the other hand, in the second mode, the load circuit is brought into the state where the electric power does not need to be supplied from the power supply system. In response to the fact that the mode of the load circuit is switched from the first mode to the second mode, a power supply control device causes an AC/DC converter to stop.

Abstract: The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.

Abstract: An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.

Abstract: Acid generator compounds are provided that comprise an oxo-1,3-dioxolane moiety and/or an oxo-1,3-dioxane moiety. The acid generators are particularly useful as a photoresist composition component.

Abstract: An electrical capacitor includes: a band-shaped coating foil for positive electrode having a non-coated part of which an edge of one longitudinal side is not coated with an active material; a band-shaped coating foil for negative electrode having a non-coated part of which an edge of one longitudinal side is not coated with an active material; and a band-shaped separators through which an electrolysis solution and ions can pass. The coating foil for positive electrode and the coating foil for negative electrode are flatly wound via the separators so that the non-coated part in the side of the coating foil for positive electrode and the non-coated part in the side of the coating foil for negative electrode are exposed in opposite sides to each other, and the electrode group of the non-coated parts exposed to both sides are bonded.

Abstract: A semiconductor device includes: a semiconductor element having an electrode facing a first direction; a first lead having a conductive distal end surface facing the electrode, and a rising portion which is connected to the distal end surface to extend away from the electrode; a conductive bonding material bonding the electrode of the semiconductor element to the distal end surface of the first lead; and a sealing resin covering the semiconductor element, at least a portion of the first lead, and the conductive bonding material

Abstract: A semiconductor device disclosed in the present specification comprises: a semiconductor chip, a package that incorporates the semiconductor chip, and a plurality of lower-surface pads disposed on a lower surface of the package, a plurality of upper-surface pads disposed on an upper surface of the package, wherein the plurality of upper-surface pads include a plurality of monitor pads each of which is connected to each of all the lower-surface pads.

Abstract: [Problem] To provide a semiconductor device both capable of greatly reducing the size of a through electrode and capable of reducing the size of a surface electrode and provide a method for manufacturing a semiconductor device capable of reliably bringing a through electrode into contact with a surface electrode regardless of the size of the surface electrode. [Solution] A plurality of insulating film rings (32) are selectively formed on a front surface (13) of an Si substrate (29), and surface pads (33) are formed opposite openings (42) of the insulating film rings (32). Next, by etching the Si substrate (29) from a back surface (14), through holes (56) that pass through the openings (42) of the insulating film rings (32) and reach the surface pads (33) are formed. Through electrodes (17) that connect electrically with the surface pads (33) are formed by forming a via insulating film (35) on the sides of the through holes (56) and then filling the through holes (56) with electrode material.

Abstract: A circuit control device for controlling power consumption of a plurality of circuit units includes a monitoring unit configured to monitor whether a detection temperature of each of the circuit units meets a predetermined overheat condition, and an overheat protection unit configured to execute an overheat protection operation when the overheat condition is met in any one of the circuit units, wherein the overheat protection operation is an operation to reduce power consumption of an overheat unit meeting the overheat condition, among the circuit units, and a neighbor unit disposed near the overheat unit.

Abstract: Cellulosic fibers treated with telomers of polyacrylic acid.

Abstract: An organic light-emitting device includes a base plate, an organic light-emitting body formed on the base plate, a heat-transferring filling material formed around the organic light-emitting body to cover the organic light-emitting body, the heat-transferring filling material having an electrically insulating property, and a sealing plate arranged on the heat-transferring filling material.

Abstract: A semiconductor device includes a semiconductor chip, a die pad including an obverse surface on which the semiconductor chip is bonded, a lead spaced apart from the die pad, a bonding wire electrically connecting the semiconductor chip and the lead to each other, and a resin package that seals the semiconductor chip and the bonding wire. The bonding wire includes a first bond portion press-bonded to the semiconductor chip by ball bonding, a second bond portion press bonded to the lead by stitch bonding, a landing portion extending from the second bond portion toward the die pad and formed in contact with an obverse surface of the lead, and a loop extending obliquely upward from the landing portion toward the semiconductor chip.